• Corrosion Science and Technology
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• v.2 no.4
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• pp.197-201
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• 2003

In this study, Ni-P layers were electroplated on the surface of stainless steel in order to investigate the effects of an additive and agitation on their mechanical properties and microstructure. The concentration of the additive in the plating solution increased, the pores formed in the layer decreased, while the residual stress developed in the layers during electroplating increased. Agitation of the solution during electroplating was observed to force to increase local pores in the layer, which lowers its tensile properties. Grain growth was suppressed due to very fine $Ni_3P$ precipitates formed at its grain boundaries during heat treatment at $343^{\circ}C$ for 1 hr in air.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2018.06a
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• pp.32.1-32.1
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• 2018

Novel soft magnetic materials can be achieved by altering material properties such as morphology, composition, crystallinity, and grain size of soft magnetic alloys. Especially, magnetic properties (i.e., saturation magnetization, coarcivity) of soft magnetics are significantly affected by grain boundaries which act as a control of magnetic domain wall movement. Thus, we herein develop a two-step electroless plating method to control morphology and grain size of FeCo films for excellent magnetic properties. Accordingly, the chemical composition to control the degree of polarization of FeCo alloys was altered by electroless deposition parameters; for example, electrolyte concentration and temperature. The grain size and crystallinity of FeCo alloys was dramatically affected by the reaction temperature because the grain growth mechanism dominantly occurs at $90^{\circ}C$ where as the neucleation only happens at $50^{\circ}C$. By simply controlling the temperature, the micron-sized FeCo grains embedded FeCo film was synthesized where the large grains allow high magnetization originated from larger magnetic domain with low corecivity and the nano-sized grains allow excellent soft magnetic properties due to the magnetic correlation length.

• Journal of the Korean institute of surface engineering
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• v.25 no.3
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• pp.133-143
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• 1992

Titanium nitride(TiN) films have been prepared by HCD plasma enhanced reactive ion plating. Density and temperature of the plasma generated by the HCD were investigated. It was shown that parameters such as the substrate bias voltage(0 350V) and N2 flow rate(10 180SCCM) influenced the growth, the growth, the microstructure and the color tone of the film mostly. In order to study the interface region, surface analysis by AES combined with sputter depth profiling was performed. Microhardness of the coated TiN films were measured by micro Vickers hardness tester. Also, the effect of coating parameters on composition, coating surface and fracture morphology, grain size and growth rate were examined.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2001.11a
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• pp.55-62
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• 2001

An electrolytic copper rod was drawn up to $90\%$ in area reduction and annealed under various conditions. The EBSD measurement of the drawn wire showed that in the center region the <111> + <100> fiber duplex texture was dominant, while in the middle and surface regions relatively defused textures developed with a little higher density in <11w>//wire axis. The inhomogeneous texture in the deformed wire gave rise to the inhomogeneous microstructure and texture after annealing. The annealing texture could be classified into the recrystallization texture developed during low temperatures and at the early stage at a high temperature and the growth texture developed after a prolonged annealing at the high temperature. The recrystallization temperature could be explained by the strain energy release maximization model and the growth texture was discussed based on the grain boundary mobility anisotropy.

• Proceedings of the KSME Conference
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• 2001.06a
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• pp.205-210
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• 2001

Fatigue crack growth tests were carried out using high manganese cast steel under constant amplitude loading. Average crystal grain sizes of the material are $200{\mu}m$ and $1000{\mu}m$. For this material, ${\Delta}K_{th}$ is about $8MPa{\sqrt{m}}$ which is quiet large as compared to the general structural steels and the crack growth rate is lower than the general structural steels especilly in the low ${\Delta}K$ regsion. The reason of this behavior is crack closure due to fracture surface roughness and fretting oxide. The relationship between da/dN and the ${\Delta}K_{eq}$ was represented by narrow band regardless of the stress ratio.

• Journal of Advanced Marine Engineering and Technology
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• v.40 no.8
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• pp.692-697
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• 2016

This study investigated the effect of surface roughness of zinc oxide (ZnO) layer on the growth of polycrystalline Si layer via an Al-induced layer exchange process. It was found that the growth rate, grain size, crystallization fraction, and preferential orientation of the polycrystalline Si layer were strongly influenced by the surface roughness of the underlying ZnO layer. As the roughness of the ZnO surface increased, a higher growth rate (~40 min) and preferential Si (100) orientation were obtained because of the spatial concentration fluctuations in the Al-Si alloy, induced by the surface roughness of the underlying ZnO layer.

• Korean Journal of Organic Agriculture
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• v.7 no.2
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• pp.189-195
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• 1999

Under the no-till direct-sown rice-vetch cropping systems, where whole chopped rice straw were returned to the paddy surface at combine harvest and whole-plant of Chinese Milk Vetch(Astragalus sinicus L.) was submerged after direct-sowing, three levels of nitrogen top-dressed(0, 2, 4 kg N/10a) without basal N and two levels of sowing rate were applied into the paddy field in expectation of the enhancement of nitrogen efficiency and protection of agricultural environment in reduced N-fertilizer level. A cultivar, Dongjin, was direct-sown on May 30, 1996. Characteristics of rice growth and physicochemical properties of rice plant were observed. Under the system, reduced total N(4 kg N/10a) resulted in high panicle numbers. N-top dressed toward at later growth stages enhanced the ratio of panicle-producing tillers and at spikelet numbers per panicle. As N-level increases, DM yields of leaf and stem at heading were increased. Maximum grain yield was obtained at 4kg N/10a and major attributed factors to grain yield in this case were the number of grains per unit area and the ratio of ripened grain.

• Korean Journal of Materials Research
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• v.4 no.3
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• pp.334-338
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• 1994

This report details the microscopic aspects of grain boundary cracking in Pb-Sn eutecticduring displacement-controlled mechanical tests performed over a range of low frequency ($10^{-3}-10^{-5}$/s)and moderate strain range (0.2 - 1 %) where is the most technologically relevant to solder jointssubjected to thermal cycling. It is shown that intergranular cracking begins with the appearance ofcrack-like features (CLF's), which can be seen due in part because they are associated with grainboundary sliding, and is able to be described by certain stages of isolated crack growth. In the initialstages CLF's are not ture cracks but instead what I shall call "proto-cracks" where grain boundarysliding begins to damage the gram boundary at the surface. At some point during the initiation stagesonce proto-cracks become ture cracks, they develop into isolated cracks and the growth of isolatedcracks is eventually accomplished by coalescence, resulting in 5 stages of cracking.ing in 5 stages of cracking.

• Korean Journal of Crystallography
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• v.3 no.1
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• pp.53-66
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• 1992

Extensive research has been perform성 on the property-microstructure-process condition relations of thin films. The various proposed models are mainly based on physical vapor deposition processes. Especially the study on the surface condition of substrates in Zone 1 with low surface mobility has not been sufficient. In this study, therefore, we discussed the mochological changes of TiN films deposited by plusma enhanced chemical vapor deposition process with substrates of different composition and micro-rorghness, and compared it with the Structure Zone Model. We could find out that the growth rate of films increased and micro-grain size decreased with the increase in micro-roughness, but it does not improve the mechanical properties because of many imperfections like voids, micro-cracks, stacking faults, etc. This means that, in these deposition conditions, the increase in shadowing diffect is more effective than the increase in nucleation sites on the growth of films due to the increase in substrate roughness.

• The Journal of the Korea institute of electronic communication sciences
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• v.8 no.4
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• pp.549-554
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• 2013

With the synthesis of graphene on Cu using CVD, it was tried to show the behavior of graphene growth depending on the size and orientation of Cu grain. It was found out that even under the same temperature and pressure the use of different gases influences on the diffusion rate of Cu. As compared to Ar gas, Cu grain growing bigger under $H_2$ and $CH_4$ was resulted in bigger graphene grain. Corrosion resistance was evaluated by potentiodynamic polarization test in room temperature and found out that the graphene on Cu was more stable in order of 10 than pure Cu due to the chemical stability of graphene. The future work of this research will focus on the synthesis of graphene having no defects including grain boundaries, and its engineering use.