• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 하계학술대회 논문집 Vol.9
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• pp.241-241
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• 2008

Macrofore formation in silicon and other semiconductors using electrochemical etching processes has been, in the last years, a subject of great attention of both theory and practice. Its first reason of concern is new areas of macropore silicone applications arising from microelectromechanical systems processing (MEMS), membrane techniques, solar cells, sensors, photonic crystals, and new technologies like a silicon-on-nothing (SON) technology. Its formation mechanism with a rich variety of controllable microstructures and their many potential applications have been studied extensively recently. Porous silicon is formed by anodic etching of crystalline silicon in hydrofluoric acid. During the etching process holes are required to enable the dissolution of the silicon anode. For p-type silicon, holes are the majority charge carriers, therefore porous silicon can be formed under the action of a positive bias on the silicon anode. For n-type silicon, holes to dissolve silicon is supplied by illuminating n-type silicon with above-band-gap light which allows sufficient generation of holes. To make a desired three-dimensional nano- or micro-structures, pre-structuring the masked surface in KOH solution to form a periodic array of etch pits before electrochemical etching. Due to enhanced electric field, the holes are efficiently collected at the pore tips for etching. The depletion of holes in the space charge region prevents silicon dissolution at the sidewalls, enabling anisotropic etching for the trenches. This is correct theoretical explanation for n-type Si etching. However, there are a few experimental repors in p-type silicon, while a number of theoretical models have been worked out to explain experimental dependence observed. To perform ordered macrofore formaion for p-type silicon, various kinds of mask patterns to make initial KOH etch pits were used. In order to understand the roles played by the kinds of etching solution in the formation of pillar arrays, we have undertaken a systematic study of the solvent effects in mixtures of HF, N-dimethylformamide (DMF), iso-propanol, and mixtures of HF with water on the macrofore structure formation on monocrystalline p-type silicon with a resistivity varying between 10 ~ 0.01 $\Omega$ cm. The etching solution including the iso-propanol produced a best three dimensional pillar structures. The experimental results are discussed on the base of Lehmann's comprehensive model based on SCR width.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 하계학술대회 논문집 Vol.8
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• pp.41-41
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• 2007

For use in spintronic materials, dilute magnetic semiconductors (DMS) are under consideration as spin injectors for spintronic devices[l]. $TiO_2$-based DMS doped by a cobalt, iron, and manganese et al. was recently reported to show ferromagnetic properties, even at temperatures above 300K and the magnetic ordering was explained in terms of carrier-induced ferromagnetism, as observed for a III-V based DMS. An anomalous Hall effect (AHE) and co-occurance of superparamagnetism in reduced Co-doped rutile $TiO_{2-\delta}$ films have also been reported[2]. Metal segregation in the reduced metal-doped rutile $TiO_2-\delta$ films still remains as problems to solve the intrinsic DMS properties. Superlattice films have been proposed to get dilute magnetic semiconductor (DMS) with intrinsicroom-temperature ferromagnetism. For a $TiO_2$-based DMS superlattice structure, each layer was alternately doped by two different transition metals (Fe and Mn) and deposited to a thickness of approximately $2.7\;{\AA}$ on r-$Al_2O_3$(1102) substrates by pulsed laser deposition. The r-$Al_2O_3$(1102) substrates with atomic steps and terrace surface were obtained by thermal annealing. Samples of $Ti_{0.94}Fe_{0.06}O_2$(TiFeO), $Ti_{0.94}Mn_{0.06}O_2$(TiMnO), and $Ti_{0.94}(Fe_{0.03}Mn_{0.03})O_2$ show a low remanent magnetization and coercive field, as well as superparamagnetic features at room temperature. On the other hand, superlattice films (TiFeO/TiMnO) show a high remanent magnetization and coercive field. An anomalous Hall effect in superlattice films exhibits hysisteresis loops with coercivities corresponding to those in the ferromagnetic Hysteresis loops. The superlattice films composed of alternating layers of $Ti_{0.94}Fe_{0.06}O_2$ and $Ti_{0.94}Mn_{0.06}O_2$ exhibit intrinsic ferromagnetic properties for dilute magnetic semiconductor applications.

• 한국전자통신학회논문지
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• 제14권3호
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• pp.497-504
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• 2019

본 연구에서는 고주파 마그네트론 스퍼터링 법을 이용하여 $HfO_2$ 박막을 제작하고, 질소 분위기에서 급속 열처리 온도에 따른 $HfO_2$ 박막의 구조적 및 광학적 특성을 조사하였다. XRD 측정을 통해 열처리 유무에 상관없이 $HfO_2$ 박막은 다결정 구조를 가짐을 확인할 수 있었고, 열처리 온도가 증가함에 따라 반가폭은 감소하는 추세를 나타내었다. 박막의 표면을 AFM 으로 조사한 결과, $600^{\circ}C$ 에서 열처리한 박막의 표면 거칠기가 3.454 nm 로 가장 작은 값을 나타내었다. 모든 $HfO_2$ 박막들은 가시광 영역에서 약 80% 정도의 투과도를 나타내었다. 또한 투과도와 반사도로부터 구한 굴절률과 셀마이어 분산 관계로부터, 파장에 따른 $HfO_2$ 의 굴절률을 예측할 수 있었다. $600^{\circ}C$ 에서 열처리 한 $HfO_2$ 박막이 2.0223 (${\lambda}=632nm$) 의 높은 굴절률과 0.963 의 높은 우수한 충진율을 나타내었다.

• 콘크리트학회논문집
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• 제19권5호
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• pp.639-646
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• 2007

본 연구에서는 환경에 유해한 휘발성 유기화합물 (VOC)을 사용하지 않은 나노합성 세라믹 도장재를 도포한 콘크리트의 내구성 증진 효과를 평가하기 위하여 건조상태 부착강도 실험, 습윤상태 부착강도 실험, SEM 촬영, MIP 분석, 탄산화 촉진 실험, 전기적 촉진법에 의한 염소이온 확산실험, 동결융해에 대한 저항성, 내알칼리 실험 및 내염수성 실험을 실시하여 기존의 표면처리제와 비교 평가하였다. 부착강도 측정 결과 나노합성 세라믹 도장재가 건조상태 및 습윤상태에서 가장 이상적인 결과를 나타내었는데 이는 가수분해와 중축합반응을 통하여 무기질계 세라믹 구조를 형성한 나노합성 세라믹이 콘크리트 내의 C-A-S (calcium silicate aluminate)나 C-S-H (calcium silicate hydrate)와 같은 수화물과의 수소결합을 통해 콘크리트 표면과 일체화되어 나타난 결과로 판단된다. 또한 SEM 및 MIP 분석의 결과를 통해 미세한 공극을 가진 표면 조직을 보여주었다. 그리고 탄산화 및 염소이온 확산 실험과 동결융해 저항성에서 기존의 유기도장재를 능가하는 결과를 보였으며 내알칼리성 및 내염수성 실험에서도 좋은 성능을 나타내었다. 이상의 결과를 통해 기존의 휘발성 유기화합물을 사용하는 유기도장재의 대안으로써 해안 구조물, 하수 처리장 등 콘크리트 구조물의 내구성 향상을 위한 나노합성 세라믹 도장재의 사용이 기대된다.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2018년도 춘계학술대회 논문집
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• pp.102-102
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• 2018

Electronic industry had required the finer size and the higher performance of the device. Therefore, 3-D die stacking technology such as TSV (through silicon via) and micro-bump had been used. Moreover, by the development of the 3-D die stacking technology, 3-D structure such as chip to chip (c2c) and chip to wafer (c2w) had become practicable. These technologies led to the appearance of HBM (high bandwidth memory). HBM was type of the memory, which is composed of several stacked layers of the memory chips. Each memory chips were connected by TSV and micro-bump. Thus, HBM had lower RC delay and higher performance of data processing than the conventional memory. Moreover, due to the development of the IT industry such as, AI (artificial intelligence), IOT (internet of things), and VR (virtual reality), the lower pitch size and the higher density were required to micro-electronics. Particularly, to obtain the fine pitch, some of the method such as copper pillar, nickel diffusion barrier, and tin-silver or tin-silver-copper based bump had been utillized. TCB (thermal compression bonding) and reflow process (thermal aging) were conventional method to bond between tin-silver or tin-silver-copper caps in the temperature range of 200 to 300 degrees. However, because of tin overflow which caused by higher operating temperature than melting point of Tin ($232^{\circ}C$), there would be the danger of bump bridge failure in fine-pitch bonding. Furthermore, regulating the phase of IMC (intermetallic compound) which was located between nickel diffusion barrier and bump, had a lot of problems. For example, an excess of kirkendall void which provides site of brittle fracture occurs at IMC layer after reflow process. The essential solution to reduce the difficulty of bump bonding process is copper to copper direct bonding below $300^{\circ}C$. In this study, in order to improve the problem of bump bonding process, copper to copper direct bonding was performed below $300^{\circ}C$. The driving force of bonding was the self-annealing properties of electrodeposited Cu with high defect density. The self-annealing property originated in high defect density and non-equilibrium grain boundaries at the triple junction. The electrodeposited Cu at high current density and low bath temperature was fabricated by electroplating on copper deposited silicon wafer. The copper-copper bonding experiments was conducted using thermal pressing machine. The condition of investigation such as thermal parameter and pressure parameter were varied to acquire proper bonded specimens. The bonded interface was characterized by SEM (scanning electron microscope) and OM (optical microscope). The density of grain boundary and defects were examined by TEM (transmission electron microscopy).

• 자원환경지질
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• 제42권5호
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• pp.479-486
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• 2009

자연환경에서 망간은 +2, +3, +4가의 다양한 산화수로 존재하며 환경적으로 중요한 여러 원소들과 활발한 산화/환원반응을 함으로써 원소의 지화학적 순환에 중요한 역할을 하고 있다. 특히 망간은 다양한 산화물로 존재하며 각각 특징적인 망간의 산화상태를 나타내고 있다. 망간산화물의 지화학적 특성, 즉 망간산화물의 용해도, 흡착력, 산화/환원 능력은 산화물을 구성하는 망간의 산화수에 의해 크게 좌우되는 것으로 알려져 있다. 따라서 망간의 산화수를 결정하는 인자를 밝히는 것이 산화/환원에 민감한 여러 오염원소의 지화학적 거동을 예측하는 데 매우 중요하다. X-선 광전자 분광법(X-ray photoelectron spectroscopy, XPS)은 고체상으로 존재하는 다양한 원소의 산화상태를 밝히는데 매우 유용한 도구이다. 본 연구에서 MnO, $Mn_2O_3$, $MnO_2$에 대한 망간의 산화수를 결정하기 위해 XPS $Mn2p_{3/2}$와 Mn3s 결합에너지 스펙트럼을 측정하여 기존에 보고 된 값들과 비교하였다. 망간산화물에 대한 $Mn2p_{3/2}$ 결합에너지는 MnO, 640.9 eV; $Mn_2O_3$, 641.5 eV; $MnO_2$, 641.8 eV로서, 망간의 산화수가 증가할수록 $Mn2p_{3/2}$ 의 결합에너지가 증가하는 것으로 나타났다. 시료준비 방법 중 하나인 Ar 에칭의 경우 시료 표면의 전자구조를 변화시킬 수 있는 가능성이 확인되었다.

• 한국산학기술학회논문지
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• 제22권5호
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• pp.310-316
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• 2021

기존의 인공위성은 다기능·높은 성능을 가진 대형위성을 국가 단위에서 운용하는 것이 일반적이었으나 최근의 전기·전자 및 광학 기술의 경량 소형화 발전에 따라 점차 소형위성이 주목받고 있다. 크기와 무게가 감소됨에 따라 적은 비용으로 개발 및 발사가 가능하여 위성 개발에 진입장벽이 낮아지고 있으나, 인공위성의 전력공급에 필수적인 태양전지 패널의 경우 태양광에 효율적으로 노출되기 위해 넓은 표면적이 필요하여 소형화 및 경량화가 제한적이다. 우주용 태양전지는 우주선과 태양열, 온도와 같은 다양한 우주환경을 고려하여 제작되어야하고, 부피를 최적화하기 위해 전개 매커니즘을 적용하며 경량화 및 고효율화를 위하여 태양전지 셀의 구조적 재료적인 연구개발이 필요하다. 현재 태양전지 패널로 개발되어 운용되고 있는 제품들은 고효율화를 위하여 주로 InGaP/GaAs/Ge 소재의 3중구조를 적용하고 있다. 최근에는 초고효율 다층구조 태양전지를 위하여 4중접합 이상의 구조가 연구되고 있으며, 나아가 소재적으로 경량화에 유리한 유연박막 태양전지, 유기 및 유무기 하이브리드 태양전지 등이 차세대 소형위성용 태양전지로 주목받고 있다.

• 한국자기학회지
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• 제20권5호
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• pp.173-177
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• 2010

이 연구에서는 각분해 광전자 분광법(angle-resolved photoemission spectroscopy: ARPES)을 시용하여 전하밀도파(chargedensity-wave: CDW)를 형성하는 물질인 $CeTe_2$의 전자구조를 연구하였다. $CeTe_2$의 ARPES 데이터에서는 분산적인 띠들이 분명하게 관찰되었다. $CeTe_2$의 일정에너지(constant energy: CE) 맵에서는 4중 대칭성(fourfold symmetry)이 관찰되었으며, 그 형태가 문헌에 있는 $CeTe_2$의 CE 맵과 유사하였다. 이러한 발견은 $CeTe_2$의 CDW 형성이 $2{\times}2$ 형태의 살창 변형에 의한 것임과 4f 전자들이 $CeTe_2$의 CDW 형성에 별다른 기여를 하지 않는다는 것을 나타낸다. 이 연구로부터 $CeTe_2$에서 페르미 준위 근처의 전자들은 주로 Te(1) 5p와 Ce 5d 전자들이며 Te(1) 5p 전자들에 의한 띠가 CDW 형성에 기여하고 Ce 5d 전자들에 의한 띠는 CDW 상태에서도 페르미 준위를 가로지르는 금속성을 나타낸다는 것을 알 수 있었다.

• 한국결정성장학회지
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• 제24권2호
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• pp.65-69
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• 2014

A1100, A5052, A6061, A6063, A7075 규격의 시판 알루미늄 합금 판재를 $Na_2SiO_3$와 $Na_2P_2O_7$ 전해질에서 pulse폭 $2000{\mu}sec$, + impulse 420 V, $400{\mu}sec$, -impulse $300{\mu}sec$의 bipolar pulse로 플라즈마 전해 산화 코팅(plasma electrolytic oxidation coating)한 산화피막의 결정상을 분석하였다. 표면에 형성된 산화물의 결정상은 ${\alpha}-alumina$, ${\gamma}-alumina$, ${\eta}-alumina$, $Al_{4.95}Si_{1.05}O_{9.52}$, 그리고 $(Al_{0.9}Cr_{0.1})_2O_3$가 관찰되었다. Bipolar pulse에 의해서 전해액의 성분인 Si가 산화피막에 포함되며, 포함된 Si는 결정상을 형성하기도 하지만 유리상을 형성시킨다. 이때 합금의 Mg 성분은 유리상의 양을 증가시킨다. Micro plasma에 의해서 용융된 표면은 유리상이 먼저 형성되고 이후 계속된 micro plasma의 열에 의하여 새로운 결정상으로 전이가 일어나는 과정을 거치며, 이에 따라 기존에 보고된 결정상이외에도 다양한 결정상이 형성될 수 있음을 추측할 수 있다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2012년도 제42회 동계 정기 학술대회 초록집
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• pp.100-101
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• 2012

The plasma damage free and room temperature processedthin film deposition technology is essential for realization of various next generation organic microelectronic devices such as flexible AMOLED display, flexible OLED lighting, and organic photovoltaic cells because characteristics of fragile organic materials in the plasma process and low glass transition temperatures (Tg) of polymer substrate. In case of directly deposition of metal oxide thin films (including transparent conductive oxide (TCO) and amorphous oxide semiconductor (AOS)) on the organic layers, plasma damages against to the organic materials is fatal. This damage is believed to be originated mainly from high energy energetic particles during the sputtering process such as negative oxygen ions, reflected neutrals by reflection of plasma background gas at the target surface, sputtered atoms, bulk plasma ions, and secondary electrons. To solve this problem, we developed the NBAS (Neutral Beam Assisted Sputtering) process as a plasma damage free and room temperature processed sputtering technology. As a result, electro-optical properties of NBAS processed ITO thin film showed resistivity of $4.0{\times}10^{-4}{\Omega}{\cdot}m$ and high transmittance (>90% at 550 nm) with nano- crystalline structure at room temperature process. Furthermore, in the experiment result of directly deposition of TCO top anode on the inverted structure OLED cell, it is verified that NBAS TCO deposition process does not damages to the underlying organic layers. In case of deposition of transparent conductive oxide (TCO) thin film on the plastic polymer substrate, the room temperature processed sputtering coating of high quality TCO thin film is required. During the sputtering process with higher density plasma, the energetic particles contribute self supplying of activation & crystallization energy without any additional heating and post-annealing and forminga high quality TCO thin film. However, negative oxygen ions which generated from sputteringtarget surface by electron attachment are accelerated to high energy by induced cathode self-bias. Thus the high energy negative oxygen ions can lead to critical physical bombardment damages to forming oxide thin film and this effect does not recover in room temperature process without post thermal annealing. To salve the inherent limitation of plasma sputtering, we have been developed the Magnetic Field Shielded Sputtering (MFSS) process as the high quality oxide thin film deposition process at room temperature. The MFSS process is effectively eliminate or suppress the negative oxygen ions bombardment damage by the plasma limiter which composed permanent magnet array. As a result, electro-optical properties of MFSS processed ITO thin film (resistivity $3.9{\times}10^{-4}{\Omega}{\cdot}cm$, transmittance 95% at 550 nm) have approachedthose of a high temperature DC magnetron sputtering (DMS) ITO thin film were. Also, AOS (a-IGZO) TFTs fabricated by MFSS process without higher temperature post annealing showed very comparable electrical performance with those by DMS process with $400^{\circ}C$ post annealing. They are important to note that the bombardment of a negative oxygen ion which is accelerated by dc self-bias during rf sputtering could degrade the electrical performance of ITO electrodes and a-IGZO TFTs. Finally, we found that reduction of damage from the high energy negative oxygen ions bombardment drives improvement of crystalline structure in the ITO thin film and suppression of the sub-gab states in a-IGZO semiconductor thin film. For realization of organic flexible electronic devices based on plastic substrates, gas barrier coatings are required to prevent the permeation of water and oxygen because organic materials are highly susceptible to water and oxygen. In particular, high efficiency flexible AMOLEDs needs an extremely low water vapor transition rate (WVTR) of $1{\times}10^{-6}gm^{-2}day^{-1}$. The key factor in high quality inorganic gas barrier formation for achieving the very low WVTR required (under ${\sim}10^{-6}gm^{-2}day^{-1}$) is the suppression of nano-sized defect sites and gas diffusion pathways among the grain boundaries. For formation of high quality single inorganic gas barrier layer, we developed high density nano-structured Al2O3 single gas barrier layer usinga NBAS process. The NBAS process can continuously change crystalline structures from an amorphous phase to a nano- crystalline phase with various grain sizes in a single inorganic thin film. As a result, the water vapor transmission rates (WVTR) of the NBAS processed $Al_2O_3$ gas barrier film have improved order of magnitude compared with that of conventional $Al_2O_3$ layers made by the RF magnetron sputteringprocess under the same sputtering conditions; the WVTR of the NBAS processed $Al_2O_3$ gas barrier film was about $5{\times}10^{-6}g/m^2/day$ by just single layer.