• Journal of the Korea Academia-Industrial cooperation Society
• /
• v.20 no.9
• /
• pp.532-540
• /
• 2019

PET microfibers with various diameters (0.5, 0.2, 0.06, and 0.01 dpf) were dyed with a dispersed dye (C.I. Disperse Blue 56) at various temperatures. The dyeing process was conducted under infinite dyebath conditions at constant temperatures. The effects of the dyeing temperature and diameter on the partition coefficient, affinity, and diffusion coefficient of disperse dyes were studied. The curve of isotherms was fitted well to Nernst-type model in a large range of initial dye concentrations. At the same temperature, the partition coefficient and affinity decreased with increasing sample diameter due to the increase in surface area. At all deniers, the partition coefficient and affinity decreased with increasing temperature because the dyeing process is an exothermic reaction. In addition, the decrease in radius of the sample gives rise to a decrease in the heat of dyeing. The fine diameter of the sample resulted in an increased surface area but decreased space between the microfibers. Consequently, decreasing the diameter of the microfibers leads to a decrease in the diffusion coefficient. At the same diameter, the diffusion coefficient increased with increasing temperature because of rapid dye movement and the large free volume of the sample inside. In addition, thermal dependence of the diffusion coefficient increased when the diameter of the sample increased.

• Journal of the Korean Institute of Intelligent Systems
• /
• v.25 no.4
• /
• pp.412-417
• /
• 2015

Kinect sensor has two output data which are produced from red green blue (RGB) sensor and depth sensor, it is called color image and depth map, respectively. Although this device's prices are cheapest than the other devices for three-dimensional (3D) reconstruction, we need extra work for reconstruct a smooth 3D data and also have semantic meaning. It happened because the depth map, which has been produced from depth sensor usually have a coarse and empty value. Consequently, it can be make artifact and holes on the surface, when we reconstruct it to 3D directly. In this paper, we present a method for solving this problem by using implicit surface representation. The key idea for represent implicit surface is by using radial basis function (RBF) and to avoid the trivial solution that the implicit function is zero everywhere, we need to defined on-surface point and off-surface point. Based on our simulation results using captured face as an input, we can produce smooth 3D face and fill the holes on the 3D face surface, since RBF is good for interpolation and holes filling. Modified anisotropic diffusion is used to produced smoothed surface.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2008.06a
• /
• pp.239-240
• /
• 2008

As semiconductor devices are scaled down for better performance and more functionality, the Cu-based interconnects suffer from the increase of the resistivity of the Cu wires. The resistivity increase, which is attributed to the electron scattering from grain boundaries and interfaces, needs to be addressed in order to further scale down semiconductor devices [1]. The increase in the resistivity of the interconnect can be alleviated by increasing the grain size of electroplating (EP)-Cu or by modifying the Cu surface [1]. Another possible solution is to maximize the portion of the EP-Cu volume in the vias or damascene structures with the conformal diffusion barrier and seed layer by optimizing their deposition processes during Cu interconnect fabrication, which are currently ionized physical vapor deposition (IPVD)-based Ta/TaN bilayer and IPVD-Cu, respectively. The use of in-situ etching, during IPVD of the barrier or the seed layer, has been effective in enlarging the trench volume where the Cu is filled, resulting in improved reliability and performance of the Cu-based interconnect. However, the application of IPVD technology is expected to be limited eventually because of poor sidewall step coverage and the narrow top part of the damascene structures. Recently, Ru has been suggested as a diffusion barrier that is compatible with the direct plating of Cu [2-3]. A single-layer diffusion barrier for the direct plating of Cu is desirable to optimize the resistance of the Cu interconnects because it eliminates the Cu-seed layer. However, previous studies have shown that the Ru by itself is not a suitable diffusion barrier for Cu metallization [4-6]. Thus, the diffusion barrier performance of the Ru film should be improved in order for it to be successfully incorporated as a seed layer/barrier layer for the direct plating of Cu. The improvement of its barrier performance, by modifying the Ru microstructure from columnar to amorphous (by incorporating the N into Ru during PVD), has been previously reported [7]. Another approach for improving the barrier performance of the Ru film is to use Ru as a just seed layer and combine it with superior materials to function as a diffusion barrier against the Cu. A RulTaN bilayer prepared by PVD has recently been suggested as a seed layer/diffusion barrier for Cu. This bilayer was stable between the Cu and Si after annealing at $700^{\circ}C$ for I min [8]. Although these reports dealt with the possible applications of Ru for Cu metallization, cases where the Ru film was prepared by atomic layer deposition (ALD) have not been identified. These are important because of ALD's excellent conformality. In this study, a bilayer diffusion barrier of Ru/TaCN prepared by ALD was investigated. As the addition of the third element into the transition metal nitride disrupts the crystal lattice and leads to the formation of a stable ternary amorphous material, as indicated by Nicolet [9], ALD-TaCN is expected to improve the diffusion barrier performance of the ALD-Ru against Cu. Ru was deposited by a sequential supply of bis(ethylcyclopentadienyl)ruthenium [Ru$(EtCp)_2$] and $NH_3$plasma and TaCN by a sequential supply of $(NEt_2)_3Ta=Nbu^t$ (tert-butylimido-trisdiethylamido-tantalum, TBTDET) and $H_2$ plasma. Sheet resistance measurements, X-ray diffractometry (XRD), and Auger electron spectroscopy (AES) analysis showed that the bilayer diffusion barriers of ALD-Ru (12 nm)/ALD-TaCN (2 nm) and ALD-Ru (4nm)/ALD-TaCN (2 nm) prevented the Cu diffusion up to annealing temperatures of 600 and $550^{\circ}C$ for 30 min, respectively. This is found to be due to the excellent diffusion barrier performance of the ALD-TaCN film against the Cu, due to it having an amorphous structure. A 5-nm-thick ALD-TaCN film was even stable up to annealing at $650^{\circ}C$ between Cu and Si. Transmission electron microscopy (TEM) investigation combined with energy dispersive spectroscopy (EDS) analysis revealed that the ALD-Ru/ALD-TaCN diffusion barrier failed by the Cu diffusion through the bilayer into the Si substrate. This is due to the ALD-TaCN interlayer preventing the interfacial reaction between the Ru and Si.

• Journal of Korean Society of Environmental Engineers
• /
• v.39 no.5
• /
• pp.282-287
• /
• 2017

The purpose of this study was predicted the effects of mixing and diffusion due to the operation of the apparatus before the development of the mixed diffusion device for the decontamination absorbent to minimize the influence of contaminant inflow due to radiation accident. The tracer used for the flow characteristics was $^{68}Ga$, $^{99m}Tc$, which is a radioactive isotope, and 2 inch NaI radiation detector was used to detect it. The impeller of the decontamination mixed diffusion system applied to this study was made into three types and the mixing diffusion effect was compared. As a result of analyzing the flow characteristics of the radio-isotope with decontamination mixed diffusion device, mixing, diffusion and flow pattern were obtained. The radial mixing type impeller was able to diffuse to the water surface by the upflow flow, and the fin structure was adjusted for finding optimal conditions. The model 3 type consists of a fin guiding part and an auxiliary fin so that the diffusion speed is higher than that of other types of impellers. It also showed a short time to reach complete mixing.

• Journal of the Korean Society for Industrial and Applied Mathematics
• /
• v.9 no.2
• /
• pp.29-43
• /
• 2005

We consider a surface reconstruction problem from geometrical points (i.e., points given without any order) distributed on a series of smooth parallel cross sections in ${\mathbb{R}}^3$. To solve the problem, we utilize the natural points ordering method in ${\mathbb{R}}^2$, described in [18], which is a method of reconstructing a curve from a set of sample points and is based on the concept of diffusion motions of a small object from one point to the other point. With only the information of the positions of these geometrical points, we construct an acceptable surface consisting of triangular facets using a heuristic algorithm to link a pair of parallel cross-sections constructed via the natural points ordering method. We show numerical simulations for the proposed algorithm with some sets of sample points.

• The Journal of Korean Institute of Communications and Information Sciences
• /
• v.6 no.1
• /
• pp.51-57
• /
• 1981

Carriers moving in a semiconductor can impart gain or loss to an acousic wave traveling through Piezo-electric materials. In this paper, surface a coustic wave amplifiers, which employ the interaction between carriers drifting in a semiconduct or film and electic fields accompanying a Rayleigh wave propagating on a Piezoelectric substrate, are described. The effect of various electromagnetic boundary condition on th propagation of surface waves in Piezoelectrics is considered. An expression for the dependence of surface wave velocity on electic boundary conditions is derived. Calculations show that, for properly prepared material, significant amplification is expected up to the microwave frequencies. At high frequencies, gain is reduced because electro diffusion smooths out the electron bucning necessary for amplification.

• Journal of Surface Science and Engineering
• /
• v.42 no.5
• /
• pp.232-239
• /
• 2009

This study presented the effect of membrane thickness on hydrogen permeability. Microvoids on the surface of the membrane should not exist for the exact values of hydrogen permeability. Pd-Cu-Ni hydrogen alloy membranes were fabricated by Ni powder sintering, substrate plasma pretreatment, sputtering and Cu reflow process. And this leaded to void-free surface and dense film of Pd-Cu-Ni hydrogen alloy membrane. Hydrogen permeation test showed that hydrogen permeability increased from 2.7 to $15.2ml/cm^2{\cdot}min{\cdot}atm^{0.5}$ as membrane thickness decreased from 12 to $4{\mu}m$. This represented the similar trend as a hydrogen permeability of pure palladium membrane based on solution-diffusion mechanism.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2012.08a
• /
• pp.216-216
• /
• 2012

The interaction of hydrogen with ZnO single crystal surfaces, ZnO (0001), ZnO (000-1), and ZnO (10-10) has been investigated using temperature programmed desorption (TPD) and X-ray photoelectron Spectroscopy (XPS) techniques. When the ZnO single crystal surfaces are exposed to atomic hydrogen at 200 K, all three surfaces show hydrogen desorption at 450 K. ZnO (0001) surface shows hydrogen desorption feature at ~260 K as the hydrogen exposure is increased. The ZnO (10-10) surface shows low-temperature desorption feature first and the high-temperature desorption feature appears as the hydrogen exposure increases. The ZnO (000-1) surface does not show any lower temperature hydrogen desorption. We will report the adsorption configuration of hydrogen atoms on ZnO single crystal surfaces with different surfaces structures.

• Proceedings of the Korea Concrete Institute Conference
• /
• 2002.10a
• /
• pp.543-546
• /
• 2002

This paper discussed micro - structure of skin concrete to understand transport properties from surface and seek thickness from surface which is seriously influenced on durability. Concrete at nearer surface has high porosity relative to inner concrete. The porosity of concrete and ISAT value at region from surface to 20 mm depth is decreased with depth. On the other hand, according to the result of ASTM C 1202 with specimen thickness, critical depth which affects fast ionic penetration through interfacial transition zone (ITZ) equals 35mm and the critical depth would be directly influenced by the effects of ITZ on chloride diffusion unrelated with W/C ratio.

• Journal of Environmental Science International
• /
• v.5 no.3
• /
• pp.285-295
• /
• 1996

In genneral, Businger expression is used for determining a turbulance diffusion coefficient. In this study, it is applied to the surface elements of cities such as Asphalt, Cround, Grass, Pond. We set up 5 m-height bar and measured the ary temperature and wet temperature at 도 height of 0.13, 0.27, 0.5, 1, 0, 3.0, 5.0m. In addition we measured the wind gradient and wind velocity at the height 3 m solar radiation continuously for 48 hours on the surface. Compared the measured data to Businger expression the result showed that Businger expression can be well applied to the complex surface of the city.