• 한국군사과학기술학회지
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• 제18권4호
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• pp.358-368
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• 2015

Recently, unmanned systems are largely utilized in various fields due to the persistency and the least operational risk and an unmanned surface vehicle(USV) is the one of the representative application in the naval field. To assign multiple roles to an USV, we developed a sonar system which consists of a forward detecting sonar for the long-range detection, a downward detecting sonar for the small target scan and identification, and a strut type body for mounting sonar systems. In this paper, we described the developed sonar system for USV and the sea test results for verifying system performance. The test results showed that the developed sonar system was able to detect the underwater target about several kilometers away and could recognize a small object at the downside of the sonar system. We expect that the developed sonar system will be easily applied to other unmanned platforms without serious consideration.

• 한국재료학회지
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• 제17권8호
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• pp.402-407
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• 2007

In electronics manufacturing processes, soldering process has generally been used in surface mounting technology. Because of environmental restriction, lead free solders as like a SnAgCu ternary system are being used widely. After soldering process, the formation and growth of intermetalic compounds(IMCs) are formed in the interface between solder and Cu substrate as follows isothermal temperature and time. In this studies, therefore, we investigated the effects of the Cu substrate thickness on the IMC formation and growth of Sn-40Pb/Cu and Sn-3.0Ag-0.5Cu/Cu solder joints, respectively. The effect of the Cu thickness in PCB Cu pad and pure Cu plate was analyzed as measuring of thickness of each IMC. After solder was soldered on PCB and Cu plate which have different Cu thickness, we measured the IMC thickness in solder joints respectively. Also we compared with the effectiveness of Cu thickness on the IMC growth. From these results, we calculated the activation energy.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 춘계학술대회 논문집
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• pp.1214-1218
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• 2005

As demands for precision parts are increased, existing methods to fabricate them such as MEMS, LIGA technology have the technical limitations like high precision, high functionality and ultra miniaturization. A micro-stereolithography technology based on $DMD^{TM}$(Digital Micromirror Device) can meet these demands. In this technology, STL file is the standard format as the same of conventional rapid prototyping system, and 3D part is fabricated by stacking layers that are sliced as 2D section from STL file. Whereas in conventional method, the resin surface is cured as scanning laser beam spot according to the section shape, but in this research, we use integral process which enables to cure the resin surface at one time. In this paper, we deal with the dynamic pattern generation and $DMD^{TM}$ operation to fabricate micro structures. Firstly, we address effective slicing method of STL file, conversion to bitmap, and dynamic pattern generation. Secondly, we suggest $DMD^{TM}$ operation and optimal support manufacturing for $DMD^{TM}$ mounting. Thirdly, we examine the problems on continuous stacking layers, and their improvements in software aspects.

• 센서학회지
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• 제10권1호
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• pp.16-23
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• 2001

국부적인 측정을 수행하는 일반적인 광섬유 센서에 비해 분포형 광섬유 센서는 광섬유의 길이방향을 따라 모든 위치에서 측정이 가능하며 보다 넓은 영역의 측정을 수행할 수 있다. 브릴루인 산란 분포형 광섬유 센서를 구조물의 건전성 감시에 이용할 때에는 광섬유 센서의 일반적인 부착 방법인 에폭시를 이용한 표면부착 방법을 사용하게 된다. 본 논문에서는 에폭시를 이용하여 브릴루인 분포형 광섬유 센서를 구조물의 표면에 부착하였을 때 구조물의 변형률 변화를 광섬유 센서가 정확히 측정해 낼 수 있는지에 대해 유한요소법을 통한 검증을 수행하였다. 구조물로부터 에폭시, 광섬유 코팅, 클래딩을 통해 코어로 전달되는 변형률의 전달률을 해석을 통해 확인하였으며 변형률 분포로부터 에폭시 끝 단의 자유 경계면이 미치는 영향을 살펴보았다.

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 2004년도 춘계학술대회 논문집
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• pp.404-409
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• 2004

To maximize the productivity in machining molds and dies, machine tools should operate at high speeds. During the high speed operation of moving frames or spindles, vibration problems are apt to occur if the machine tool structures are made of conventional steel materials with inferior damping characteristics. However, self-excited vibration or chatter is bound to occur during high speed machining when cutting speed exceeds the stability limit of machine tool. Chatter is undesirable because of its adverse effect on surface finish, machining accuracy, and tool life. Furthermore, chatter is a major cause of reducing production rate because, if no remedy can be found, metal removal rates have to be lowered until vibration-free performances is obtained. Also, the resonant vibration of machine tools frequently occurs when operating frequency approaches one of their natural frequencies because machine tools have several natural frequencies due to their many continuous structural elements. However, these vibration problems are closely related to damping characteristics of machine tool structures. The polymer concrete has high potential for machine tool bed due to its good damping characteristics with moderate stiffness. This paper presents the use of polymer concrete and sandwich structures to overcome vibration problems. Also, co-cure bonding method for functional part mounting was exhibited experimentally, by which manufacturing time and cost for polymer concrete bed will be remarkably reduced.

• 조명전기설비학회논문지
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• 제27권5호
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• pp.67-73
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• 2013

The conversion of solar radiation into electrical energy by Photo-Voltaic (PV) effect is a very promising technology, being clean, silent and reliable, with very small maintenance costs and small ecological impact. The output power produced by the PV panels depends strongly on the incident light radiation. The continuous modification of the sun-earth relative position determines a continuously changing of incident radiation on a fixed PV panel. The point of maximum received energy is reached when the direction of solar radiation is perpendicular on the panel surface. Thus an increase of the output energy of a given PV panel can be obtained by mounting the panel on a solar tracking device that follows the sun trajectory. Tracking systems that have two axes and follow the sun closely at all times during the day are currently the most popular. This paper presents research conducted into the performance of Solar tracking system with photosensors. The results show that an optimized dual-axis tracking system with photosensor performance and analysis. From the obtained results, it is seen that the sun tracking system improves the energy and energy efficiency of the PV panel.ti-junction CPV module promises to accelerate growth in photovoltaic power generation.

• Smart Structures and Systems
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• 제15권2호
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• pp.245-258
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• 2015

A methodology based on distributed fiber optic sensors is proposed to detect the lateral buckling for subsea pipelines in this study. Uncontrolled buckling may lead to serious consequences for the structural integrity of a pipeline. A simple solution to this problem is to control the formation of lateral buckles among the pipeline. This firms the importance of monitoring the occurrence and evolution of pipeline buckling during the installation stage and long-term service cycle. This study reports the experimental investigations on a method for distributed detection of lateral buckling in subsea pipelines with Brillouin fiber optic sensor. The sensing scheme possesses the capability for monitoring the pipeline over the entire structure. The longitudinal strains are monitored by mounting the Brillouin optical time domain analysis (BOTDA) distributed sensors on the outer surface of the pipeline. Then the bending-induced strain is extracted to detect the occurrence and evolution of lateral buckling. Feasibility of the method was validated by using an experimental program on a small scale model pipe. The results demonstrate that the proposed approach is able to detect, in a distributed manner, the onset and progress of lateral buckling in pipelines. The methodology developed in this study provides a promising tool for assessing the structural integrity of subsea pipelines.

• 전자통신동향분석
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• 제35권4호
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• pp.1-10
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• 2020

Since the 1960s, semiconductor packaging technology has developed into electrical joining techniques using lead frames or C4 bumps using tin-lead solder compositions based on traditional reflow processes. To meet the demands of a highly integrated semiconductor device, high reliability, high productivity, and an eco-friendly simplified process, packaging technology was required to use new materials and processes such as lead-free solder, epoxy-based non cleaning interconnection material, and laser based high-speed processes. For next generation semiconductor packaging, the study status of two epoxy-based interconnection materials such as fluxing and hybrid underfills along with a laser-assisted bonding process were introduced for fine pitch semiconductor applications. The fluxing underfill is a solvent-free and non-washing epoxy-based material, which combines the underfill role and fluxing function of the Surface Mounting Technology (SMT) process. The hybrid underfill is a mixture of the above fluxing underfill and lead-free solder powder. For low-heat-resistant substrate applications such as polyethylene terephthalate (PET) and high productivity, laser-assisted bonding technology is introduced with two epoxy-based underfill materials. Fluxing and hybrid underfills as next-generation semiconductor packaging materials along with laser-assisted bonding as a new process are expected to play an active role in next-generation large displays and Augmented Reality (AR) and Virtual Reality (VR) markets.

• 대한의생명과학회지
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• 제5권1호
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• pp.41-49
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• 1999

저자들은 1999년 5월에 경기도 남양주군 군부대에서 사육하고 있는 한 마리의 군견 오른쪽 안부 위에서 7마리 (암놈 4마리, 수놈 3마리)의 동양안충을 검출하였다. 이 중 일부는 고정과 lactophenol 액으로 봉입한 후 광학현미경으로 관찰하였으며 일부는 glutaraldehyde액 에 고정하여 주사전자현미경으로 관찰하였다. 충체의 암놈 및 수놈의 두부와 꼬리부위의 형태 특징 그리고 충체 표피의 각질, 암놈 음문의 위치 등을 관찰한 결과 동양안충으로 동정하였다.

• 청정기술
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• 제10권2호
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• pp.61-72
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• 2004

본 연구에서는 물성, 세정성, 헹굼액의 유수분리성을 고려하여 유기용매의 종류 및 함량, 계면활성제의 종류 및 함량, 부조계면활성제/계면활성제 (cosurfactant/surfactant, A/S) 비율 등의 변수로 하여 수계/준수계 세정제를 개발하였다. 개발된 세정제들은 대부분 평균 액적크기가 10 ~ 20 nm의 미세 나노입자를 형성 하였으며, 30.2~32.5 dyne/cm의 낮은 표면장력과 낮은 점도 값을 보여 주었다. 플럭스에 대한 용해력은 계면활성제의 소수성이 증가할수록 높게 나타났으며 terpene을 함유한 세정제들이 hydrocarbon 함유 세정제와 대응 시판세정제에 비해 우수한 용해력을 보여 terpene계 세정제가 대체세정제로의 적합성을 보여주었다. 또한, 개발된 세정제들을 함유한 헹굼액은 시판세정제에 비하여 우수한 유수분리성을 보여 헹굼액의 재활용이 가능하여 경제적인 부담과 수질오염을 줄일 수 있음을 보여주었다. 그리고 이렇게 개발된 세정제를 L 전자 회사의 전자부품 생산라인 SMT(surface mount technology) 세정공정에 적용시켜 보았다. 그 결과 solder cream 제거에 있어서 에탄올, 이소프로필알콜(IPA), glycol ether과 같은 물질이 함유된 기존의 세정제에 비하여 세정성능이 2 배이상 향상되었고 생산현장에서 악취와 VOC의 문제를 해결시킬 수 있었다.