• Journal of the Microelectronics and Packaging Society
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• v.31 no.2
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• pp.69-77
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• 2024

Due to the miniaturization and multifunctionality of electronic devices, a surface mount technology in the form of molded interconnect devices (MID), which directly forms electrodes and circuits on the plastic injection parts and mounts components and parts on them, is being introduced to overcome the limitations in the mounting area of electronic components. However, when using plastic injection parts with low thermal stability, there are difficulties in mounting components through the conventional reflow process. In this study, we developed a process that utilizes induction heating, which can selectively heat specific areas or materials, to melt solder and mount components without causing any thermal damage to the plastic. We designed the shape of an induction heating Cu coil that can concentrate the magnetic flux on the area to be heated, and verified the concentration of the magnetic flux and the degree of heating on the pad part through finite element method (FEM). LEDs, capacitors, resistors, and connectors were mounted on a polycarbonate substrate using induction heating to verify the mounting process, and their functionality was confirmed. We presented the applicability of a selective heating process through magnetic induction that can overcome the limitations of the reflow method.

• Proceedings of the Korean Operations and Management Science Society Conference
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• 2003.05a
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• pp.394-401
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• 2003

We consider a PCB grouping problem arising from the electronic industry. Given a surface mounting device, several types of PCBs and a number of component feeders used to assemble the PCBs. the optimization problem is the PCB grouping problem while minimizing setup time of component feeders. We formulate the problem as an Integer programming model and propose a column generation approach to solve the Integer programming formulation. In this approach we decompose the original problem Into master problem and column generation subproblem Starting with a few columns in the master problem. we generate new columns successively by solving subproblem optimally. To solve the subproblem. we use a branrh-and-rut approach. Computational experiments show that our solution approach gives high quality solutions in a reasonable computing time.

• Management & Information Systems Review
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• v.34 no.2
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• pp.67-78
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• 2015

In this paper, we consider a scheduling problem of printed circuit board production process with setup cost depending job sequence. Given a set of PCBs, these are produced in single surface mounting device. The problem is to define job sequence with the objective of minimizing the total seutp cost. We propose a mathematical formulation and the problem is proven to be NP-hard. So, a meta heuristic based on genetic algorithm is developed.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.32 no.5
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• pp.430-436
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• 2008

This paper proposes a way to predict electrical lifetime of a relay using Accelerated Life Testings (ALTs). The relay of interest mounting on printed circuit boards is usually under an inrush current stress. The inrush current is generated and accelerated through controlling a lamp switching device in the ALT. We find that the dominant failure mechanism under high levels of inrush current would be contact welding in the contact surface of the relay and the contact welding process is accelerated according to increase in inrush current. The electrical lifetime model based on Inverse Power Law in term of inrush current is proposed, and parameters characterizing relay's lifetime distribution are statistically estimated using ALTA 6 PRO software.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1996.04a
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• pp.568-573
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• 1996

In this paper, A design strategy of the Surface Mounting Device for accurate and better performance is studied. Analytical Modeling. Sensitivity analysis and optimization are being conducted. The ANSYS software and experimental method are used for verification of the analytical equations withboundary conditons. Through the sensitivity analysis, the most dominant design parameters can be detected. The optimum design parameters for performing given performing given perfomances are selected by using the optimization algorithm. The design tool based on the design strategy for the analysis, modeling and optimization will be useful for a re-design and better perofrmance of the SMD.

• Journal of the Korean Society for Precision Engineering
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• v.14 no.2
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• pp.120-128
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• 1997

In this paper, A design strategy of the Surface Mounting Device for accurate and better performance is studied. Analytical modeling, sensitivity analysis, and optimization are being conducted. The ANSYS software and experimental method are used for the verification of the analytical equations with boundary conditions. Through the sensitivity analysis, the most dominant design parameter can be detected. The optimum design parameters for improving the given performances are selected by using the optimiza- tion algorithm. The design tool based on the design strategy for the analysis, modeling, and optimization will be useful for are-design and better improving of the SMD.

• Design & Manufacturing
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• v.14 no.1
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• pp.8-14
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• 2020

In general, auto parts production assembly line is assembled and produced by automatic mounting by an automated robot. In such a production site, quality problems such as misalignment of parts (doors, trunks, roofs, etc.) to be assembled with the vehicle body or collision between assembly robots and components are often caused. In order to solve such a problem, the quality of parts is manually inspected by using mechanical jig devices outside the automated production line. Automotive inspection technology is the most commonly used field of vision, which includes surface inspection such as mounting hole spacing and defect detection, body panel dents and bends. It is used for guiding, providing location information to the robot controller to adjust the robot's path to improve process productivity and manufacturing flexibility. The most difficult weighing and measuring technology is to calibrate the surface analysis and position and characteristics between parts by storing images of the part to be measured that enters the camera's field of view mounted on the side or top of the part. The problem of the machine vision device applied to the automobile production line is that the lighting conditions inside the factory are severely changed due to various weather changes such as morning-evening, rainy days and sunny days through the exterior window of the assembly production plant. In addition, since the material of the vehicle body parts is a steel sheet, the reflection of light is very severe, which causes a problem in that the quality of the captured image is greatly changed even with a small light change. In this study, the distance between the car body and the door part and the door are acquired by the measuring device combining the laser slit light source and the LED pattern light source. The result is transferred to the joint robot for assembling parts at the optimum position between parts, and the assembly is done at the optimal position by changing the angle and step.

• Journal of the Korean Society of Safety
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• v.24 no.4
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• pp.28-33
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• 2009

This study examined the mounting status of cigar lighter receptacles for vehicles and analyzed the tracking phenomenon that occurs when foreign material entered a cigar lighter receptacle to obtain data for the analysis of accident investigation. Regardless of the vehicle's output, cigar lighter receptacles are mounted in a vehicle horizontally, vertically, or at tilting or inclined angle. The tilting type cigar lighter receptacle is much easier to use but current leakage resulting from foreign materials (coffee, beverages, water, etc.) falling into the cigar lighter receptacle may cause a fire to start. This study used a vehicle battery (DC 12V) as a power supply for the tracking test and configured its circuit in the same way as that of an electrical device in a vehicle. The tracking phenomenon that occurred in the standby mode of the vehicle exhibited a fine flame and an irregular occurrence of smoke. While this tracking phenomenon was occurring, the leakage current and the reaching distance of the flame were measured to be approximately 930mA and $20{\sim}50cm$, respectively. It is thought that the resultant flame may ignite toluene, dust, cigarettes, etc. It was observed that as the tracking progressed, the internal metal socket melted and a hole was created, the surface of which was also severely carbonized. In addition, the electrical resistance of the carbonized conductive path was measured to be approximately $30{\Omega}$. It is thought that this much resistance may cause local heating when leakage current flows and could ignite any nearby flammable material.

• Proceedings of the KSME Conference
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• 2001.06d
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• pp.396-401
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• 2001

Heat transfer analysis of a iron core type linear motor for surface mounting device applications was considered in this study. In order to avoid the complex conjugate problem a fluid flow regime and a solid regime were considered separately. First, film coefficients of the moving parts were evaluated from computational fluid dynamic analysis and those of the stationary parts from the existing empirical or analytic correlations. And then, by applying them, internal and external temperatures of the linear motor pal1s were computed through finite element analysis. Both computation and measurement were carried out with respect to motor driving power. The measurement did not exhibit a linear temperature variation trend with respect to motor power while the computation revealed a linear correlation. Nonetheless, the computations agreed with the measurements within an error range of 20%. It indicates that an adequate heat transfer model for the reciprocative coil assembly may help more exact prediction.

• Journal of Institute of Control, Robotics and Systems
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• v.21 no.3
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• pp.276-282
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• 2015

This paper proposes a SMD (surface mounting device) classification method for the PCB assembly inspection machines. The package types of SMD components should be classified to create the job program of the inspection machine. In order to reduce the creation time of job program, we developed the automatic classification algorithm for the SMD packages. We identified the chip-type packages by color and edge distribution of the images. The input images are transformed into the HSI color model, and the binarized histroms are extracted for H and S spaces. Also the edges are extracted from the binarized image, and quantized histograms are obtained for horizontal and vertical direction. The neural network is then applied to classify the package types from the histogram inputs. The experimental results are presented to verify the usefulness of the proposed method.