• Journal of the Korea Academia-Industrial cooperation Society
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• v.12 no.9
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• pp.4138-4146
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• 2011

In surface mount technology, with cellular phones and flat panel displays shrinking in size, the electric goods for making these things are getting smaller as well. Therefore, the technology of mounting components such as 0402 and 0603 Chip is on the rise. The chip mount manufacturing companies have studied the mount technology to prevent the missing insertions or improper insertion. This study suggests arranging the mechanical structure by using fiber sensors to eliminate missing insertions or improper insertions and developing the technology for upgrading system algorithms.

• Design & Manufacturing
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• v.11 no.2
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• pp.25-28
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• 2017

Semiconductor equipment manufacturers desire to enhance efficiency of Sub Fab to increase semiconductor productivity. For this reason, Sub Fab equipment manufacturers are developing Integrated System that combined modules with multiple facilities. Integrated System is required to apply Mount Leveler of Wedge Type in compliance with weight increase compared with existing single equipment and product shape change. This thesis analyzes main design variables of components of Wedge Mount Leveler and carries out structure analysis using ANSYS, finite element analysis program Analysis shows that main design variables of components of Wedge Mount Leveler has self-locking condition by friction force of Wedge and adjusting bolt. Each friction force hinges upon Wedge angle and Friction Coefficient of contact surface and upon the thread angle and Friction Coefficient of contact surface. Also, as a result of carrying out structure analysis of Wedge Mount Leveler, deflection and stress appears in different depending on the height of the level.

• International Journal of Naval Architecture and Ocean Engineering
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• v.5 no.1
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• pp.62-80
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• 2013

This paper has been focused on developing a new hybrid mount for shipboard equipment used in naval surface ships and submarines. While the hybrid mount studied in our previous research was 100 kg-class series-type mount, the new hybrid mount has been designed as an inertia-type mount capable of supporting a static of 500 kg. The proposed mount consists of a commercial rubber resilient mount, a piezostack actuator and an inertial mass. The piezostack actuator connected with the inertial mass generates actively the control force. The performances of the proposed mount with a newly designed specific controller have been evaluated in accordance with US military specifications and compared with the passive mount. An isolation system consisting of four proposed mounts and auxiliary devices has been also tested. Through a series of experimental tests, it has been confirmed that the proposed mount provides better performance than the US Navy's standard passive mounts.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2016.05a
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• pp.674-675
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• 2016

In this paper, we propose a manufacturing process model of Internet of Things devices using a Printed Circuit Board (PCB)-mounted RFID tag chip for reducing electronic wastes. Electrical and electronic products require a PCB surface mount and many examination. Also, conventional barcode systems cannot provide traceability management in PCB manufacturing before finishing Surface Mount Technology (SMT) process. The proposed process model does not require workers' attaching and detaching process unlike barcode systems. Also, RFID tag chip can record all the data in manufacturing steps. Thus, the number of connections to a database management system (DBMS) can be reduced.

• Journal of the Korea Institute of Military Science and Technology
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• v.26 no.3
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• pp.205-213
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• 2023

An optimal design of a simple beam-shaped flexure hinge mount supporting an optical mirror is presented. An optical mirror assembly is an opto-mechanically coupled system as the optical and mechanical behaviors interact. This side-supporting mount is flexible in the radial direction and rigid for the remaining degrees of freedom to support the mirror without transferring thermal load. Through thermo-elastic, optical and eigenvalue analysis, opto-mechanical performance was predicted to establish the objective functions for optimization. The key design parameters for this flexure are the thickness and length. To find the optimal values of design parameters, response surface analysis was performed using the design of experiment based on nested FCD. Optimal design candidates were derived from the response surface analysis, and the optimal design shape was confirmed through Opto-mechanical performance validation analysis.

• Industrial Engineering and Management Systems
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• v.12 no.4
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• pp.330-335
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• 2013

A surface mount device (SMD) assembles electronic components on printed circuit boards (PCB). Since a component assembly process is a bottleneck process in a PCB assembly line, making an efficient SMD plan is critical in increasing the PCB assembly line productivity. Feeder assignment is an important part of the SMD plan optimization. In this paper, we propose a feeder re-assign improvement algorithm for a specific type of SMD machine with a piano type multi-head gantry. Computational results on some real-world benchmark data sets show the effectiveness of our proposed algorithm.

• 제어로봇시스템학회:학술대회논문집
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• 1995.10a
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• pp.259-262
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• 1995

In this paper, a model of an asymptotically reliable serial production line with quailty control devices is introduced and analyzed. By an asymptotic technique and Taylor series expansion, its average production rate is approximated in a closed form. The results are applied to a case study of a surface mount system.

• The Bulletin of The Korean Astronomical Society
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• v.15
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• pp.12.2-12.2
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• 1990

• Bulletin of the Korean Space Science Society
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• 1994.04a
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• pp.27-27
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• 1994

No Abstract. See Full-text

• Journal of the Korea Academia-Industrial cooperation Society
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• v.16 no.3
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• pp.2146-2150
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• 2015

The surface mount technology is used, as mounting relay using Chip Mounter that is inserted into the junction box, etc. car and small components such as 0402 and 0603 Chip. In this study we developed stick tube for supplying the relay that cause problems as components is heavy and suggested the technology using fiber sensors to eliminate missing insertions or improper insertions because of small components. And we show to result of the experiment how to increased the productivity.