• Journal of the Korean Society for Precision Engineering
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• v.15 no.1
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• pp.43-50
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• 1998

The purpose of the paper is to protect the damage of plastic IC package with searching the cause of the fracture due to the delamination and crack when the encapsulant of plastic IC package is on viscoelastic behavior with the effect of creep on high temperature, The model for analysis is the plastic SOJ package with dimpled diepad in the IR soldering process of surface mounting technology. The risk of delamination with calculating the distribution of viscoelastic thermal stress in the package without the crack in the surface mounting process is checked. The package model with the perfect delamination between chip and diepad is chosen to estimate the resistance against fracture in thermal loading with calculating C (t)-integrals according to the change of the design. The optimum design to depress the delamination and crack is presented.

• Journal of Power System Engineering
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• v.9 no.1
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• pp.57-63
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• 2005

In the calendar and the advertising catalog, the surface is usually coated by coating polypropylene film. The delamination failure of coating film depends on surface roughness and quality of the substrate paper. In this paper, the mechanisms of delamination failure between the coating film and the paper is investigated by using the root cause analysis as one of techniques of reliability evaluation. The papers used in failure analysis are three kind products made by two domestic and one foreign companies. It found that the main causes of delamination failure between the coating film and the paper were the creation of microvoids caused by shape of filler and their growth caused by contraction of paper.

• Progress in Superconductivity and Cryogenics
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• v.19 no.2
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• pp.25-28
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• 2017

In superconducting coil applications particularly in wet wound coils, coated conductor (CC) tapes are subjected to different type of stresses that could affect its electromechanical transport property. These include hoop stress acting along the length of the CC tape and the Lorentz force acting perpendicular to the CC tape's surface. Since the latter is commonly associated with the delamination problem of multi-layered REBCO CC tapes, more understanding and attention on the delamination phenomena induced in the case of coil applications are needed. Difference on the coefficient of thermal expansion (CTE) of each constituent layer of the CC tape, the bobbin, and the impregnating materials is the main causes of delamination in CC tapes when subjected to thermal and mechanical cycling. In the design of degradation-free superconducting coils, therefore, characterization of the delamination behaviors including mechanism and strength in the multi-layered REBCO CC tapes becomes a critical issue. Various trials to increase the delamination strength by improving interface characteristics at interlayers have been performed. In this study, in order to investigate the influences of laser cleaning and Ag annealing treated at the substrate side surface, transverse tensile tests were conducted under different sample configurations using $4.5mm{\times}8mm$ upper anvil. The mechanical delamination strength of differently processed CC samples was examined at room temperature (RT). As a result, the Sample 1 with the additional laser cleaning and Ag annealing processes and the Sample 2 with additional Ag annealing process only showed higher mechanical delamination strength as compared to the Sample 3 without such additional treatments. Sample 3 showed quite different behavior when the loading direction is to the substrate side where the delamination strength much lower as compared to other cases.

• Composites Research
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• v.26 no.6
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• pp.380-385
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• 2013

Characteristics of delamination factor and surface roughness by drilling condition for glass fiber reinforced plastic (GFRP) composites were investigated in this paper. An expression to quantify the delamination factor was induced by using image pixels of the entry and the experimental drilling was accomplished by fabricating several GFRP specimens in condition of minimizing the effect of vibration and heat. A method for measuring 6 points average surface roughness was applied to acquire the more reliable roughness values. The experimental results showed that the delamination factor was decreased as the feed rate was increased and it was also slightly decreased as the cutting speed was increased. Also, it was investigated that the surface roughness at inner surface of drilled holes was increased as the feed rate was increased, whereas the roughness values were not affected by the cutting speed variation.

• Journal of the Society of Naval Architects of Korea
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• v.58 no.6
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• pp.375-381
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• 2021

This paper investigated sound characteristics by the delamination of an acoustic window. In detail, acoustic scattering and transmission characteristics on the delaminated acoustic window were estimated using an experimental and numerical approach. The experiment results showed that acoustic wave could lose its amplitude and take phase delay when it propagates the delaminated acoustic window. The numerical results showed that scattering phenomena occur on the delamination surface. The scattering characteristics presented differently according to the delamination size in the acoustic window. It also showed that transmitted sound distortion due to delamination could cause a direction detection error of SONAR by changing the position of the main lobe and the magnitude of the side lobe. In conclusion, the delamination has to be managed during the manufacturing process of acoustic windows.

• Proceedings of the Korean Reliability Society Conference
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• 2005.06a
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• pp.199-208
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• 2005

In the calendar and the advertising catalog, the surface Is usually coated by coating polypropylene film. The delamination failure of coating film depends on surface roughness and quality of the substrate paper. In this paper, the mechanisms of delamination failure between the coating film and the paper is investigated by using the root cause analysis as one of techniques of reliability evaluation. The papers used in failure analysis are three kind products made by two domestic and one foreign companies. It found that the main causes of delamination failure between the coating film and the paper were the creation of microvoids caused by shape of filler and their growth caused by contraction of paper.

• Smart Structures and Systems
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• v.5 no.6
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• pp.633-644
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• 2009

A simple method has been developed to detect the bonding condition of active fiber composites (AFC) adhered to the surface of a host structure. Large deformation actuating capability is one of important features of AFC. Edge delamination in adhesive layer due to large interfacial shear stress at the free edge is typically resulted from axial strain mismatch between bonded materials. AFC patch possesses very good flexibility and toughness. When an AFC patch is partially delaminated from host structure, there remains sensing capability in the debonded part. The debonding size can be determined through axial resonance measured by the interdigitated electrodes symmetrically aligned on opposite surfaces of the patch. The electrical impedance and modal response of the AFC patch in part adhered to an aluminum plate were investigated in a broad frequency range. Debonding ratio of the AFC patch is in inverse proportion to the resonant frequency of the fundamental mode. Feasibility of in-situ detecting the progressive delamination between AFC patch and host plate is demonstrated.

• Tribology and Lubricants
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• v.33 no.6
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• pp.282-287
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• 2017

SU-8 is an epoxy-type photoresist widely used for the fabrication of high-aspect-ratio (HAR) micro-structures in micro-electro-mechanical systems (MEMS). To fabricate highly integrated structures, chemical mechanical polishing (CMP) has emerged as the preferred manufacturing process for planarizing the MEMS structure. In SU-8 CMP, an oxidizer decomposes organic impurities and particles in the CMP slurry remove the chemically reacted surface of SU-8. To fabricate HAR microstructures using the CMP process, the adhesion between SU-8 and substrate material is important to avoid the delamination of the SU-8 film caused by the mechanical-dominant material removal characteristic. In this study, the friction force during the CMP process is measured with a CMP monitoring system to detect the delamination phenomenon and investigate the delamination of the SU-8 film from the silicon substrate under various pressure conditions. The increase in applied pressure causes an increase in the frictional force and wafer-edge stress concentration. The frictional force measurement shows that the friction force changes according to the delamination phenomenon of the SU-8 film, and that it is possible to monitor the delamination phenomenon during the SU-8 CMP process. The delamination at a high applied pressure is explained by the effect of stress distribution and pad deformation. Consequently, it is necessary to control the pressure of polishing, which can avoid the delamination in SU-8 CMP.

• Progress in Superconductivity and Cryogenics
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• v.21 no.4
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• pp.34-38
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• 2019

Multilayered high-temperature superconductor coated conductor (CC) tapes are used in an extensive range of applications and are exposed to many stresses such as hoop stress, radial/transverse tensile stress under large Lorentz forces, and thermal stress while cooling if thermal expansion properties differ. Loads induced transversely at the tape surface inevitably create delamination phenomena in the multilayered CC tapes. Thus, delamination behaviors of CC tapes along the c-axis under transverse loading conditions, which can vary based on manufacturing process and constituent layers, must be characterized for applications. The anvil test method was used to mechanically investigate the delamination characteristics of various commercially available Ag-stabilized CC tapes at room temperature and 77 K, finding superior strength at the latter. The wide variations found depended on tape structure and fabrication technique. Fractographic morphologies of delaminated tapes supported the findings under transverse loading conditions.

• Advances in aircraft and spacecraft science
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• v.4 no.5
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• pp.515-528
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• 2017

Since composite structures are widely used in structural engineering, delamination in such structures is an important issue of research. Delamination is one of a principal cause of failure in composites. In This study the electrical potential (EP) technique is applied to detect and locate delamination in basalt fiber reinforced polymer (FRP) laminate composite pipe by using electrical capacitance sensor (ECS). The proposed EP method is able to identify and localize hidden delamination inside composite layers without overlapping with other method data accumulated to achieve an overall identification of the delamination location/size in a composite, with high accuracy, easy and low-cost. Twelve electrodes are mounted on the outer surface of the pipe. Afterwards, the delamination is introduced into between the three layers (0º/90º/0º)s laminates pipe, split into twelve scenarios. The dielectric properties change in basalt FRP pipe is measured before and after delamination occurred using arrays of electrical contacts and the variation in capacitance values, capacitance change and node potential distribution are analyzed. Using these changes in electrical potential due to delamination, a finite element simulation model for delamination location/size detection is generated by ANSYS and MATLAB, which are combined to simulate sensor characteristic. Response surfaces method (RSM) are adopted as a tool for solving inverse problems to estimate delamination location/size from the measured electrical potential changes of all segments between electrodes. The results show good convergence between the finite element model (FEM) and estimated results. Also the results indicate that the proposed method successfully assesses the delamination location/size for basalt FRP laminate composite pipes. The illustrated results are in excellent agreement with the experimental results available in the literature, thus validating the accuracy and reliability of the proposed technique.