• Title/Summary/Keyword: Surface Adhesion

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RIE Damage Remove Etching Process for Solar Cell Surface Texturing Using the TMAH Etching

  • O, Jeong-Hwa;Gong, Dae-Yeong;Jo, Jun-Hwan;Jo, Chan-Seop;Yun, Seong-Ho;Lee, Jong-Hyeon
    • Proceedings of the Korean Vacuum Society Conference
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    • 2012.02a
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    • pp.584-584
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    • 2012
  • 결정형 실리콘 태양전지 공정 중 표면 texturing 공정은 표면에 요철을 형성시켜 반사되는 빛 손실을 줄여서, 증가된 빛 흡수 양에 의해 단락전류(Isc)를 증가시키는데 그 목적이 있다. 표면 texturing 공정은 습식 식각과 건식 식각에 의한 방법으로 나눌 수 있다. 습식 식각은 KOH, TMAH, HNA 등의 실리콘 식각 용액을 사용하여 공정상의 위험도가 크고, 사용 후 용액의 폐기물에 의한 환경오염 문제가 있다. 건식 식각은 습식 식각과 달리 폐기물의 처리가 없고 미량의 가스를 이용한다. 그리고 다결정 실리콘 웨이퍼처럼 불규칙적인 결정방향에도 영향을 받지 않는 장점을 가지고 있어서 건식 식각을 이용한 표면 texturing 공정에 관한 많은 연구가 진행되고 있으며, 특히 RIE(reactive ion etching)를 이용한 태양전지 texturing 공정이 가장 주목을 받고 있다. 하지만 기존의 RIE를 이용하여 표면 texturing 공정을 하게 되면 500 nm 이하의 needle-like 구조의 표면이 만들어진다. Needle-like 구조의 표면은 전극을 형성할 때에 접촉 면적이 좁기 때문에 adhesion이 좋지 않은 것과 단파장 대역에서 광 손실이 많다는 단점이 있다. 본 논문에서는 기존의 RIE texturing의 단점을 보완하기 위해 챔버 내부에 metal-mesh를 장착한 후 RIE를 이용하여 $1{\mu}m$의 피라미드 구조를 형성하였고, RIE 공정 시 ion bombardment에 의한 표면 손상을 제거(RIE damage remove etching)하기 위하여 10초간 TMAH(Tetramethyl -ammonium hydroxide, 25 %) 식각 공정을 하였다.

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Low Temperature Processes of Poly-Si TFT Backplane for Flexible AM-OLEDs

  • Hong, Wan-Shick;Lee, Sung-Hyun;Cho, Chul-Lae;Lee, Kyung-Eun;Kim, Sae-Bum;Kim, Jong-Man;Kwon, Jang-Yeon;Noguchi, Takashi
    • 한국정보디스플레이학회:학술대회논문집
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    • 2005.07a
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    • pp.785-789
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    • 2005
  • Low temperature deposition of silicon and silicon nitride films by catalytic CVD technique was studied for application to thin film transistors on plastic substrates for flexible AMOLEDs. The substrate temperature initially held at room temperature, and was controlled successfully below $150^{\circ}C$ during the entire deposition process. Amorphous silicon films having good adhesion, good surface morphology and sufficiently low content of atomic hydrogen were obtained and could be successfully crystallized using excimer laser without a prior dehydrogenation step. $SiN_x$ films showed a good refractive index, a high deposition rate, a moderate breakdown field and a dielectric constant. The Cat-CVD silicon and silicon nitride films can be good candidates for fabricating thin films transistors on plastic substrates to drive active-matrix organic light emitting display.

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DC Magnetron Sputtering of Cr/Cu/Cr Metal Electrodes for AC Plasma Display panel (DC Magnetron Sputtering 법에 의한 AC Plasma Display panel의 Cr/Cu/Cr 금속전극 제조)

  • 남대현;이경우;박종완
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.13 no.8
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    • pp.704-710
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    • 2000
  • Metal electrode materials for plasma display panel should have low electrical resistivity in order to maintain stable gas discharge and have fast response time. They should also hae good film uniformity adhesion and thermal stability. In this study Cr/Cu/Cr metal electrode structure is formed by DC magnetron sputtering. Cr and Cu films were deposited on ITO coated glasses with various DC power density and main pressures as the major parameters. After metal electrodes were formed a heat treatment was followed at 55$0^{\circ}C$ for 20 min in a vacuum furnace. The intrinsic stress of the sputtered Cr film passed a tensile stress maximum decreased and then became compressive with further increasing DC power density. Also with increasing the main pressure stress turned from compression to tension. After heat the treatment the electrical resistivity of the sputtered Cu film of 2${\mu}{\textrm}{m}$ in thickness prepared at 1 motor with the applied power density of 3.70 W/cm$^2$was 2.68 $\mu$$\Omega$.cm With increasing the main pressure the DC magnetron sputtered Cu film became more open structure. The heat treatment decreased the surface roughness of the sputtered Cr/Cu/Cr metal electrodes.

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Effect of Allyl Modified/Silane Modified Multiwalled Carbon Nano Tubes on the Electrical Properties of Unsaturated Polyester Resin Composites

  • Swain, Sarojini;Sharma, Ram Avatar;Patil, Sandip;Bhattacharya, Subhendu;Gadiyaram, Srinivasa Pavan;Chaudhari, Lokesh
    • Transactions on Electrical and Electronic Materials
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    • v.13 no.6
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    • pp.267-272
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    • 2012
  • Considering the properties of the carbon nano tubes (CNT), their inclusion into the polymer matrix vastly increases the properties of the resultant composite. However, this is not the case due to the poor interfacial adhesion of the CNT and the polymer matrix. The present approach focuses on increasing the interaction between the polymer matrix and the CNT through the chemical modification of the CNT resulting in allyl ester functionalized carbon nanotubes (ACNT) and silane functionalized carbon nano tubes (SCNT) which are capable of reacting with the polymer matrix during the curing reaction. The addition of ACNT/SCNT into unsaturated polyester resin (UPR) resulted in the improvement of the electrical properties of resulted nanocomposites in comparison to the CNT. The surface resistivity, volume resistivity, dielectric strength, dry arc resistivity, and the comparative tracking index of the nanocomposites were significantly improved in comparison to CNT. The chemical modification of CNT was confirmed via spectroscopy.

Mechanical and thermal properties of MWCNT-reinforced epoxy nanocomposites by vacuum assisted resin transfer molding

  • Lee, Si-Eun;Cho, Seho;Lee, Young-Seak
    • Carbon letters
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    • v.15 no.1
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    • pp.32-37
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    • 2014
  • Multi-walled carbon nanotube (MWCNT)/epoxy composites are prepared by a vacuum assisted resin transfer molding (VARTM) method. The mechanical properties, fracture surface morphologies, and thermal stabilities of these nanocomposites are evaluated for epoxy resins with various amounts of MWCNTs. Composites consisting of different amounts of MWCNTs displayed an increase of the work of adhesion between the MWCNTs and the matrix, which improved both the tensile and impact strengths of the composites. The tensile and impact strengths of the MWCNT/epoxy composite improved by 59 and 562% with 0.3 phr of MWCNTs, respectively, compared to the epoxy composite without MWCNTs. Thermal stability of the 0.3 phr MWCNT/epoxy composite increased compared to other epoxy composites with MWCNTs. The enhancement of the mechanical and thermal properties of the MWCNT/epoxy nanocomposites is attributed to improved dispersibility and strong interfacial interaction between the MWCNTs and the epoxy in the composites prepared by VARTM.

Mitomycin-C in Endoscopic Dacryocystorhinostomy (비내누낭비강문합술에서 Mitomycin-C의 효과)

  • 김명원;이종환;김은석;이상철;장백암;변영자
    • Korean Journal of Bronchoesophagology
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    • v.4 no.2
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    • pp.188-192
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    • 1998
  • Background and Objectives: The most common cause of the failure of endoscopic dacryocystorhinostomy is closure of the osteotomy site due to granulation or adhesion. We used mitomycin-C, an antineoplastic antibiotic agent, soaking over the osteotomy site to suppress fibrous proliferation and scar formation during the endoscopic dacryocystorhinostomy. Materials and Methods : A total of 20 Patients diagnosed with nasolacrimal duct obstruction were assigned randomly to either a mitomycin-C group or a control group. Endoscopic dacryocystochinostnmy has been used in both groups. In the mitomycin-C group, a piece of merocel soaked with 0.2 mg/ml mitomycin-C was applied to the osteotomy site and then after 30 minutes was removed. Results : All patients in the mitomycin-C group remained symptom free after removal of their silicone tube (100% success), and there were two patients in the control group who had recurrent epiphora (67% success). In the mitomycin-C group, the average surface area of the osteotomy at the end of the sixth postoperative month was 4.1 $\textrm{mm}^2$, whereas that of the control group was 2.5 $\textrm{mm}^2$. Neither serious systemic nor local toxicity were noted in the mitomycin-C group. Conclusion : Intraoperative mitomycin-C may possibly improve success rates over the endoscopic dacryocystorhinostomy procedure.

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Analysis of Properties Multi-Layered TiN/CrN Thin Films Deposited by AIP Method (AIP법으로 증착된 TiN/CrN 다층박막의 특성 분석)

  • Baek, Min-Sook;Yoon, Dong-Joo;Heo, Ki-Bok;Kim, Byung-Il
    • Korean Journal of Materials Research
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    • v.28 no.7
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    • pp.405-410
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    • 2018
  • TiN and CrN thin films are among the most used coatings in machine and tool steels. TiN and CrN are deposited by arc ion plating(AIP) method. The AIP method inhibits the reaction by depositing a hard, protective coating on the material surface. In this study, the characteristics of multi-layer(TiN/CrN/TiN(TCT), CrN/TiN/CrN(CTC)) are investigated. For comparison, TiN with the same thickness as the multilayer is formed as a single layer and analyzed. Thin films formed as multilayers are well stacked. The characteristics of micro hardness and corrosion resistance are better than those of single layer TiN. The TiN/CrN peak is confirmed because both TCT and CTC are formed of the same component(TiN, CrN), and the phase is first grown in the (111) direction, which is the growth direction. However, the adhesion and abrasion resistance of the multilayer films are somewhat lower.

A Stydy on the Wetting of Ceramic Oxides by Molten Metal (용융금속에 의한 Ceramic Oxides에서의 Wetting에 관한 연구)

  • Lee, Seok-Keun;Lim, Eung-Keuk;Kim, Whan
    • Journal of the Korean Ceramic Society
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    • v.20 no.4
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    • pp.289-296
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    • 1983
  • The Wetting of fusion cast $Al_2O_3$ brick and $Al_2O_3 -ZrO_2$ brick by liquid Ag was studied by the sessile drop technique in Ar atmosphere. In this experiment the specimens were photographed per 2$0^{\circ}C$with increasing temperature from 96$0^{\circ}C$ melting point of Ag. And the method of photographing was carried out by shadow technique. The cosine of the contact angle increased linearly with increasing temperature in both systems. And the relation between the cosine of the contact angle and the temperature was Cos$\theta$=1.132+$0.75{\times}10^{-3}T$ for $Al_2O_3$ brick and Cos$\theta$=-1.706+$1.125{\times}10^{-3}T$ for $Al_2O_3 -ZrO_2$ brick In both systems the contact angle decreased as the surface of substrate became smoother. The work of adhesion which was 503.5ergs/$cm^2$ for $Al_2O_3$brick and 393.6 ergs/cm2 for $Al_2O_3 -ZrO_2$ brick at 96$0^{\circ}C$ increased parabolically with increasing temperature in both system.

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The Effect of Dispersant in Slurry on Ru CMP behavior (Slurry내 분산 안정제가 Ru CMP 거동에 미치는 영향)

  • Cho, Byung-Gwun;Kim, In-Kwon;Park, Jin-Goo
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2008.06a
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    • pp.112-112
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    • 2008
  • 최근 Ruthenium (Ru) 은 높은 화학적 안정성, 누설전류에 대한 높은 저항성, 저유전체와의 높은 안정성 등과 같은 특성으로 인해 금속층-유전막-금속층 캐패시터의 하부전극으로 각광받고 있다. 또한 Cu와의 우수한 Adhesion 특성으로 인해 Cu 배선에서의 Cu 확산 방지막으로도 주목받고 있다. 그러나 이렇게 형성된 Ru 하부전극의 각 캐패시터간의 분리와 평탄화를 위해서는 CMP 공정이 도입이 필요하다. 이러한 CMP 공정에 공급되는 Slurry 에는 부식액, pH 적정제, 연마입자 등이 첨가되는데 이때 연마입자가 응집하여 Slurry의 분산 안전성 저하에 영향을 줄수 있다. 이로 인해 응집된 Slurry는 Scratch와 Delamination 과 같은 표면 결함을 유발할 수 있으며, Slurry의 저장 안정성을 저하시켜 Slurry의 물리적 화학적 특성을 변화시킬 수 있다. 그리하여 본 연구에서는 Ru CMP Slurry에서의 Surfactant와 같은 분산 안정제에 따른 Surface tension, Zeta potential, Particle size, Sedimentation의 분석을 통해 Slurry 안정성에 대한 영향을 살펴보았다. 그 결과 pH9 조건의 31ppm Dispersant 농도에서 50%이상의 Sedimentation 상승효과를 얻을 수 있었다. 또한 선택된 Surfactant가 첨가된 Ru CMP Slurry를 제조하여 Ru wafer의 Static etch rate, Passivation film thickness 와 Wettability를 비교해 보았다. 그리고 CMP 공정을 실시하여 Ru의 Removal rate와 TEOS에대한 Selectivity를 측정해 보았다.

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Interface Chemical and Hydrodynamic Aspects of Deinking Process Using Flotation for Waste paper Recycling(II) (부유선별법을 적용한 탈묵공정의 계면화학적 및 수력학적 원리(II) -수력학적 원리를 중심으로-)

  • Sun-Young Park
    • Resources Recycling
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    • v.5 no.4
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    • pp.11-16
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    • 1996
  • In the flotation system for deinking process, the ink partcles musl collidc with the air bubbles for adhesion The probability of bubble-particle collision is largely dependent on the hydrodynamic conditions The main reason for the very small ink particles not to be able to float easily may be tound in the hydrodynamic effects, which make small ink particlcs move following the slreamlines around the bubbles rather than achually collide with bubbles. Also. the low floatabdily of the large and heavy ink particles is due to the gravity force and viscous drag which affect uprising molinn of particles through the liquid. Therefore, it is vely important to control not only the surface chemical conditions but the hydrodynamic conditions in practical floialion system

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