• 한국정보디스플레이학회:학술대회논문집
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• 2008.10a
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• pp.873-878
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• 2008

Doosan Mecatec has developed alignment system for Organic Light-Emitting Diode (OLED) display production using large size substrate. In the present article, The alignment system between the substrate and the mask, which is a core technology for producing the OLED product using the fourth-generation substrate with $730{\times}920mm^2$ or more, will be described by dividing into a substrate loader, a magnet unit, a CCD camera, etc. The substrate loader is optimized through the simulation where the central portion of the substrate droops by about 1.5mm by clamping each of a long side (920mm direction) and a short side (730mm direction) thereof by 6 point and 4 point. A magnet unit using a sheet type of rubber magnet is constituted and a CCD camera model with the specifications capable of minimizing the errors between a clear image and the same image is selected. The system to which an upward evaporation technique of small molecular organic materials will be applied has been developed so that repeatability and position accuracy becomes ${\pm}1{\mu}m$ or less using an UVW type of stage. Also, the vision accuracy of the CCD camera becomes ${\pm}1{\mu}m$ or less and the align process TACT becomes 30sec. or less so that the final alignment accuracy between the substrate and the mask becomes ${\pm}3{\mu}m$ or less. In order to meet an extra-large glass substrate, an evaporation system using an extra-large AMOLED substrate has been developing through a vertical type of an alignment system.

• Journal of the Semiconductor & Display Technology
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• v.5 no.4 s.17
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• pp.35-40
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• 2006

This paper shows that the effect of exposing on the top area and a solution which using a water circulation system. Semiconductor substrate stage is made from Aluminum and is repeated the sequence of exposing (150), turning OFF shutter, taking 30 sec. interval at the top area of stage. So the temperature of substrate temperature rises continuously. On this, we made a waterway at the inner part of the substrate stage and operated a water circulation system. We measured the temperature of a substrate stage surface with a thermocouple attached to the substrate stage. To analyze the top area's temperature, we used Analysis Program ANSYS for analysis and 3D CAD program Solid-Works for modeling.

• Journal of Institute of Control, Robotics and Systems
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• v.14 no.4
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• pp.327-331
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• 2008

An in-line wet etch/cleaning system was established for the research and development in wet etch process as a formation of electrode such as metal or transparent conductive oxide layer. A reverse moving system was equipped in the in-line wet etch/cleaning system for the alternating motion of glass substrate in a wet etch bath of the system. Therefore, it was possible for the glass substrate to be moved back and forth and it was possible to reduce the size of the system by using the reversing moving system. For the effect of the alternating motion of substrate on the etch rate in the in-line wet etch bath, indium tin oxide(ITO) patterns were obtained through wet etch process in the in-line system in which the substrate was moved back and forth. From the CD(critical dimension) skews resulted from the ADI CD and ACI CD of the ITO patterns, it was concluded that the alternating motion of glass substrate are possible to be applied to the mass production of wet etch process.

• 한국정보디스플레이학회:학술대회논문집
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• 2003.07a
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• pp.407-410
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• 2003

We will introduce our new concept deposition system for SMOLED manufacturing in this conference. This system is designed to deposit organic and metal material to downward to overcome the limit of substrate size and process tact time hurdle for OLED mass production, and is organized with organic deposition chamber, substrate pre-cleaning chamber, metal deposition chamber and encapsulation system. These entire process chambers are integrated with linear type substrate transfer system. We also compare our new SMOLED manufacturing system with conventional vacuum deposition systems, and show basic organic thin film property data, organic material deposition property data, and basic device property.

• Journal of Microbiology
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• v.40 no.2
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• pp.125-128
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• 2002

The aerobic respiratory chain of Vibrio alginolyticus possesses two different kinds of NADH oxidase systems, i.e., an $Na^{+}$-dependent NADH oxidase system and an $Na^{+}$-independent NADH oxidase system. When deamino-NADH, which is the only substrate for the $Na^{+}$-dependent NADH oxidase system, was used as a substrate, the maximum activities of $N^{+}$-dependent NADH: quinone oxidoreductase and $Na^{+}$-dependent NADH oxidase were obtained at about 0.06 M and 0.2 M NaCl, respectively. When NADH, which is a substrate for both $Na^{+}$-dependent and $Na^{+}$-independent NADH oxidase systems was used as a substrate, the NADH oxidase activity had a pH optimum at about 8.0. In cGntrastl when deamino-NADH was used as a substrate, the NADH oxidase activity had a pH optimum at about 9.0. On the other handle inside-out membrane vesicles prepared from the wild-type bacterium generated only a very small $\Delta$pH by the NADH oxidase system, whereas inside-out membrane vesicles prepared from Napl, which is a mutant defective in the $Na^{+}$ pump, generated $\Delta$pH to a considerable extent by the NADH oxidase system. On the basis of the results\ulcorner it was concluded that the respiratory chain-linked components of V. atginotyticus affect each other.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.44 no.4
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• pp.32-42
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• 2007

The substrate resistance is modeled to estimate the performance degradation of analog circuits by substrate noise in a $0.35{\mu}m$ twin-well non-epitaxial CMOS process. The substrate resistance model equations are applied to the P+ guard-ring isolation structure and a good match was achieved between measurements and models. The substrate resistance is divided into four types and a semi-empirical model equation is obtained for each type of substrate resistance. The rms(root-mean-square) error of the substrate resistance model is below 10% compared with the measured resistance. To apply this substrate resistance model to the P+ guard ring structure, ADS(Advanced Design System) circuit simulation results are compared with the measurement results using Network Analyzer, and relatively good agreements are obtained between measurements and simulations.

• 한국정보디스플레이학회:학술대회논문집
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• 2008.10a
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• pp.523-525
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• 2008

Inkjet printing is being considered as an alternative to the conventional lithography in the electronic industry. Surface energy control of substrate is a critical issue in controlling the dimension of microstructures by the inkjet printing. This study introduces the surface energy control of ITO substrate for in/q'et printing of PEDOT/PSS.

• Journal of the Semiconductor & Display Technology
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• v.10 no.4
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• pp.113-118
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• 2011

According to the high accuracy of semiconductor equipments, PCB substrate with much thin thickness is required. However, it is very difficult to sustain the PCB substrate without deformation in case of horizontal installation, due to low bending stiffness. In this research, new PCB process equipment with vertical installation has been developed in order to solve the problem of PCB substrate damage during etching process. As the main parts of etching system on PCB substrate, PCB substrate and JIG are analyzed through finite element method and experimental test. Through the analysis results of stress state, we could find the optimal JIG design to make the damage as low as possible.

• Journal of the Microelectronics and Packaging Society
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• v.9 no.3
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• pp.7-12
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• 2002

In the measurement of the RF properties, the LTCC substrate must be considered as a system including various conductor patterning processes. In this paper, the LTCC substrate system is compared with a conventional PCB(Printed Circuit Board) substrate such as FR-4, Duroid and Teflon, etc. The microstrip resonator method is employed for the measurement of the RF properties in the range of DC to 20 GHz. Experimental results show that the ring resonator method is suitable for system loss measurement, and the series gap resonator method for dielectric constant measurement. The process of conductor patterning and its effect on the system loss were also studied.

• Journal of Mechanical Science and Technology
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• v.18 no.4
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• pp.622-629
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• 2004

In this paper, effects of elastic energy of magnetostrictive film on the deflection of a cantilevered film-substrate system are investigated. The total energy including the elastic energy of magnetostrictive film is formulated. And it is minimized to give the curvatures and the position of neutral axis of the cantilevered system. To discuss the effects of the elastic energy of film in a measured system, three magnetostrictive unimorph cantilevers and a bimorph cantilever reported elsewhere are reviewed. It is shown that the assumption, since the thickness of film is much smaller than that of substrate the film elastic energy is negligible, can cause considerable error in evaluating magnetostrictive coefficients. Not the ratio of thicknesses but elastic energies between film and substrate is also shown to play important role in making decision whether the assumption is valid or not.