• Journal of the Semiconductor & Display Technology
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• v.22 no.4
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• pp.142-147
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• 2023

This paper presents a novel design of a differential patch antenna for 60-GHz millimeter-wave applications. The design process of the back-to-back (BTB) patch antenna is based on the conventional single-patch antenna. The initial design of the BTB patch antenna (Type-I) has a patch size of 0.66 × 0.98 mm² and a substrate size of 0.99 × 1.48 mm². It has a gain of 1.83 dBi and an efficiency of 94.4% with an omni-directional radiation pattern. A 0.4 mm-thick high-resistivity silicon (HRS) is employed for the substrate of the BTB patch antenna. The proposed antenna is further analyzed to investigate the effect of substrate size and resistivity. As the substrate resistivity decreases, the gain and efficiency degrade due to the substrate loss. As the substrate (HRS) size decreases approaching the patch size, the resonant frequency increases with a higher gain and efficiency. The BTB patch antenna has optimal performances when the substrate size matches the patch size on the HRS substrate (Type-II). The antenna is redesigned to have a patch size of 0.81 × 1.18 mm² on the HRS substrate in the same size. It has an efficiency of 94.9% and a gain of 1.97 dBi at the resonant frequency of 60 GHz with an omni-directional radiation pattern. Compared to the initial design of the BTB patch antenna (Type-I), the optimal BTB patch antenna (Type-II) has a slightly higher efficiency and gain with a considerable reduction in antenna area by 34.8%.

• Journal of Electrical Engineering and Technology
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• v.10 no.1
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• pp.320-324
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• 2015

Mutual coupling between antenna elements of a linear microstrip patch antenna array positioned along the H-plane including the effect of edge reflections is investigated. Simple formulas are presented for the estimation of the grounded dielectric substrate size with minimum mutual coupling. The substrate sizes calculated by these formulas are in good agreement with those obtained by the full-wave simulation and experimental measurement. The substrate size with minimum mutual coupling is a function of the effective dielectric constant for surface waves and the distance between the antenna centers. The substrate size with minimum mutual coupling decreases as the effective dielectric constant for surface waves on a finite grounded dielectric substrate increases.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.30 no.11 s.254
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• pp.1392-1400
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• 2006

Since the monolithic ceramic substrate was in introduced for automotive catalytic converters, the durability of the substrate has been a continuing requirement to reduce the emission, gas of vehicle. The substrate can occupy a volume as small as 82 $cm^3$ and as large as 8200 $cm^3$ to provide the required substrate for catalytic activity. The long-term durability varies with the size of the substrate from manufacture's point of view. Therefore this study presents that the response surface model using central composite design can explain size effect on the modulus of rupture in a cordierite ceramic monolithic substrate.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.62 no.5
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• pp.657-662
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• 2013

A size-reduced high frequency mixer designed by adopting artificial dielectric substrate is described in this work. The artificial dielectric substrate is composed by stacking the lower substrate in which a lot of metalized via-holes exist, and upper substrate on which microstrip lines are realized. The effective dielectric constant increases due to the inserted lots of via-holes, and this may be applied to size-reduction of high frequency circuits. In this work, in order to present an application example of size-reduction for active high frequency circuits using the artificial dielectric substrate, a 8GHz single gate mixer is miniaturized and measured. It is described that the basic circuit elements for mixers such as hybrid, low pass filter, and matching networks can be replaced by the artificial dielectric substrate for size-reduction. The final mixer has 55% of size compared to the normal one. The measured average conversion gain is around 3dB which is almost similar result as the normal circuit.

• Transactions of the Korean hydrogen and new energy society
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• v.29 no.5
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• pp.434-441
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• 2018

The pore size of nickel (Ni) bottom electrode layer (BEL) for low-temperature solid oxide fuel cells embedded with ultrathin-film electrolyte was controlled by changing the substrate surface morphology and deposition process parameters. For ~150-nm-thick Ni BEL, the upper side of an anodic aluminum oxide (AAO) substrate with ~65-nm-sized pores provided ~1.7 times smaller pore size than the lower side of the AAO substrate. For ~100-nm-thick Ni BEL, the AAO substrate with ~45-nm-sized pores provided ~2.6 times smaller pore size than the AAO substrate with ~95-nm-sized pores, and the deposition pressure of ~4 mTorr provided ~1.3 times smaller pore size than that of ~48 mTorr. On the AAO substrate with ~65-nm-sized pores, the Ni BEL deposited for 400 seconds had ~2 times smaller pore size than the Ni BEL deposited for 100 seconds.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.38-38
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• 2010

Ever since the experimental discovery of graphene exfoiliated from the graphite flakes by Geim et at., this area has drawn a lot of attention for its possible application in IT industry. For the growth of graphene, chemical vapor deposition (CVD) has been widely used to fabricate the large area graphene. The lateral size of this graphene can be easily controlled by the size of the metal substrate though the chemical etching to remove this substrate is somewhat troublesome. Another problem which is hard to avoid is the folding at the grain boundary. We will discuss the origin of the folding first and introduce the way to avoid this folding. To solve this problem, we have used the various types of micro-thin metal foils. The precise control of hydro-carbon and the carrier gas results in the formation of the graphene on top of substrate. The thickness of graphene layers can be controlled with the control of gas flow on top of Cu substrate in contrast to the previously reported self-limiting growth $behavior^1$. Uniformity of this graphene layer has been checked by micro-raman spectroscopy and SEM. The size of grain can be enhanced by thermal treatment or use of other metal substrate. The dependence of grain size on the lattice size of the substrate will be discussed. By selecting the shape of substrate, we can grow various types of graphene. We will introduce the micron size graphene tube and its application.

• Journal of ILASS-Korea
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• v.11 no.2
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• pp.59-68
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• 2006

Experimental results of the metal powder production with internal mixing, internal impinging and the atomizer coupled with substrate design are presented in this paper. In a test with internal mixing atomizer, mean powder size was decreased from $37{\mu}m\;to\;23{\mu}m$ for Pb65Sn35 alloy as the gas-to-melt mass ratio was increased from 0.04 to 0.17. The particle size further reduces to $16.01{\mu}m$ as the orifice area is increased to $24mm^2$. The micrograph of the metal powder indicates that very fine and spherical metal powder has been produced by this process. In a test program using the internal impinging atomizers, the mean particle size of the metal powder was decreased from $22{\mu}m\;to\;12{\mu}m$ as the gas-to-melt-mass ratio increased from 0.05 to 0.22. The test results of an atomizer coupled with a substrate indicates that the deposition rate of the molten spray on the substrate is controlled by the diameter of the substrate, the height of the substrate ring and the distance of the substrate from the outlet of the atomizer. This in rum determines the powder production rate of the spraying processes. Experimental results indicate that the deposition rate of the spray forming material decreases as the distance between the substrate and the atomizer increases. For example, the deposition rate decreases from 48% to 19% as the substrate is placed at a distance from 20cm to 40cm. On the other hand, the metal powder production rate and its particle size increases as the subsrate is placed far away from the atomizer. The production of metal powder with mean particle size as low as $3.13{\mu}m$ has been achieved, a level which is not achievable by the conventional gas atomization processes.

• 한국정보디스플레이학회:학술대회논문집
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• 2001.08a
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• pp.3-8
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• 2001

This paper will review the state of the latest development of AMLCD manufacturing facilities for large Substrate and discuss the future technologies. The trend of the display size enlargement of Note book PC has hauled the enlargement of the mother glass substrate in past 10 years. The enlargement of a substrate size has brought about the productivity improvement of the TFT panel with process innovation as yet. Will this trend be continuing hereafter too? The issues of the processing and facilities related with the large square substrate and mask step reduction will be overviewed and the future processing and facilities will be discussed.

• Journal of the Korean institute of surface engineering
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• v.35 no.3
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• pp.165-171
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• 2002

TiN coating were deposited onto different WC-Co substrates using arc ion plating (AIP) technique. The structure and morphology for the deposited coating were characterized by x-ray diffraction (XRD) and scanning electron microscopy (SEM). The adhesion behavior of the deposited TiN coating was investigated with a conventional scratch test. Effects of WC particle size and Co content on the adhesion strength between the deposited TiN coating and substrate were studied. During the scratch test, the value of critical load was dependent of WC particle size and Co content on substrate. As the WC particle size and Co content on substrate decreased, the critical load increased. The highest critical load, approximately 110N, was obtained at WC particle size of 1$\mu\textrm{m}$ and Co content of 10wt.%.

• Advances in materials Research
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• v.9 no.1
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• pp.33-48
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• 2020

With the use of differential quadrature method (DQM), forced vibrations and resonance frequency analysis of functionally graded (FG) nano-size beams rested on elastic substrate have been studied utilizing a shear deformation refined beam theory which contains shear deformations influence needless of any correction coefficient. The nano-size beam is exposed to uniformly-type dynamical loads having partial length. The two parameters elastic substrate is consist of linear springs as well as shear coefficient. Gradation of each material property for nano-size beam has been defined in the context of Mori-Tanaka scheme. Governing equations for embedded refined FG nano-size beams exposed to dynamical load have been achieved by utilizing Eringen's nonlocal differential law and Hamilton's rule. Derived equations have solved via DQM based on simply supported-simply supported edge condition. It will be shown that forced vibrations properties and resonance frequency of embedded FG nano-size beam are prominently affected by material gradation, nonlocal field, substrate coefficients and load factors.