• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.11 no.9
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• pp.711-717
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• 1998

BST(70/30) and BST(50/50) thin films were prepared by Sol-Gel method and studied about the microstructural and dielectric properties with Pt and ITO bottom electrodes. The stock solution was synthesized and spin coated on the Pt/Ti$SiO_2$/Si and Indium Tin Oxide(ITO)/ glass substrate. the coated films were dries at 350$^{\circ}C$ for 10 minutes and annealed at $750^{\circ}C$ for 1 hour for the crystallization. The thin films coated on ITO substrate were crystallized easily and the packing density and roughness of surface were better that those of films coated on Pt substrates. In the BST(50/50) composition the structural properties were similar to the BST(70/30) composition and grain size were decreased with increasing the contents of Sr. The dielectric constant was higher in the BST(50/50) composition compared with the BST(70/30) composition. Using the ITO substrate, the dielectric constant was higher than the Pt substrate while the dielectric loss was showed a reverse trend. The dielectric constant with and increase of temperature was decreased slowly.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.39 no.4
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• pp.19-25
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• 2002

In this paper, to improve the characteristics of a transmission line on silicon substrate, we fabricated air-bridge interconnected CPW transmission line on a 10-${\mu}{\textrm}{m}$-thick oxidized porous silicon(OPS) substrate using surface micromachining. Air-bridge interconnected CPW of S-W-S = 30-80-30 ${\mu}{\textrm}{m}$has insertion loss of -0.25 ㏈ and return loss of -28.9 ㏈ at 4㎓ And return loss of CPW with stepped compensated air-bridge(S-W-S : 30-100-30 ${\mu}{\textrm}{m}$) is improved -0.98㏈ at 4㎓. The results indicate that the thick OPS provides an approach to incorporate high performance, low cost microwave and millimeter wave circuits in a high-resistivity silicon-based process.

• Journal of Sensor Science and Technology
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• v.24 no.4
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• pp.264-269
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• 2015

An infrared (IR) bolometer measures the change of resistance by absorbing incident IR radiation and generates a signal as a function of the radiation intensity. Since a bolometer requires temperature stabilization and light filtering except for the infrared rays, it is essential for the device to be packaged meeting conditions that above mentioned. Minimization of heat loss is needed in order to stabilize temperature of bolometer. Heat loss by conduction or convection requires a medium, so the heat loss will be minimized if the medium is a vacuum. Therefore, vacuum packaging for bolometer is necessary. Another important element in bolometer packaging is germanium (Ge) window, which transmits IR radiation to heat the bolometer. To ensure a complete transmittance of IR light, anti-reflection (AR) coatings are deposited on both sides of the window. Although the transmittance of Ge window is high for IR rays, it is difficult to use frequently in low-price IR bolometer because of its high price. In this paper, we fabricated IR window by utilizing silicon (Si) substrate instead of Ge in order to reduce the cost of bolometer packaging. To enhance the IR transmittance through Si substrate, it is textured using Reactive Ion Etching (RIE). The texturing process of Si substrate is performed along with the change of experimental conditions such as gas ratio, pressure, etching time and RF power.

• Journal of the Semiconductor & Display Technology
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• v.22 no.4
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• pp.142-147
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• 2023

This paper presents a novel design of a differential patch antenna for 60-GHz millimeter-wave applications. The design process of the back-to-back (BTB) patch antenna is based on the conventional single-patch antenna. The initial design of the BTB patch antenna (Type-I) has a patch size of 0.66 × 0.98 mm² and a substrate size of 0.99 × 1.48 mm². It has a gain of 1.83 dBi and an efficiency of 94.4% with an omni-directional radiation pattern. A 0.4 mm-thick high-resistivity silicon (HRS) is employed for the substrate of the BTB patch antenna. The proposed antenna is further analyzed to investigate the effect of substrate size and resistivity. As the substrate resistivity decreases, the gain and efficiency degrade due to the substrate loss. As the substrate (HRS) size decreases approaching the patch size, the resonant frequency increases with a higher gain and efficiency. The BTB patch antenna has optimal performances when the substrate size matches the patch size on the HRS substrate (Type-II). The antenna is redesigned to have a patch size of 0.81 × 1.18 mm² on the HRS substrate in the same size. It has an efficiency of 94.9% and a gain of 1.97 dBi at the resonant frequency of 60 GHz with an omni-directional radiation pattern. Compared to the initial design of the BTB patch antenna (Type-I), the optimal BTB patch antenna (Type-II) has a slightly higher efficiency and gain with a considerable reduction in antenna area by 34.8%.

• Textile Coloration and Finishing
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• v.18 no.6 s.91
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• pp.25-30
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• 2006

Degumming is an essential process to improve the luster and smoothness of the silk filament. Silk varieties were degummed using different methods. A number of methods, from pad-steam to specific alkaline are being used for this propose. In this paper an attempt to compare the efficiencies of different degumming processes has been made. from the results, it may be observed that when silk fabrics were pad-steam, the degree of degumming, as assessed by weight loss. When the pad-steam degumming was carried out at different pHs, adjusted using alkalies, it was observed that at higher pH the weight loss is high. Pad-steam degumming as well as star degumming was found to be superior with minimum damage to the substrate. Among the alkalis used, the sodium carbonate gives the best results, since the weight loss is almost maximum with lower strength loss by over degumming. It is also efficient from the point of view of conservation of heat energy and time as against the comparable star degumming.

• Proceedings of the KIEE Conference
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• summer
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• pp.1010-1012
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• 2004

AC loss is an important factor in the development of superconducting tapes and superconducting power applications. In this paper we measured and compared characteristics of BSCCO tape and YBCO Coated Conductor(YBCO CC). BSCCO tape was fabricated by PIT method. We measured critical current density and transport current loss of it. Also, YBCO CC tape consist of substrate. buffer, YBCO and metal layers. We measured critical current density on variations of external magnetic field and transport current loss of these cases. The results of measurement show that normalized critical current of YBCO CC is smaller then that of BSCCO tape in the external magnet field. According to the results. measured loss and calculated of the YBCO CC show the same tendency.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.41 no.8
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• pp.37-44
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• 2004

This paper describes a new GaAs-based surface-micromachined microstrip line supported by dielectric post and air-gapped signal line with ground metal. This new type of dielectric-supported air-gapped microstripline(DAML) structure is developed using surface micromachining techniques to provide easy means of airbridge connection between the signal lines and to archive low losses at millimeter-wave frequency band with wide impedance range. Each DAMLs with the length of 5 mm are fabricated and the measured characteristics are compared with those of the conventional microstrip transmission line. These transmission lines are composed of 10 ${\mu}{\textrm}{m}$ height of signal line, post size of 10 ${\mu}{\textrm}{m}$ ${\times}$ 10 ${\mu}{\textrm}{m}$ and post height of 9 ${\mu}{\textrm}{m}$. By elevating the signal lines from the substrate using the micromachining technology, the substrate dielectric loss can be reduced Compared with of the conventional microstrip transmission line showing 7.5 dB/cm loss at 50 GHz, the loss can be reduced to 1.1 dB/cm loss at 50 GHz.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.24 no.3
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• pp.259-269
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• 2013

In this paper, we propose an SIW(Substrate Integrated Waveguide) multi-section E-plane transformer using air-holes for an SIW system with variable thicknesses. Air-holes are inserted into a SIW E-plane quarter wavelength transformer for matching an E-plane impedance discontinuity. A PSIW(Punched Substrate Integrated Waveguide) consisted of air-holes has an SIW characteristic impedance tunability because of reducing a equivalent shunt capacitance of the SIW. And, a PSIW multi-section E-plane transformer is implemented for improving a matching bandwidth by using the Chebyshev polynomial. The measurement results of PSIW double-section E-plane transformer show that the insertion loss($S_{21}$) is $1.57{\pm}0.11$ dB and input return loss($S_{11}$) is more than 15 dB from 11.45 GHz to 13.6 GHz.

• Journal of the Korean Ceramic Society
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• v.52 no.6
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• pp.429-434
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• 2015

This study investigates the macroscopic wear behaviors of C/C and C/C-SiC composites coated with hafnium carbide (HfC). To improve the wear resistance of C/C composites, low-pressure chemical vapor deposition (LPCVD) was used to obtain HfC coating. The CVD coatings were deposited at various deposition temperatures of 1300, 1400, and $1500^{\circ}C$. The effect of the substrate material (the C/C substrate, the C/C-CVR substrate, or the C/C-SiC substrate deposited by LSI) was also studied to improve the wear resistance. The experiment used the ball-on-disk method, with a tungsten carbide (WC) ball utilized as an indenter to evaluate the wear behavior. The HfC coatings were found to effectively improve the wear resistance of C/C and C/C-SiC composites, compared with the case of a non-coated C/C composite. The former showed lower friction coefficients and almost no wear loss during the wear test because of the presence of hard coatings. The wear scar width was relatively narrower for the C/C and C/C-SiC composites with hafnium coatings. Wear behavior was found to critically depend on the deposition temperature and the material. Thus, the HfC-coated C/C-SiC composites fabricated at deposition temperatures of $1500^{\circ}C$ showed the best wear resistance, a lower friction coefficient, and almost no loss during the wear test.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.24 no.5
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• pp.508-514
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• 2013

Substrate integrated waveguide(SIW) constructed by two metal planes and conductive vias in a dielectric substrate, have all the conductors connected each other and hence, cannot be biased by DC sources. We propose a new folded corrugated substrate integrated waveguide(FCSIW) that can be DC-biased. Since the proposed FCSIW replaces the SIW conducting vias by folded open subs, it can supply the DC sources. The FCSIW has better transmission characteristics and 30 % less width than the common corrugated substrate integrated waveguide(CSIW) having a serious leakage generation problem. The FCSIW shows better insertion loss(1.49 dB) compared with that(3.08 dB) of the CSIW measured for 154 mm length devices and averaged at 9~15 GHz frequency band. No leakage has been observed from crosstalk measurements of the FCSIW.