• Proceedings of the KIEE Conference
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• 1999.11a
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• pp.31-34
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• 1999

In the present study, we fabricated stoichiometric $(Ba_{1-x}Sr_x)TiO_3$ thin films at various substrate temperature and contents using of magnetron sputtering method on optimized Pt-based electrodes (Pt/TiN/$SiO_2$/Si). The substate temperature deposited at 200[ $^{\circ}C$], 400[$^{\circ}C$] and 600[$^{\circ}C$] and crystalline BST thin films show above 400[$^{\circ}C$]. Also, the composition of $(Ba_{1-x}Sr_x)TiO_3$ thin films deposited on Si wafer substrate at 400[$^{\circ}C$] were closed to stoichiometry($1.015{\sim}1.093$ in A/B ratio), but compositional deviation from a stoichiometry is larger as $SrCO_3$ is added. The drastic decrease of dielectric constant and increase of dielectric loss in $(Ba_{1-x}Sr_x)TiO_3$thin films is observed above 100[kHz]. V-I characteristics of $(Ba_{1-x}Sr_x)TiO_3$ thin films show the decrease of leakage current with the increase of $SrCO_3$ contents.

• Journal of the Korean Vacuum Society
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• v.8 no.4B
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• pp.524-529
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• 1999

We deposited diamond phase carbon thin films on Si substrate by the electrolysis of methanol solution. A little amount of ammonia solution was added to increase the current density of the electrolyte. We analyzed films by XRD and SEM. The chemical change of electrolyte during the electrolysis process was characterized by FTIR. We obtained better quality diamond phase carbon films at a lower applying boltage(300V) and temperature ($40^{\circ}C$) by adding ammonia solution to methanol electrolyte. Diamond (111), (220), (311) peaks were shown distinctively in XRD graph. Addition of ammonia solution resulted in lowering the applying bias voltage to 300V and the substrate temperature to $40^{\circ}C$ still maintaining a high current density at 80mA/$\textrm{cm}^2$, which prohibited a great loss of solution from vaporization. Possible change of chemical reaction due to the addition of ammonia solution was also discussed.

• Journal of the Institute of Electronics Engineers of Korea TC
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• v.39 no.2
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• pp.81-91
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• 2002

In this paper, a high-quality integrated transformer using bondwires is proposed and fabricated. The bondwire transformer inherently has low conductor loss due to wide cross-section and small parasitic capacitance because the vertical placement of the bondwire loop separates from substrate and effectively reduces the substrate effects. It can be fabricated easily by used of the modern automatic wirebonding technology. The electrical characteristics of the fabricated transformers are compared with those of the spiral transformer It is expected that the bondwire transformer can improve the performance for RFIC and MMIC applied to a variety of application, for example, Mixer, Balanced Amplifier, VCO, and LNA.

• Nuclear Engineering and Technology
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• v.52 no.7
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• pp.1503-1510
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• 2020

Ultra-low noise charge sensitive amplifiers (CSAs) based on various types of circuit board substrates, such as FR4, Teflon, and ceramics (Al₂O₃) with two different designs, PA1 and PA2, have been developed. They were tested to see the noise effect from the dielectric loss of the substrate capacitance before and after irradiation. If the electronic noise from the CSAs is to be minimized and the energy resolution enhanced, the shaping time has to be optimized for the detector, and a small feedback capacitance of the CSA is favorable for a better SNR. Teflon- and ceramic-based PA1 design CSAs showed better noise performance than the FR4-based one, but the Teflon-based PA1 design showed better sensitivity than ceramic based one at a low detector capacitance (<10 pF). In the PA2 design, the equivalent noise and the sensitivity were 0.52 keV FWHM for a silicon detector and 7.2 mV/fC, respectively, with 2 ㎲ peaking time and 0.1 pF detector capacitance. After 10, 100, 10³, 10⁴, and 10⁵ Gy irradiation the ENC and sensitivity characteristics of the developed CSAs based on three different substrate materials are also discussed.

• Journal of the Korean Institute of Telematics and Electronics D
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• v.35D no.4
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• pp.93-100
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• 1998

Pyoelectric infrared detectors based on La-modified PbTiO3 (PLT) thin films have been fabricated by RF magnetron sputtering and micromachining technology. The detectors form Pb$_{1-x}$ La$_{x}$Ti$_{1-x}$ O$_{3}$ (x=0.05) thin film ferroelectric capacitors epitaxially grown by RF magnetron sputtering on Pt/MgO (100) substrate. The sputtered PLT thin film exhibits highly c-axis oriented crystal struture that no poling trealization for sensing applications is required. This is an essential factor to increase the yield for realization of an infrared image sensor. Micromachining technology is used to lower the thermal mass of the detector by giving maximum sensor efficiency. Polyimide is coated on top of the sensing elements to support the fragile structure and the backside of the MgO substrate is selectively eteched to reduce the heat loss. The sensing element exhibited a very high detectivity D* of 8.5*10$^{8}$ cm..root.Hz/W at room temperature and it is about 100 times higher than the case of micromachining technology is not used. a sensing system that detects the position as well as the existence of a human body is realized using the array sensor.sor.

• The Journal of the Korea institute of electronic communication sciences
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• v.10 no.7
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• pp.763-768
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• 2015

In this paper, a microstrip patch antenna with arrow and ribbon shape for WLAN was designed and manufactured. The antenna was designed on a FR-4 substrate that has a thickness of 0.8mm and a dielectric constant of 4.4. The substrate size is $50{\times}40mm^2$. A commercially available tool was used for simulation to get the optimized parameters and the optimized values were obtained by finding the parameters that act sensitively to the performance of the antenna. The proposed antenna was produced using the optimized values, and characteristics of return loss, gain and radiation pattern in WLAN bands were measured.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.11b
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• pp.455-458
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• 2001

The thin films of high pemitivity in ferroelectric materials using a capacitor are applied to DRAMs and FRAMs. (Ba, Sr)$TiO_3$ thin films as ferroelectric materials were prepared by the sol-gel method and made by spin-coating on the Pt/Ti/$SiO_2/Si$ substrate at 4,000 [rpm] for 10 seconds. The devices of BST thin films to composite $(Ba_{0.7},Sr_{0.3})TiO_3$ were fabricated by changing of the depositing layer number on $Pt/Ti/SiO_2/Si$ substrate. The thin film capacitor to be ferroelectric devices was investigated by structural and electrical properties. The thickness of BST thin films at each coating numbers 3, 4 and 5 times was $2500[\AA]$, $3500[\AA]$, $3800[\AA]$. The dielectric factor of thin film when the coating numbers were 3, 4 and 5 times was 190, 400 and 460 on frequency l[MHz]. The dielectric loss of BST thin film was linearly increased by increasing of the specimen area.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.52 no.8
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• pp.319-324
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• 2003

AIN thin films are deposited on Si (100) and $SiO_2$/Si substrates by using an RF magnetron sputtering method and by changing the conditions of deposition variables, such as RF power, $N_2$/Ar flow ratio, and substrate temperature ($T_sub$). For all the deposited AIN films, XRD Peak patterns are monitored to examine the effect of deposition condition on the crystal orientation. Highly (002)-oriented AIN films are obtained at following nominal deposition conditions; RF Power : 350W, $N_2$/Ar ratio = 10/20, T$_{sub}$ : $250^{\circ}C$, and working pressure = 5mTorr, respectively. AIN-based SAW devices are fabricated using a lift-off method by varying the thickness of AIN layer. Insertion losses and side-lobe rejection levels of fabricated SAW devices are extracted from their frequency response characteristics, which are also compared in terms of AIN thickness and substrate. Relationships between the film properties of AIN films and the frequency responses of SAW devices are discussed. It is concluded from the experimental results that the (002)-preferred orientation as well as the surface roughness of AIN film may play a crucial role of determining the device performances of AIN-SAW devices.s.

• Journal of the Microelectronics and Packaging Society
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• v.8 no.3
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• pp.69-75
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• 2001

Photoimageable thick film technology is a new technology in that the lithography process such as exposure and development is applied to the conventional thick film process. Line resolution of 25 $\mu\textrm{m}$ width and 25 $\mu\textrm{m}$ space could be obtained by laminating green sheet, printing photoimageable Ag paste, exposing the test patterns, developing, and co-firing. In case of using the alumina substrate, 20 $\mu\textrm{m}$ fine line could be also obtained by similar process. Test results showed that exposing power density and developing time were the most important processing parameters for the fine line formation. Microstrip and series gap resonators with well-defined line morphology and good transmission characteristics in high frequency were formed by this new technology, and thereby dielectric constant and loss of test substrate were calculated.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2015.10a
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• pp.65-67
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• 2015

In this paper, small WLAN antenna was designed and investigated. Proposed antenna was configured for microstrip patch antenna ($29mm{\times}29mm$) that was mounted on RF4 dielectric substrate (relative permittivity 4.4, thick 1.6mm, tangent loss 0.025) with $45mm{\times}45mm$. In order to obtain a wide band characteristic, the cutting process was 3.2mm diagonal corners of the patch antenna located on the top of the substrate. Antenna feeding position for 50 ohm impedance matching was decided to be 5.1mm at the central axis in the horizontal direction. As a result, frequency bandwidth satisfying the condition of VSWR<2dB was 2.365-2.45GHz (85MHz, 3.53%) for considering WLAN.