• 한국세라믹학회지
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• 제39권11호
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• pp.1011-1016
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• 2002

Colloidal particles of silica (100 nm in size) were electrostatically dispersed and adsorbed on a glass substrate coated with silica sol or alumina sol. Stability of the suspensions and microstructure of the adsorbed particle layers were discussed in terms of total potential energies between the particles and the substrate. Well-dispersed suspension resulted in a layer with densely packed and regularly arranged particles, whereas less stable suspension resulted in a porous layer with loosely packed and irregularly arranged particles. Despite repulsive interactions between the particles and the substrate coated with silica sol, the observed adsorption can be attributed to chemical bonds formed at the interface between the particle and silica sol. In contrast, the adsorption of the particles on the substrate coated with alumina sol formed a layer with strongly adhered and densely packed particles, due to large attractive interactions between the particles and alumina sol.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1991년도 추계학술대회 논문집
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• pp.12-16
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• 1991

Cadmium sulphide films with thickness of 0.6∼1.2$\mu\textrm{m}$ were deposited onto corning 7059 glass substrate under a vacuum of 5${\times}$10$\^$-6/ Torr. Source and substrate temperature ranges used were 800∼1100$^{\circ}C$ and 100∼200$^{\circ}C$, respectively. The microstructures and semiconducting properties of the films were studied using X-ray diffraction, UV-VIS-IR spectrophotometer and Hall measurement unit. Electrical resistivity and optical transmission of the CdS films decrease with an increase in source temperature while they increase with an increase in substrate temperature. The resistivity of the film evaporated at 1100$^{\circ}C$ varied from 7${\times}$10$^3$ohm-cm at the substrate temperature of 100$^{\circ}C$ to 2${\times}$10$\_$6/ohm-cm at 190$^{\circ}C$. All the films had hexagonal structure and strong texture with c-axis of grains normal to the substrate glass.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 춘계학술대회 논문집 디스플레이 광소자분야
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• pp.81-83
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• 2003

We have investigated the generation of pretilt angle for a nematic liquid crystal (NLC) alignment with rubbing alignment method on polyimide surfaces using thin plastic substrates. It was found that monodomain alignment of LNC is obtained with rubbing alignment method on polyimide surfaces using thin plastic substrates. The generated NLC pretilt angles are about $3^{\circ}$ by the rubbing alignment method on thin plastic substrates, However, the pretilt angle measured at about $1.7^{\circ}$ lower on the glass substrate than by thin plastic substrate. It is considered that this alignment may be attributed to roughness of micro groove substrate. The tilt angle increases with increasing baking temperature for making polyimide layer using glass substrate. It was concluded that pretilt angle in the polyimide surface is attributable to the increasing of imide rato.

• 마이크로전자및패키징학회지
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• 제6권1호
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• pp.51-58
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• 1999

지르코니아에 접합과 반응성이 정합되며 고온에서 물리화학적으로 안정성을 갖는 접합재를 제조하기 위하여 silicate계 유리의 조성에 따른 적심특성, 결정화 및 반응성등 제반 특성을 고찰하였다. 지르코니아와의 열팽창계수가 정합 될 수 있는 유리계에 대한 조성 실험하였다. Alkaline earth silicate 유리는 적심성이 우수하였으며 적심각이 낮으며 $B_2O_3$의 첨가함로써 유리의 점도를 조절 및 결정화를 억제할 수가 있었다. $900^{\circ}C$ 이하에서 적심공정에 일어났으며 $800^{\circ}C$에서 10시간동안 유지한 후에 결정화와 계면 반응을 조사한 결과 기공이 많이 발생하였으며 $B_2O_3$를 15mo1% 첨가한 경우 흐름성이 증가하였으며 기판과의 반응성이 높아졌다. 기공을 없애기 위해서는 공정변수를 조절하여 유리의 소결을 촉진할 필요가 있으며 유리점도와 반응성에 관한 최적화가 요구된다. 본 연구에서는 유리-세라믹필러 복합체의 고온적심성에 대하여 조사하였다. Filler로서 $ZrO_2$분말을 여러 조건으로 열처리하여 분말종류와 첨가량에 따라 기공, $ZrO_2$ filler의 형상 및 계면반응 등을 고찰하였다.

• 한국광학회지
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• 제35권1호
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• pp.1-8
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• 2024

유리기층에 코팅되어 있는 박막의 광학상수를 정확하게 분석하기 위해, 반투명 기층 위에 다층박막이 코팅되어 있는 시료의 유사 투과타원 상수 표현과 투과율 표현을 구체적으로 제시하였다. 두꺼운 기층에서 일어나는 다중반사로 인한 빛의 세기를 결맞지 않도록 중첩하는 동시에, 반투명 기층의 광흡수 영역에서 기층의 흡수를 정확하게 반영함으로써 다층박막이 코팅된 반투명 기층 시료의 정확한 모델링 분석이 가능하게 하였다. 흡광도가 매우 낮은 파장대역에서 투과율 측정에 기반한 분석과 타원법에 기반한 모델링 분석 방법이 가지는 박막의 소광계수의 차이를 투과율의 민감도와 타원상수의 민감도 분석을 통하여 비교 분석하였다. 투과율 분석법과 반사 타원법을 SiN 박막이 코팅된 유리기층 시료에 적용함으로써 소광계수가 매우 작을 때에도 SiN 박막의 복소굴절률과 두께를 정확하게 결정할 수 있음을 보였다.

• 한국전기전자재료학회논문지
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• 제22권11호
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• pp.961-968
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• 2009

In this work, transparent conductive oxide(TCO) films such as $In_2O_3-SnO_2$(ITO) and $In_2O_3-ZnO$(IZO) were prepared on polyethylene naphthalene(PEN) and glass substrates by using rf-magnetron sputtering system. The TCO films deposited on PEN substrate show very poor conductivity as compared to that of the TCO films deposited on glass substrates. From the results of the residual gas analysis(RGA) test, this poor stability of plastic substrate is presumed to be caused by the deteriorated adhesion between the TCO films and the plastic substrate due to outgassing from the plastic substrate during deposition of TCO films. From our experiment, it is found that the vaporization of some defects in the plastic substrates deteriorate the adhesion of the TCO films to the plastic substrate, because the most plastic substrates containing the water vapor and/or other adsorbed particles such as organic solvents. Mixing of these gases vaporized in the sputtering process will also affect the electrical property of the deposited TCO films. Inorganic thin composite $(SiO_2)_{40}(ZnO)_{60}$ film as a gas barrier layer is coated on the PEN substrate to protecting the diffusion of vapors from the substrate, so that the TCO films with an improved quality can be obtained.

• 한국세라믹학회지
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• 제46권3호
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• pp.313-316
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• 2009

A zinc borosilicate glass having a low softening temperature of $490^{\circ}C$ has been investigated as a protective layer for Ag patterns against chemical reactions with a $I^-/I_3^-$ electrolyte in dye-sensitized solar cells (DSSCs). A thick glass layer was prepared by the typical screen printing and firing processes to obtain a final thickness of ${\sim}5{\mu}m$. The chemical leaching performance of the glass layer in the electrolyte revealed that the reactive Ag pattern can be significantly protected by utilizing the low softening protective layer. The electrical resistance of the FTO-coated glass substrate was effectively maintained at a low value of ${\sim}27{\Omega}$ as long as the glass layer was well densified at a sufficiently high temperature of ${\sim}520^{\circ}C$. The transmittance of the layer was near 60%, depending on the firing temperature of the glass layer.

• 한국결정성장학회지
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• 제9권6호
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• pp.606-611
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• 1999

Kaolin으로부터 합성한 mullite에 brosilicate계 유리를 혼합하여 기판재료로 적합한 저유전성 Mullite/Glass 복합체를 제조하였다. 유리를 첨가함으로써 액상소결에 의한 Cu, Au, Ag-Pd 등의 배선 사용이 가능한 저온에서 치밀한 소결체를 얻을수 있었다. 기판의 물성저하의 원이 되는 유리의 결정화는 나타나지 않았다. 소결온도 950~$1100^{\circ}C$의 범위에서 유리 50 wt%의 조성의 복합체에서 유전상수 약 5.2~5.4 (at 1 MHz), 열팽창을 5.3~$5.7{\times}10^{-6}{\cdot}^0C^{-1}$, , 꺾임강도 130 MPa로 high-performed substrate로서 적합한 특성을 나타내었다.

• 한국표면공학회지
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• 제46권4호
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• pp.162-167
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• 2013

Encapsulation is required since organic materials used in OLED devices are fragile to water vapor and oxygen. Laser sealing method is currently used where IR laser is scanned along the glass-frit coated lines. Laser method is, however, not suitable to encapsulating large-sized glass substrate due to the nature of sequential scanning. In this work we propose a new method of encapsulation using Joule heating. Conductive layer is patterned along the sealing lines on which the glass frit is screen printed and sintered. Electric field is then applied to the conductive layer resulting in bonding both the panel glass and the encapsulation glass by melting glass-frit. In order to obtain uniform bonding the temperature of a conductive layer having a shape of closed loop should be uniform. In this work we conducted simulation for heat distribution according to the structure of a conductive layer used as a Joule-heat source. Uniform temperature was obtained with an error of 5% by optimizing the structure of a conductive layer. Based on the results of thermal simulations we concluded that Joule-heating induced encapsulation would be a good candidate for encapsulation method especially for large area glass substrate.

• 한국전기전자재료학회논문지
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• 제28권9호
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• pp.571-576
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• 2015

In this study, we developed a lead-free $P_2O_5-V_2O_5-ZnO$ glass frit for sealing OLED using laser irradiation. The frit satisfied the characteristics required for laser sealing such as low glass transition temperature, low coefficient of thermal expansion (CTE), high water-resistance, and high absorption at the wavelength of the laser beam. Ceramic fillers were added to the glass frit in order to further reduce and match its CTE with that of the commercial glass substrate. The addition of Zirconium Tungsten Phosphate (ZWP) to the frit yielded the most desirable results, reducing the CTE to $45.4{\times}10^{-7}/^{\circ}C$, which is very close to that of the glass substrate ($44.0{\times}10^{-7}/^{\circ}C$). Successful formation of a solid sealing layer was observed by optical and scanning electron microscopy.