• Journal of the Korean Ceramic Society
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• v.39 no.11
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• pp.1011-1016
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• 2002

Colloidal particles of silica (100 nm in size) were electrostatically dispersed and adsorbed on a glass substrate coated with silica sol or alumina sol. Stability of the suspensions and microstructure of the adsorbed particle layers were discussed in terms of total potential energies between the particles and the substrate. Well-dispersed suspension resulted in a layer with densely packed and regularly arranged particles, whereas less stable suspension resulted in a porous layer with loosely packed and irregularly arranged particles. Despite repulsive interactions between the particles and the substrate coated with silica sol, the observed adsorption can be attributed to chemical bonds formed at the interface between the particle and silica sol. In contrast, the adsorption of the particles on the substrate coated with alumina sol formed a layer with strongly adhered and densely packed particles, due to large attractive interactions between the particles and alumina sol.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1991.10a
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• pp.12-16
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• 1991

Cadmium sulphide films with thickness of 0.6∼1.2$\mu\textrm{m}$ were deposited onto corning 7059 glass substrate under a vacuum of 5${\times}$10$\^$-6/ Torr. Source and substrate temperature ranges used were 800∼1100$^{\circ}C$ and 100∼200$^{\circ}C$, respectively. The microstructures and semiconducting properties of the films were studied using X-ray diffraction, UV-VIS-IR spectrophotometer and Hall measurement unit. Electrical resistivity and optical transmission of the CdS films decrease with an increase in source temperature while they increase with an increase in substrate temperature. The resistivity of the film evaporated at 1100$^{\circ}C$ varied from 7${\times}$10$^3$ohm-cm at the substrate temperature of 100$^{\circ}C$ to 2${\times}$10$\_$6/ohm-cm at 190$^{\circ}C$. All the films had hexagonal structure and strong texture with c-axis of grains normal to the substrate glass.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.04a
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• pp.81-83
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• 2003

We have investigated the generation of pretilt angle for a nematic liquid crystal (NLC) alignment with rubbing alignment method on polyimide surfaces using thin plastic substrates. It was found that monodomain alignment of LNC is obtained with rubbing alignment method on polyimide surfaces using thin plastic substrates. The generated NLC pretilt angles are about $3^{\circ}$ by the rubbing alignment method on thin plastic substrates, However, the pretilt angle measured at about $1.7^{\circ}$ lower on the glass substrate than by thin plastic substrate. It is considered that this alignment may be attributed to roughness of micro groove substrate. The tilt angle increases with increasing baking temperature for making polyimide layer using glass substrate. It was concluded that pretilt angle in the polyimide surface is attributable to the increasing of imide rato.

• Journal of the Microelectronics and Packaging Society
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• v.6 no.1
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• pp.51-58
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• 1999

The effects of glass composition on the wettability and reactivity with $ZrO_2$substrate was evaluated and fabrication variables and glass compositions was investigated. Various glass compositions was investigated. Alkaline earth silicate glass show good wettability and lower viscosity and crystallization of glass could be prevented by $B_2O_3$.The sealant glass begin to wet on $ZrO_2$substrate below $900^{\circ}C$ and porosity occurred in various glass compositions, the crystallization and porosity in the glass could be prevented by the addition of flux into glass composition. But flowability and reactivity of glass with $ZrO_2$substrate was enhanced. Processing variables should be optimized to reduce the porosity by enhancing the sintering of glass powder. Many silicate glasses were investigated for the applications of high temperature sealants. Wetting and bonding of glass was good enough to seal together between $ZrO_2$and other ceramic components of SOFC. But porosity and reaction layer were occurred in the sealant glass. It will be possible to produce glass sealant without porosity and reaction layer at the interface by optimization of processing variable and modify the glass compositions. In present study, wettability of glass-filler composite was investigated. The porosity, shape of filler and interfacial reactions of sealant glass with fillers were examined.

• Korean Journal of Optics and Photonics
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• v.35 no.1
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• pp.1-8
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• 2024

Explicit expressions for the transmission pseudo-ellipsometric constants and transmittance of a semi-transparent glass substrate coated with thin films are presented to determine the optical constants of a very weakly absorbing thin film coated on a glass substrate. The intensity of the multiply reflected light inside the semi-transparent substrate is superposed incoherently and the light absorption by the substrate is properly treated, so that modeling analysis of thin films coated on a semi-transparent substrate can be performed with increased accuracy. The extinction coefficient derived from transmittance analysis is compared to that from ellipsometric analysis in the weakly absorbing region, and the difference between the two extinction coefficients is discussed in relation to the sensitivities of the transmittance and ellipsometric constants. This transmittance analysis, together with ellipsometric analysis, is applied to a glass substrate coated with a SiN thin film, and it is shown that the thickness and complex refractive index of the SiN thin film can be determined accurately, even though the extinction coefficient is very small.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.22 no.11
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• pp.961-968
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• 2009

In this work, transparent conductive oxide(TCO) films such as $In_2O_3-SnO_2$(ITO) and $In_2O_3-ZnO$(IZO) were prepared on polyethylene naphthalene(PEN) and glass substrates by using rf-magnetron sputtering system. The TCO films deposited on PEN substrate show very poor conductivity as compared to that of the TCO films deposited on glass substrates. From the results of the residual gas analysis(RGA) test, this poor stability of plastic substrate is presumed to be caused by the deteriorated adhesion between the TCO films and the plastic substrate due to outgassing from the plastic substrate during deposition of TCO films. From our experiment, it is found that the vaporization of some defects in the plastic substrates deteriorate the adhesion of the TCO films to the plastic substrate, because the most plastic substrates containing the water vapor and/or other adsorbed particles such as organic solvents. Mixing of these gases vaporized in the sputtering process will also affect the electrical property of the deposited TCO films. Inorganic thin composite $(SiO_2)_{40}(ZnO)_{60}$ film as a gas barrier layer is coated on the PEN substrate to protecting the diffusion of vapors from the substrate, so that the TCO films with an improved quality can be obtained.

• Journal of the Korean Ceramic Society
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• v.46 no.3
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• pp.313-316
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• 2009

A zinc borosilicate glass having a low softening temperature of $490^{\circ}C$ has been investigated as a protective layer for Ag patterns against chemical reactions with a $I^-/I_3^-$ electrolyte in dye-sensitized solar cells (DSSCs). A thick glass layer was prepared by the typical screen printing and firing processes to obtain a final thickness of ${\sim}5{\mu}m$. The chemical leaching performance of the glass layer in the electrolyte revealed that the reactive Ag pattern can be significantly protected by utilizing the low softening protective layer. The electrical resistance of the FTO-coated glass substrate was effectively maintained at a low value of ${\sim}27{\Omega}$ as long as the glass layer was well densified at a sufficiently high temperature of ${\sim}520^{\circ}C$. The transmittance of the layer was near 60%, depending on the firing temperature of the glass layer.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.9 no.6
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• pp.606-611
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• 1999

Low dielectric Mullite/Glass composites for substrates were fabricated by mullite by synthesized from kaolin and alumina, and borosilicate glass. By the liquid-sintering, the composites were densified at low sintering temperature in air, allowing confiring with Cu, Ag, Au and Ag-Pd. Crystallization of the borosilicate glass was not occurred. The mullite/50 wt% glass composites fired between 950 and $1100^{\circ}C$ showed good properties for high-performed substrate, such as low dielectric constant (5.2~5.4, at 1MHz), low coefficient of thermal expansion (5.3~$5.7{\times}10^{-6}{\cdot}^0C^{-1}$), and bending strength of 130 MPa.

• Journal of the Korean institute of surface engineering
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• v.46 no.4
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• pp.162-167
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• 2013

Encapsulation is required since organic materials used in OLED devices are fragile to water vapor and oxygen. Laser sealing method is currently used where IR laser is scanned along the glass-frit coated lines. Laser method is, however, not suitable to encapsulating large-sized glass substrate due to the nature of sequential scanning. In this work we propose a new method of encapsulation using Joule heating. Conductive layer is patterned along the sealing lines on which the glass frit is screen printed and sintered. Electric field is then applied to the conductive layer resulting in bonding both the panel glass and the encapsulation glass by melting glass-frit. In order to obtain uniform bonding the temperature of a conductive layer having a shape of closed loop should be uniform. In this work we conducted simulation for heat distribution according to the structure of a conductive layer used as a Joule-heat source. Uniform temperature was obtained with an error of 5% by optimizing the structure of a conductive layer. Based on the results of thermal simulations we concluded that Joule-heating induced encapsulation would be a good candidate for encapsulation method especially for large area glass substrate.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.28 no.9
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• pp.571-576
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• 2015

In this study, we developed a lead-free $P_2O_5-V_2O_5-ZnO$ glass frit for sealing OLED using laser irradiation. The frit satisfied the characteristics required for laser sealing such as low glass transition temperature, low coefficient of thermal expansion (CTE), high water-resistance, and high absorption at the wavelength of the laser beam. Ceramic fillers were added to the glass frit in order to further reduce and match its CTE with that of the commercial glass substrate. The addition of Zirconium Tungsten Phosphate (ZWP) to the frit yielded the most desirable results, reducing the CTE to $45.4{\times}10^{-7}/^{\circ}C$, which is very close to that of the glass substrate ($44.0{\times}10^{-7}/^{\circ}C$). Successful formation of a solid sealing layer was observed by optical and scanning electron microscopy.