• 제목/요약/키워드: Stress singularity index

검색결과 7건 처리시간 0.019초

마찰용접에 의한 이종재 접합계면에 대한 응력특이성의 해석 (Analysis of Stress Singularities on Interfaces of Friction Welded Dissimilar Materials)

  • 정남용;박철희
    • 한국자동차공학회논문집
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    • 제13권2호
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    • pp.142-148
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    • 2005
  • In this paper, the stress singularity on interface of friction welded dissimilar materials was investigated by using 2-dimensional elastic boundary element method. It is required that stress distributions and stress singularities on an interface for friction welded dissimilar materials analize to establish strength evaluation. The stress singularity index ($\lambda$) and stress singularity factor ($\Gamma$) were calculated from the results of stress analysis. The stress singularities on variations for shapes and thickness of friction welded flashes were analized and discussed. This paper suggested that the strength evalution by using the stress singularity factors as fracture parameters, considering the stress singularity on an interface edge of friction welded dissimilar materials were very useful.

접착이음의 계면덧살에 대한 응력특이성 해석 (Analysis of Stress Singularity for the Excess Adhesive of Interface in Adhesively Bonded Joint)

  • 정남용;박철희
    • 한국생산제조학회지
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    • 제21권3호
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    • pp.439-445
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    • 2012
  • The stress singularity for the excess adhesive on interface of adhesively bonded joint was investigated by using the 2-dimensional elastic boundary element method (BEM). To establish a reasonable strength evaluation method and a fracture criterion for the excess adhesive of interface in adhesively bonded joint, it is necessary to evaluate fracture parameters with various bonding conditions. Under the variations of adhesively bonded thickness (h) and diameter (d) for the excess adhesive, a stress analysis was performed, and from the results, the stress singularity index (${\lambda}$) and the stress singularity factor (${\Gamma}$) were calculated. The variations have a great influences on the stress singularity for the excess adhesive of interface in adhesively bonded joint, and the ${\Gamma}$ is reduced as the "h" and "d" increase.

SUH35/SUH3 마찰용접 접합계면에 대한 잔류응력 특이성의 해석 (Analysis of Residual Stress Singularities on Interfaces of Friction Welded SUH35/SUH3)

  • 정남용;박철희
    • 한국자동차공학회논문집
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    • 제13권5호
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    • pp.104-111
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    • 2005
  • With increasing use of SUH35/SUH3 dissimilar materials for automotive engine valves, it is required that stress singularities under residual stress on an interface for friction welded dissimilar materials analyzed to establish strength evaluation. The stress singularity $index{\lambda}$ and stress singularities $factor{\Gamma}$ were calculated from using the results of stress analysis to consider residual stress and loads. The stress singularities on variations for shapes and thickness of welded flashes were analyzed and discussed. This paper suggested that the strength evaluation by using the stress singularity factors as fracture parameters, considering the stress singularity on an interface edge of friction welded dissimilar materials will be useful.

응력특이성계수에 의한 이종 접합재료의 강도평가 (Strength Evaluation of Bonded Dissimilar Materials by Using Stress Singularity Factor)

  • 정남용;오봉택
    • 대한기계학회논문집A
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    • 제20권7호
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    • pp.2087-2096
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    • 1996
  • Recentrly advantages in composite and light weight material techniques have led to the increased use of bonded dissimilar materials such as ceramics/metal bonded joints, IC package, brazing, coating and soldering in the various industries. It is required to analyze the evaluation method of fracture strength and design methodology of bonded joints in dissimilar materials. Stress singularity according to changes of scarf angles for bonded scarf joints in dissimilar materials was investigated by the boundary element method and static experiments. In this paper, effect of the stress singularity factors at the interface edges of scarf joints on various dissmilar materials combinations were investigated by analysis of its stress and stress singularity index using 2-dimensional elastic program of boundary element method. And the variations of stress singularity index by changes for Young's modulus ratios of materials and scarf angles were investigated. Also, it is found that stress singularities at bonded interface edges are disappeared for certain combination of scarf angle in a pair of bonded dissimilar materials. As the results, it is proposed that the strength evaluation by using stress singularity factors, $\Gamma$, considering stress singularity at the interface edges of bonded dissimilar materials, is very useful.

세라믹/금속 접합재에 대한 응력특이성의 해석 (Analysis of Stress Singularity on Ceramics/Metal Bonded Joints)

  • 김기성;김희송;정남용
    • 대한기계학회논문집A
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    • 제20권10호
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    • pp.3058-3067
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    • 1996
  • With increasing use of ceramics/metal bonded joints, It is required to analyze the residual stress distribution and stress singularity at an interface edge for its bonded joints. In this paper, the residual stress distribution and stress singularity index of the ceramics/metal bonded joints were analyzed by using 2-dimensional elastic boundary element method. The variations of residual stress distribution and stress singularity index are studied with changes for the combinations of ceramics/metal bodned joints.

반도체 패키지의 경계요소법에 의한 균열진전경로의 예측 (Prediction of Crack Propagation Path Using Boundary Element Method in IC Packages)

  • 정남용
    • 한국자동차공학회논문집
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    • 제16권3호
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    • pp.15-22
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    • 2008
  • Applications of bonded dissimilar materials such as integrated circuit(IC) packages, ceramics/metal and resin/metal bonded joints, are very increasing in various industry fields. It is very important to analyze the thermal stress and stress singularity at interface edge in bonded joints of dissimilar materials. In order to investigate the IC package crack propagating from the edge of die pad and resin, the fracture parameters of bonded dissimilar materials and material properties are obtained. In this paper, the thermal stress and its singularity index for the IC package were analyzed using 2-dimensional elastic boundary element method(BEM). From these results, crack propagation direction and path by thermal stress in the IC package were numerically simulated with boundary element method.

경계요소법에 의한 반도체 패키지의 균열진전경로 예측 (Prediction of crack propagation path in IC package by BEM)

  • 송춘호;정남용
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2001년도 춘계학술대회논문집A
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    • pp.286-291
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    • 2001
  • Applications of bonded dissimilar materials such as IC package, ceramic/metal and resin/metal bonded joints, are very increasing in various industry fields. It is very important to analyze the thermal stress and stress singularity at interface edges in bonded joints of dissimilar materials. In orer to understand the package crack emanating from the edge of Die pad and Resin, fracture mechanics of bonded dissimilar materials and material properties are obtained. In this paper, the thermal stress and its singularity index for the IC package were analyzed using 2-dimensional elastic boundary element method. Crack propagation angle and path by thermal stress were numerically simulated with boundary element method.

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