• Transactions of Materials Processing
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• v.25 no.6
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• pp.373-378
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• 2016

Recent researches have reported that the superposition of ultrasonic vibrations in metal forming provides beneficial effects such as the reduction of forming load, flow stress and interfacial friction which improves the surface quality of end products. This paper presents experimental investigations on the effects of ultrasonic vibrations in upsetting tests of aluminum. The ultrasonic exciting system consists of piezoelectric transducer and resonator was designed and constructed to superimpose high frequency oscillation on the forming tools. Ultrasonic vibration-assisted upsetting tests were performed for three vibration modes five amplitudes, and the results were compared with those of conventional upsetting tests. The results showed that the superimposition of ultrasonic vibration reduces the upsetting load, and the load reduction is only dependent on the amplitude of the applied vibration regardless of deformation histories and vibration modes.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2000.10a
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• pp.136-140
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• 2000

It is desirable to predict springback quantitatively and accurately for the tool and process design in sheet stamping operations, however, it is blown very difficult. The result of springback analysis by the finite element method is sensitively influenced by numerical factors such as blank element size, number of integration point, punch velocity, contact algorithm etc. In the present work, a parametric study by Taguchi method is performed in order to evaluate the influence of numerical factors on springback Quantitatively and to obtain the combination of numerical factors which yields the best approximation to experimental data. Since springback is determined by the residual stress after forming process, it is important to evaluate stress distribution accurately. The oscillation in the time history curve of stress obtained by explicit FEM says that the stress solution at termination time is in very unstable state. Therefore, a variability study is also carried out in this study in order to assess the stability of implicit springback analysis starting from the stress solution by explicit forming simulation. The 2D draw bending process, one of the NUMISHEET '93 benchmark problems, is adopted as an application model.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.11 no.5
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• pp.197-202
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• 2001

The influence of thermal treatment and cold drawing was investigated for poly(ethy1ene terephthalate) films fabricated with various experimental conditions. Samples were elongated at room temperature under stepwise-drawing condition with the cross-head speed kom 0.5 to 500 mrdmin in an universal tester. Stress oscillation was observed in the stress-stnin curve of the samples heat-treatd at 50, 72 and $129^{\circ}C$ for 30 min, but it was not observed in the samples heat-treatd at $83^{\circ}C$ for 30 min. Thermal analyses of the samples were carried out in differential scanning calorimeter at the heating rate df $10^{\circ}C$/min/min, and the glass transition temperature, crystallization peak, enthalpy of fusion and degree of crystallinity were measured. The dynamic mechanical analyses of the samples were also carried out in a multiplefimction internal kiction pendulum at 1 Hz with the heating rate of $1.5^{\circ}C$/min, and it was found that the elastic modulus increases in the order of non-treated, heat-treated, and elongated samples.

• Proceedings of the KIEE Conference
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• 2005.07b
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• pp.1380-1382
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• 2005

The multi-resonant converter minimizes a parasitic oscillation by using the resonant tank circuit absorbed parasitic reactance existing in a converter circuit. So it is possible that the converter operated at a high frequency has a high efficiency because the losses are reduced. However, the resonant voltage stress across a switch is four or five times a input voltage. This high voltage stress increases the conduction loss. In this paper, we proposed the AT flyback multi-resonant converter. The proposed converter can reduce the voltage stress to two or three times by using two series input capacitors. The operational principle of the proposed converter was verified through the experimental converter.

• Journal of Industrial Technology
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• v.20 no.A
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• pp.211-218
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• 2000

It is desirable but difficult to predict springback quantitatively and accurately for successful tool and process design in sheet stamping operations. The result of springback analysis by the finite element method (FEM) is sensitively influenced by numerical factors such as blank element size, number of integration points, punch velocity, contact algorithm, etc. In the present work, a parametric study by Taguchi method is performed in order to evaluate the influence of numerical factors on the result of springback analysis quantitatively and to obtain the combination of numerical factors which gives the best approximation to experimental data. Since springback is determined by the residual stress after forming process, it is important to evaluate stress distribution accurately. The oscillation in the time history curve of stress obtained by the dynamic-explicit finite element method says that the stress solution at termination time is in very unstable state. Therefore, a variability study is also carried out in this study in order to assess the stability of implicit springback analysis starting from the stress solution by explicit forming simulation. The U-draw bending process, one of the NUMISHEET '93 benchmark problems, is adopted as an application model because it is most popular one for evaluating the springback characteristic.

• Proceedings of the KIEE Conference
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• 1999.07f
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• pp.2698-2700
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• 1999

The MRC minimizes a parasitic oscillation using the resonant tank circuit absorbed parasitic reactances existing in a converter circuit. So the converter is capable of operating at a high switching and also reducing the losses. But the resonant voltage stress across a resonant switch is 4-5 times a input voltage. This high voltage stress increases the conduction loss in MOSFET. In this paper, the CM forward MRC with synchronous rectifier and AT forward MRC are compared about efficiency and semiconductor stress. For analysis, we have built a 50W CM forward MRC and a 50W AT forward MRC. in which the input voltage is 48V, output voltage is 5V, each other. The measured voltage stress is about 170V of 2.9 times the input voltage in the AT Forward MRC, about 106V of 1.8 times the input voltage in CM forward MRC, and the efficiency is 81.05% in AT Forward MRC, 83.61% in CM forward MRC.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.12 no.3
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• pp.114-123
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• 1998

The multi-resonant converter(MRC) minimizes a parasitic oscillation by using the resonant tank circuit absorbed parasitic reactances existing in a converter circuit. So it si possible that the converter operated at a high frequency has a high efficiency because the losses are reduced. Such a MHz high frequency applications provide a high power density [W/inch3] of the converter. But the resonant voltage stress across a switch of the resonant tank circuit is 4~5 times a input voltage. This h호 voltage stress increases the conduction loss because of on-resistance of a MOSFET with higher rating. Thus, in this paper we proposed the alternated multi-resonant converter (AT MRC) differ from the clamp mode multi-resonant converter and applicated it to the forward MRC. The AT forward MRC can reduce the voltage stress to 2~3 times a input voltage by using two series input capacitor. The control circuit is simple because tow resonant switches are driven directly by the output pulse of the voltage controled oscillator. This circuit type is verified through the experimental converter with 48V input voltage, 5V/50W output voltage/power and PSpice simulation. the measured maximum voltage stress is 170V of 2.9 times the input voltage and the maximum efficiency of 81.66% is measured.

• Journal of computational fluids engineering
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• v.10 no.4 s.31
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• pp.1-11
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• 2005

A numerical study of the evaluation of turbulence models for thermal striping phenomenon is performed. The turbulence models chosen in the present study are the two-layer model, the shear stress transport (SST) model and the V2-f model. These three models are applied to the analysis of the triple-jet flow with the same velocity but different temperatures. The unsteady Reynolds-averaged Navier-Stokes (URANS) equation method is used together with the SIMPLEC algorithm. The results of the present study show that the temporal oscillation of temperature is predicted by the SST and V2-f models, and the accuracy of the mean velocity, the turbulent shear stress and the mean temperature is a little dependent on the turbulence model used. In addition, it is shown that both the two-layer and SST models have nearly the same capability predicting the thermal striping, and the amplitude of the temperature fluctuation is predicted best by the V2-f model.

• Structural Engineering and Mechanics
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• v.13 no.1
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• pp.91-101
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• 2002

During the last several years, research activity on non-tubular bonded joints has concentrated on the effects of normal stress, bending moments and shear. Nevertheless, in certain situations, the structure may be subjected to twisting moments, so that the evaluation of its dynamic behaviour to torsional vibrations becomes of great importance even though evaluations of such loading conditions is entirely lacking in the literature. The aim of this article is to show that torsional natural frequencies of the non-tubular joint can be evaluated by determining the roots of a determinantal equation, derived by taking advantage of some analytical results obtained in a previous paper dealing with the analysis of the state of stress in the adhesive. Numerical results related to clamped-free and clamped-clamped joints complete the article.

• Proceedings of the KIEE Conference
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• 1998.07d
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• pp.1508-1510
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• 1998

Recent development of scanning probe microscope techniques has made it possible to investigate, not only microscopic surface topography, but also physical and chemical properties on the nanometer-scale. The scanning Maxwell-stress microscopy (SMM) is surface characterization tool capable of mapping both the surface topography and electrical properties, such as surface potential, surface charge dielectric constant of thin films with a nanometer-scale resolution by means of the AC voltage driven oscillation of metal coated cantilever. In this study, we observed the surface potential distribution and molecular ordering in thin films. We have demonstrated that the SMM can be used for imaging surface potential distribution over the film surface and also be used for detecting surface changes in thin films. This is first step towards the understanding of electrical phenomena in organic and inorganic materials, biological system with SMM.