• Nuclear Engineering and Technology
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• 제47권3호
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• pp.340-350
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• 2015

This paper proposes strain-based acceptance criteria for assessing plastic instability of the safety class 1 nuclear components made of ferritic steel during level D service loads. The strain-based criteria were proposed with two approaches: (1) a section average approach and (2) a critical location approach. Both approaches were based on the damage initiation point corresponding to the maximum load-carrying capability point instead of the fracture point via tensile tests and finite element analysis (FEA) for the notched specimen under uni-axial tensile loading. The two proposed criteria were reviewed from the viewpoint of design practice and philosophy to select a more appropriate criterion. As a result of the review, it was found that the section average approach is more appropriate than the critical location approach from the viewpoint of design practice and philosophy. Finally, the criterion based on the section average approach was applied to a simplified reactor pressure vessel (RPV) outlet nozzle subject to SSE loads. The application shows that the strain-based acceptance criteria can consider cumulative damages caused by the sequential loads unlike the stress-based acceptance criteria and can reduce the overconservatism of the stress-based acceptance criteria, which often occurs for level D service loads.

• Nuclear Engineering and Technology
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• 제54권7호
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• pp.2386-2394
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• 2022

In this paper, smooth and notched bar tensile tests of austenitic stainless steel 304 are performed, covering four different multi-axial stress states and six different strain rate conditions, to investigate the effect of the stress triaxiality and strain rate on fracture strain. Test data show that the measured true fracture strain tends to decrease with increasing stress triaxiality and strain rate. The test data are then quantified using the Johnson-Cook (J-C) fracture strain model incorporating combined effects of the stress triaxiality and strain rate. The determined J-C model can predict true fracture strain overall conservatively with the difference less than 20%. The conservatism in the strain-based acceptance criteria in ASME B&PV Code, Section III, Appendix FF is also discussed.

• Nuclear Engineering and Technology
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• 제52권12호
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• pp.2918-2927
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• 2020

This paper proposes a simplified elastic-plastic analysis procedure using the penalty factors presented in the Code Case N-779 for strain-based fatigue assessment of nuclear safety class 1 components under severe seismic loads such as safety shutdown earthquake and beyond design-basis earthquake. First, a simplified elastic-plastic analysis procedure for strain-based fatigue assessment of nuclear safety class 1 components under the severe seismic loads was proposed based on the analysis result for the simplified elastic-plastic analysis procedure in the Code Case N-779 and the stress categories corresponding to normal operation and seismic loads. Second, total strain amplitude was calculated directly by performing finite element cyclic elastic-plastic seismic analysis for a hot leg nozzle in pressurizer surge line subject to combined loading including deadweight, pressure, seismic inertia load, and seismic anchor motion, as well as was derived indirectly by applying the proposed analysis procedure to the finite element elastic stress analysis result for each load. Third, strain-based fatigue assessment was implemented by applying the strain-based fatigue acceptance criteria in the ASME B&PV Code, Sec. III, Subsec. NB, Article NB-3200 and by using the total strain amplitude values calculated. Last, the total strain amplitude and the fatigue assessment result corresponding to the simplified elastic-plastic analysis were compared with those using the finite element elastic-plastic seismic analysis results. As a result of the comparison, it was identified that the proposed analysis procedure can derive reasonable and conservative results.

• 한국지진공학회논문집
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• 제23권3호
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• pp.169-181
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• 2019

Seismic performance of ordinary reinforced concrete shear wall systems commonly used in high-rise residential buildings is evaluated. Three types of shear walls exceeding 60m in height are designed by performance-based seismic design. Then, incremental dynamic analysis is performed collapse probability is assessed in accordance with the procedure of FEMA P695. As a result, story drift, plastic rotation, and compressive strain are observed to be major failure modes, but shear failure occur little. Collapse probability and collapse margin ratio of performance groups do not meet requirement of FEMA P695. It is observed that critical wall elements fail due to excessive compressive strain. Therefore, the compressive strain of concrete at the boundary area of the shear wall needs to be evaluated with more conservative acceptance criteria.

• Journal of Microbiology and Biotechnology
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• 제21권1호
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• pp.100-108
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• 2011

A method for the rapid detection and quantification of Newcastle disease virus (NDV) produced in an animal cell culture-based production system was developed to enhance the speed of the NDV vaccine manufacturing process. A SYBR Green I-based real-time RT-PCR was designed with a conventional, inexpensive RT-PCR kit targeting the F gene of the NDV LaSota strain. The method developed in this study was validated for specificity, accuracy, precision, linearity, limit of detection (LOD), limit of quantification (LOQ), and robustness. The validation results satisfied the predetermined acceptance criteria. The validated method was used to quantify virus samples produced in an animal cell culture-based production system. The method was able to quantify the NDV samples from mid- or late-production phases, but not effective on samples from the early-production phase. For comparison with other quantifiable methods, immunoblotting, plaque assay, and tissue culture infectious dose 50 ($TCID_{50}$) assay were also performed with the NDV samples. The results demonstrated that the real-time RT-PCR method is suitable for the rapid quantification of virus particles produced in an animal cell-culture-based production system irrespective of viral infectivity.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
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• pp.211-219
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.