• Korean Journal of Metals and Materials
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• v.46 no.9
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• pp.563-571
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• 2008

The influence of annealing treatment on dynamic deformation behavior of ultra-fine grained aluminum alloys was investigated in this study. After equal-channel angular pressing at $200^{\circ}C$, most of the grains were considerably reduced to nearly equiaxed grains of $0.3{\mu}m$ in size. With an increment of various annealing treatments for 1 hour, resultant microstructures were found to be fairly stable at temperatures up to $200^{\circ}C$, suggesting that static recovery would be dominantly operative, whereas grain growth was pronounced above $250^{\circ}C$. The tensile test results showed that yield and ultimate tensile strengths decreased, but elongation-to-failure and strain hardening rate increased with increasing annealing temperature. The dynamic deformation behavior retrieved with a series of torsional tests was explored with respect to annealed microstructures. Such mechanical response was analyzed in relation to resultant microstructure and fracture mode.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.04b
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• pp.134-138
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• 2000

The physical, electrical and piezoresitive characteristics of CrN(chromiun nitride) thin-films on silicon substrates have been investigated for use as strain gauges. The thin-film depositions have been carried out by DC reactive magnetron sputtering in an argon-nitrogen atmosphere(Ar-(5~25 %)$N_2$). The deposited CrN thin-films with thickness of $3500{\AA}$nd annealing conditions($300^{\circ}C$, 48 hr) in Ar-10 % $N_2$ deposition atmosphere have been selected as the ideal piezoresistive material for the strain gauges. Under optimum conditions, the CrN thin-films for the strain gauges is obtained a high electrical resistivity, $\rho=1147.65\;{\mu}{\Omega}cm$, a low temperature coefficient of resistance, TCR=-186 ppm/$^{\circ}C$ and a high temporal stability with a good longitudinal gauge factor, GF=11.17.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.05b
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• pp.135-141
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• 2000

The physical, electrical and piezoresitive characteristics of CrN(chromiun nitride) thin-films on silicon substrates have been investigated for use as strain gauges. The thin-film depositions have been carried out by OC reactive magnetron sputtering in an argon-nitrogen atmosphere(Ar-(5~25 %)$N_2$). The deposited CrN thin-films with thickness of $3500{\AA}$ and annealing conditions($300^{\circ}C$, 48 hr) in Ar-10 % $N_2$ deposition atmosphere have been selected as the ideal piezoresistive material for the strain gauges. Under optimum conditions, the CrN thin-films for the strain gauges is obtained a high electrical resistivity, $\rho=1147.65\;{\mu}{\Omega}cm$, a low temperature coefficient of resistance, TCR=-186 ppm/$^{\circ}C$ and a high temporal stability with a good longitudinal gauge factor, GF=11.17.

• Proceedings of the KIEE Conference
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• 2002.07c
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• pp.1596-1598
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• 2002

This paper presents the characteristics of Ta-N thin-film strain gauges as high-temperature strain gauges, which were deposited on Si substrate by DC reactive magnetron sputtering in an argon-nitrogen atmosphere(Ar-($4{\sim}16%$)$N_2$). These films were annealed for 1 hour in $2{\times}10^{-6}$ Torr vacuum furnace range $500{\sim}1000^{\circ}C$. The optimized conditions of Ta-N thin-film strain gauges were annealing condition($900^{\circ}C$, 1 hr.) in 8% $N_2$ gas flow ratio deposition atmosphere. Under optimum conditions, the Ta-N thin-films for strain gauges is obtained a high resistivity, ${\rho}$=768.93 ${\mu}{\Omega}cm$, a low temperature coefficient of resistance, TCR = -84 ppm/$^{\circ}C$ and a high temporal stability with a good longitudinal gauge factor, GF = 4.12.

• Korean Journal of Metals and Materials
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• v.47 no.2
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• pp.71-78
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• 2009

The precipitation behavior of solute carbon and nitrogen strongly affects the mechanical properties of low-carbon automotive panel. In the present study, the effects of aluminum and solute nitrogen on the bake hardenability and strain aging of extremely low-carbon steel with carbon content below 15 ppm has been investigated. The ferrite grain size and distribution of precipitates were varied with the amount of aluminum content of 0.003 to ~ 0.100 wt% in a constant solute carbon and nitrogen. With increasing the aluminum content, the ferrite grain size is increased and strain aging is delayed. The strain aging is also delayed by increasing the annealing temperature, although the ferrite grain size is not much changed.

• Corrosion Science and Technology
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• v.6 no.6
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• pp.275-281
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• 2007

The effect of annealing on the pitting corrosion resistance of anodized Al-Mg alloy (AA5052) processed by equal-channel angular pressing (ECAP) was investigated by electrochemical techniques in a solution containing 0.2 mol/L of $AlCl_3$ and also by surface analysis. The Al-Mg alloy was annealed at a fixed temperature between 473 and 573 K for 120 min in air after ECAP. Anodizing was conducted for 40 min at $100-400A/m^2$ at 293 K in a solution containing 1.53 mol/L of $H_2SO_4$ and 0.0185 mol/L of $Al_2(SO_4)_3$. The internal stress generated in anodic oxide films during anodization was measured with a strain gauge to clarify the effect of ECAP on the pitting corrosion resistance of anodized Al-Mg alloy. The time required to initiate the pitting corrosion of anodized Al-Mg alloy was shorter in samples subjected to ECAP, indicating that ECAP decreased the pitting corrosion resistance. However, the pitting corrosion resistance was greatly improved by annealing after ECAP. The time required to initiate pitting corrosion increased with increasing annealing temperature. The strain gauge attached to Al-Mg alloy revealed that the internal stress present in the anodic oxide films was compressive stress, and that the stress was larger with ECAP than without. The compressive internal stress gradually decreased with increasing annealing temperature. Scanning electron microscopy showed that cracks occurred in the anodic oxide film on Al-Mg alloy during initial corrosion and that the cracks were larger with ECAP than without. The ECAP process of severe plastic deformation produces large internal stresses in the Al-Mg alloy; the stresses remain in the anodic oxide films, increasingthe likelihood of cracks. It is assumed that the pitting corrosion is promoted by these cracks as a result of the higher internal stress resulting from ECAP. The improvement in the pitting corrosion resistance of anodized AlMg alloy as a result of annealing appears to be attributable to a decrease in the internal stresses in anodic oxide films

• JSTS:Journal of Semiconductor Technology and Science
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• v.8 no.4
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• pp.326-332
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• 2008

In this work CdS films were prepared by using chemical bath deposition, which is simple and inexpensive technique suitable for large deposition area. Annealing in air at different temperatures (300, 350, 400, 450 and $500^{\circ}C$) at constant time of 30 min, also for different times (15, 30, 45, 60 and 90 min) at constant temperature ($300^{\circ}C$) is achieved. X-Ray analysis has confirmed the formation of cadmium oxide (CdO) with slight increase in grain size, shift towards lower scattering angle due to relaxation in the tensile strain for deposition films, and structure change from cubic and hexagonal to the hexagonal. From electrical properties, significant increase in electrical conductivity appeared in samples annealed at $300^{\circ}C$ for 60 min, and at $350^{\circ}C$ for 30 min.

• 한국정보디스플레이학회:학술대회논문집
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• 2007.08a
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• pp.745-748
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• 2007

Hydrogenated amorphous silicon thin film transistors (a-Si:H TFTs) were fabricated on a flexible metal substrate at $150\;^{\circ}C$. To increase the stability of the flexible a-Si:H TFTs, they were thermally annealed at $230\;^{\circ}C$. The field effect mobility was reduced because of the strain in a- Si:H TFT under thermal annealing.

• Journal of Power System Engineering
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• v.17 no.6
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• pp.122-129
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• 2013

The microstructure and deformation behavior in 22Cr-0.2N micro-duplex stainless steels with various Ni and Mn contents were compared using by OM, TEM, and XRD. The 22Cr-0.2N duplex stainless steel plates were fabricated and hot rolled, followed by annealing treatment at the temperature range of $1,000-1,100^{\circ}C$. All the samples showed the common strain hardening behaviour during the tensile test at a room temperature. The steels tested at the temperatures of $-30^{\circ}C$ or $-50^{\circ}C$ showed a distinct inflection point in the stress-strain curves, which should be resulted from the formation of strain-induced martensite(SIM) of austenite phase. This was confirmed by TEM observations. The onset strain of a inflection point in a stress-strain curve should be depended up the value of $M_d30$. With the decrease of the tensile test temperature, the inflection point appeared earlier, and the strength and fracture strain were higher. The tensile behaviour was discussed from the point of austenite stability of the micro-duplex stainless steels with the different Ni and Mn content.

• Journal of Mechanical Science and Technology
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• v.19 no.4
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• pp.958-967
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• 2005

The mathematical model for tension behaviors of a moving web by Shin (2000) is extended to the tension model considering the thermal strain due to temperature variation in furnace. The extended model includes the terms that take into account the effect of the change of the Young's Modulus, the thermal coefficient, and the thermal strain on the variation of strip tension. Computer simulation study proved that the extended tension model could be used to analyze tension behaviors even when the strip goes through temperature variation. By using the extended tension model, a new tension control method is suggested in this paper. The key factors of suggested tension control method include that the thermal strain of strip could be compensated by using the velocity adjustment of the helper-rollers. The computer simulation was carried out to confirm the performance of the suggested tension control method. Simulation results show that the suggested tension control logic not only overcomes the problem of the traditional tension control logic, but also improves the performance of tension control in a furnace of the CAL (Continuous Annealing Line).