• Journal of Institute of Control, Robotics and Systems
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• v.9 no.10
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• pp.774-781
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• 2003

The important factors that cause position error in X-Y robot are inertial force, frictions and spring distortion in screw or coupling. We have to estimate these factors precisely to correct position errors, Which is very difficult. In this paper, we makes systems to inspect metal stencil which is used to print solder paste on pads of SMD of PCB with low precision X-Y robot and vision system. To correct position error that is caused by low precision X-Y robot, we defines position error vector that is formed with position of objects that exist in reference and camera image. We apply MHT(Modified Hough Transformation) for the aim of determining the dominant position error vector. We modify reference image using extracted dominant position error vector and obtain reference image that is the same with camera image. Effectiveness and performance of this method are verified by simulation and experiment.

• Journal of the Korean Graphic Arts Communication Society
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• v.28 no.1
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• pp.65-75
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• 2010

Environmentally friendly, stencil and screen printing for cost-effective for maskless. In this study, UV -LED light source for the dispersion characteristics and high competence photoresist coating was prepared. Wavelength of 365nm UV-LED exposure device using the maskless lithography, 1.7kgf/$cm^2$ $2600mmH_2O$ the injection pressure and the suction pressure by using a dry photoconductor symptoms were dry emulsion on the market as a result, curing properties and adhesion, hardness, solvent resistance and excellent reproduction of fine patterns and ecological stencil technology was available and could be confirmed as a possibility.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.4
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• pp.83-89
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• 2014

Solder paste plays a crucial role as the widely used joining material in surface mount technology (SMT). The understanding of its behaviour and properties is essential to ensure the proper functioning of the electronic assemblies. The composition of the solder paste is known to be directly related to its rheological behaviour. This paper provides a brief overview of the solder paste behaviour of four different solder paste formulations, stencil printing processes, and techniques to characterize solder paste behaviour adequately. The solder pastes are based on the Sn-3.0Ag-0.5Cu alloy, are different in their particle size, metal content and flux system. The solder pastes are characterized in terms of solder particle size and shape as well as the rheological characterizations such as oscillatory sweep tests, viscosity, and creep recovery behaviour of pastes.

• Proceedings of the KWS Conference
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• 2007.11a
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• pp.218-221
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• 2007

The surface mounting technology of 0402 electric chip part is necessary to fabricate a high density and multi-functional module, but there is a limitation of the technology, like as a bridge and self-alignement. This work estimated SMT processing factors of 0402 chip. To obtain optimum SMT process, we evaluated effects of stencil thickness, shape of hole on printability and mountability. Printability shows best results under the thickness of $80{mu}m$ with circle hole shape and 90% square hole shape. In case of chip mounting process, chip mis-alignment and bridge was occurred rarely in same conditions. In more thin stencil thickness, $50{mu}m$, strength of 1005 chip parts was poor, because of amount of printed solder was insufficient.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.09a
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• pp.165-172
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• 2003

Wafer-level packaging technology has become established with increase of demands for miniaturizing and realizing lightweight electronic devices evolution. This packaging technology enables the smallest footprint of packaged chip. Various structures and processes has been proposed and manufactured currently, and products taking advantages of wafer-level package come onto the market. The package enables mounting semiconductor chip on print circuit board as is a case with conventional die-level CSP's with BGA solder bumps. Bumping technology is also advancing in both lead-free solder alternative and wafer-level processing such as stencil printing using solder paste. It is known lead-free solder bump formation by stencil printing process tend to form voids in the re-flowed bump. From the result of FEM analysis, it has been found that the strain in solder joints with voids are not always larger than those of without voids. In this paper, characteristics of wafer-level package and effect of void in solder bump on its reliability will be discussed.

• Journal of Industrial and Engineering Chemistry
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• v.68
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• pp.393-398
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• 2018

This work offers a promising approach for development of a temperature-responsive colorimetric display platform. For this purpose, uniform thermochromic microcapsules consisting of a cholesteric liquid crystal (CLC) core and a thin polyurethane shell layer were fabricated by conducting in-situ condensation polymerization at the interface of monodisperse CLC-in-water emulsion drops. Colloidal packing-driven microcapsule registry led to exact 2-dimensional positioning of CLC microcapsules into a holes-patterned flexible film stencil. Furthermore, we showed that the designated registry of different color types of CLC microcapsules on the stencil enabled development of a microwriting display technology capable of reversible text representation according to temperature change.

• Proceedings of the Korean Society of Laser Processing Conference
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• 2000.11a
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• pp.10-13
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• 2000

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2008.11a
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• pp.305-306
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• 2008

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2010.05a
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• pp.149-150
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• 2010

• Proceedings of the Korean Society of Laser Processing Conference
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• 2001.05a
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• pp.86-91
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• 2001