• 한국표면공학회지
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• 제53권5호
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• pp.227-231
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• 2020

This article investigated the effects of stainless steel plate-patterns bonded to aluminum frypan on the thermal distortion and surface temperature of the frypan during gas or induction heating. Two different stainless steel plate-patterns were employed: type A contains only circular holes and type B has not only circular holes but also vacant spaces of 0.5 mm thick and 40 mm long straight line crossing 60 mm long curved line. The bottom of the frypan was distorted during heating when type A stainless steel plate-bonded frypan while no significant thermal distortion was observed for type B stainless steel plate-bonded frypan during heating. Temperature of the frypan surface showed the same trend during gas heating, irrespective of stainless steel plate-patterns. During induction heating, however, the frypan with type B stainless steel plate-pattern showed lower surface temperature than the frypan with type A stainless steel plate-pattern. It is concluded that Type B stainless steel plate-pattern with circular holes and vacant spaces of lines is very effective for minimizing a thermal distortion and lowering the surface temperature of an aluminum frypan during induction heating.

• 한국세라믹학회지
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• 제45권3호
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• pp.161-166
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• 2008

The multi-films of a metallic film and a transparent conducting oxide (TCO, indium-tin oxide, ITO) film were formed on the stainless steel 316 and 304 plates by a sputtering method and an E-beam method and then the external metallic region of the stainless steel bipolar plates was converted into the metal nitride films through an annealing process. The multi-film formed on the stainless steel bipolar plates showed the XRD patterns of the typical indium-tin oxide, the metallic phase and the metal substrate and the external nitride film. The XRD pattern of the thin film on the bipolar plates modified showed two metal nitride phases of CrN and $Cr_2N$ compound. Surface microstructural morphology of the multi-film deposited bipolar plates was observed by AFM and FE-SEM. The metal nitride film formed on the stainless steel bipolar plates represented a microstructural morphology of fine columnar grains with 10 nm diameter and 60nm length in FE-SEM images. The electrical resistivity of the stainless steel bipolar plates modified was evaluated.

• Structural Engineering and Mechanics
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• 제75권6호
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• pp.723-736
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• 2020

In this paper, acoustic emission (AE) and pattern recognition are utilized to identify the AE signal signatures caused by propagation of stress corrosion cracking (SCC) in a 304 stainless steel plate. The surface of the plate is under almost uniform tensile stress at a notch. A corrosive environment is provided by exposing the notch to a solution of 1% Potassium Tetrathionate by weight. The Global b-value indicated an occurrence of the first visible crack and damage stages during the SCC. Furthermore, a method based on linear regression has been developed for damage identification using AE data.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2000년도 추계학술대회논문집A
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• pp.516-521
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• 2000

Most of studies, using ESPI method, have handled tension, thermal and vibration analysis, and is limited to isotropic materials. However, tension and vibration simultaneously are loaded in real structure. Also, almost study using ESPI method is locally limited to the analysis on the isotropic materials and a few studies on the anisotropic materials have reported. Existing methods, such as the accelerometer method and FEA method, to analyze vibration have some disadvantages. Using the accelerometer method that is generally used to analyze vibration phenomena, it is impossible to analyze vibration on the oscillating body and one can observe no vibration mode shape during experiment. In case of the FEA method, it is difficult to define boundary conditions correctly if the shape of a body tested is complex, and one can just obtain vibration mode shapes on the peak amplitude in each modes. In this study, plane plate of stainless steel(STS304), isotropic material, that is used as structural steel is analyzed about vibration characteristics under tension. Also, in the study of stainless steel, the characteristics of composite material(AS4/PEEK) used as high strength structural material in aircraft is evaluated about vibration under tension, and studies the effect of tension on vibration.

• 반도체디스플레이기술학회지
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• 제11권1호
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• pp.73-78
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• 2012

In this study, the optimal process condition was induced about the pillar arrangement process of applying the screen printing method in the manufacture process of vacuum glazing panel. The high precision screen printing is technology which pushes out the paste and spreads it by using the squeegee on the stainless steel plate in which the pattern is formed. The screen printing method is much used in the flat panel display field including the LCD, PDP, FED, organic EL, and etc for forming the high precision micro-pattern. Also a number of studies of screen printing method have been conducted as the method for the cost down through the improvement of productivity. The screen printing method has many parameters. So we used Taguchi method in order to decrease test frequencies and optimize this parameters efficiently. In this study, experiments of pillar arrangement were performed by using Taguchi experimental design. We analyzed experimental results and obtained optimal conditions which are 4 m/s of squeegee speed, $40^{\circ}$ of squeegee angle and distance between metal mask and glass.

• 한국재료학회지
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• 제22권9호
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• pp.482-488
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• 2012

To fabricate a precise micro metal mold, the electrochemical etching process has been researched. We investigated the electrochemical etching process numerically and experimentally to determine the etching tendency of the process, focusing on the current density, which is a major parameter of the process. The finite element method, a kind of numerical analysis, was used to determine the current density distribution on the workpiece. Stainless steel(SS304) substrate with various sized square and circular array patterns as an anode and copper(Cu) plate as a cathode were used for the electrochemical experiments. A mixture of $H_2SO_4$, $H_3PO_4$, and DIW was used as an electrolyte. In this paper, comparison of the results from the experiment and the numerical simulation is presented, including the current density distribution and line profile from the simulation, and the etching profile and surface morphology from the experiment. Etching profile and surface morphology were characterized using a 3D-profiler and FE-SEM measurement. From a comparison of the data, it was confirmed that the current density distribution and the line profile of the simulation were similar to the surface morphology and the etching profile of the experiment, respectively. The current density is more concentrated at the vertex of the square pattern and circumference of the circular pattern. And, the depth of the etched area is proportional to the current density.

• 대한치과교정학회지
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• 제34권4호
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• pp.303-312
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• 2004

전치의 후방 견인시 교정력은 치아의 저항중심에서 벗어난 브라켓을 통해 적용되기 때문에 바람직하지 못한 경사이동이 발생하게 되고 이를 방지하기 위한 여러 가지 방법 중 호선에 curve나 전치부 호선에 치근 설측 토그를 부여하는 방법이 많이 사용된다. 이에 본 연구는 combination loop archwire와 hook을 이용한 활주역 학을 이용하여 전치를 후방 견인 시, compensating curve를 0도, 15도, 30도 부여하고, 이 때 나타나는 효과를 광탄성법으로 비교 연구하기 위하여 치아와 치조골 모형을 광탄성 모형으로 대체시키고 와이어와 브라켓을 주어진 조건으로 위치시 킨 후 편광판을 이용하여 초기 응력 상태를 분석하여 다음과 같은 결과를 얻었다. 1. Combination loop archwire와 활주역학으로 전치를 후방 견인 시 compensating curve가 0도, 15도, 30도로 증가할수록 전치부 치근단 부위의 최대 무의차수가 감소하였다. 2. Combination loop archwire와 활주역 학으로 전치를 후방 견인 시 compensating curve가 0도, 15도, 30도로 증가할수록 견치와 소구치 부위의 최대 무의차수가 증가하였다. 3. Combination loop archwire로 전치를 견인할 때보다 동일한 힘을 사용하여 활주역 학으로 견인할 때 전치부 치근단 부위에서 다소 낮은 무의차수를 나타내었다. 이상의 결과에서 Combination loop archwire와 활주역학을 이용한 상악전치의 후방 견인시 견인방법에 큰 차이 없이 호선에 부여한 compensating curve는 전치의 설측 경사이동 양상을 어느 정도 감소시킬 수 있음을 확인하였다. 또한 힘의 적용위치가 저항중심에 더욱 가까운 hook을 이용한 활주 역학이 전치의 설측경사 방지에 더 효과적일 것으로 판단된다.가 높게 나타나는 현상을 부분적으로 설명하여 주는 것으로 사료된다.용한 정보를 제공할 수 있을 것으로 보인다.ing할 경우, arch perimeter의 증가량은 Curve of Spee의 최대 길이의 1/2보다 적게 나타났다.$(_{60}PBS)$는 전단결합강도(SBS)의 $34\%$ 수준이었으며, 인장결합강도(TBS)에 대해서는 $61\%$ 수준이었으며, Non-etched Foil-Mesh base에서 최저 Peel 결합 강도$(_{60}PBS)$는 전단결합강도(SBS)의 $34\%$ 수준이었으며, 인장결합강도(TBS)에 대해서는 $55\%$ 수준이었다. 4. 단위 면적 당 결합강도에 있어서 전단결합강도(SBS)와 인장결합강도(TBS) 및 $75^{\circ}\;와\;90^{\circ}$ peel 결합강도는 Micro-Loc base와 Chessboard base에서 차이 가 없었으며 Non-etched Foil-Mesh base에서 가장 작았고(p<0.05), $0^{\circ},\;15^{\circ},\;30^{\circ},\;60^{\circ}$ peel응력을 적용한 결과 Chessboard base에서 가장 큰 Peel결합강도를, Non-etched Foil-Mesh base에서 가장 작은 결합강도를 보였다(p<0.05).았다. 6. 주사전자현미경으로 본 표면은 모든 제품에서 생산과정 중에 보이는 압흔과 pitting이 관찰되는데, 진성기업의 Stainless Steel은 가늘고 긴 압흔이 있으며 비교적 매끄러운 표면을 보이고, Unitek사의 경우 압흔과 함께 pitting 이 관찰되며, Ormco Stainless Steel의 경우 불규칙한 pitting이 다수 존재했다

• 한국재료학회:학술대회논문집
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• 한국재료학회 2012년도 춘계학술발표대회
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• pp.81.2-81.2
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• 2012

To fabricate a metal mold for injection molding, hot-embossing and imprinting process, mechanical machining, electro discharge machining (EDM), electrochemical machining (ECM), laser process and wet etching ($FeCl_3$ process) have been widely used. However it is hard to get precise structure with these processes. Electrochemical etching has been also employed to fabricate a micro structure in metal mold. A through mask electrochemical micro machining (TMEMM) is one of the electrochemical etching processes which can obtain finely precise structure. In this process, many parameters such as current density, process time, temperature of electrolyte and distance between electrodes should be controlled. Therefore, it is difficult to predict the result because it has low reliability and reproducibility. To improve it, we investigated this process numerically and experimentally. To search the relation between processing parameters and the results, we used finite element simulation and the commercial finite element method (FEM) software ANSYS was used to analyze the electric field. In this study, it was supposed that the anodic dissolution process is predicted depending on the current density which is one of major parameters with finite element method. In experiment, we used stainless steel (SS304) substrate with various sized square and circular array patterns as an anode and copper (Cu) plate as a cathode. A mixture of $H_2SO_4$, $H_3PO_4$ and DIW was used as an electrolyte. After electrochemical etching process, we compared the results of experiment and simulation. As a result, we got the current distribution in the electrolyte and line profile of current density of the patterns from simulation. And etching profile and surface morphologies were characterized by 3D-profiler(${\mu}$-surf, Nanofocus, Germany) and FE-SEM(S-4800, Hitachi, Japan) measurement. From comparison of these data, it was confirmed that current distribution and line profile of the patterns from simulation are similar to surface morphology and etching profile of the sample from the process, respectively. Then we concluded that current density is more concentrated at the edge of pattern and the depth of etched area is proportional to current density.