• Smart Structures and Systems
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• v.3 no.1
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• pp.1-22
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• 2007

The energy efficiency of a self-powered wireless sensing system for pressure monitoring in injection molding is analyzed using Bond graph models. The sensing system, located within the mold cavity, consists of an energy converter, an energy modulator, and a ultrasonic signal transmitter. Pressure variation in the mold cavity is extracted by the energy converter and transmitted through the mold steel to a signal receiver located outside of the mold, in the form of ultrasound pulse trains. Through Bond graph models, the energy efficiency of the sensing system is characterized as a function of the configuration of a piezoceramic stack within the energy converter, the pulsing cycle of the energy modulator, and the thicknesses of the various layers that make up the ultrasonic signal transmitter. The obtained energy models are subsequently utilized to identify the minimum level of signal intensity required to ensure successful detection of the ultrasound pulse trains by the signal receiver. The Bond graph models established have shown to be useful in optimizing the design of the various constituent components within the sensing system to achieve high energy conversion efficiency under a compact size, which are critical to successful embedment within the mold structure.

• Proceedings of the Korean Society of Propulsion Engineers Conference
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• 2007.04a
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• pp.185-188
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• 2007

The main objective of this research effort was to develope the performance of C/SiC composites manufactured by LSI (Liquid Silicon Infiltration) method for solid and liquid rocket propulsion system and ensure the performance analysis technique. The various carbon preform were manufactured by filament winding, tape rolling, involute layup and stack molding process. For the best performance of thermal and mechanical properties, many process conditions were tested and selected by varying preform, the content of SiC, temperature, impregnation resin and chemical vapour reaction. In conclusion, the high performance and reliability of C/SiC composite were proved for solid and liquid rocket propulsion system. And the performance analysis technique related to mathematical ablation model was originated.

• Journal of the Korean Ceramic Society
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• v.43 no.10 s.293
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• pp.607-612
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• 2006

In VARTM (Vacuum Assisted Resin Transfer Molding) process, the permeability generally controls the filling time of the resin and it also affects the void characteristics of the fiber composite. In this study, carbon and glass fiber inter-layered hybrid composites (carbon fiber centered stack) with an epoxy matrix were fabricated by VARTM process and evaluated the resin flow and macro void characteristics. The permeability of glass fiber was higher than that of carbon fiber used in this study. Using Darcy's equation, the permeability of hybrid composites could be predicted and experimentally confirmed. After curing, the macro void content of hybrid composites was investigated using image analyzer. The calculated filling time was well agreed with experimental result and the void content was significantly changed in hybrid composites.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.2
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• pp.7-15
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• 2012

Semiconductor packages are increasingly moving toward miniaturization, lighter and multi-functions for mobile application, which requires highly integrated multi-stack package. To meet the industrial demand, the package and silicon chip become thinner, and ultra-thin packages will show serious reliability problems such as warpage, crack and other failures. These problems are mainly caused by the mismatch of various package materials and geometric dimensions. In this study we perform the numerical analysis of the warpage deformation and thermal stress of 4-layer stacked FBGA package after EMC molding and reflow process, respectively. After EMC molding and reflow process, the package exhibits the different warpage characteristics due to the temperature-dependent material properties. Key material properties which affect the warpage of package are investigated such as the elastic moduli and CTEs of EMC and PCB. It is found that CTE of EMC material is the dominant factor which controls the warpage. The results of RSM optimization of the material properties demonstrate that warpage can be reduced by $28{\mu}m$. As the silicon die becomes thinner, the maximum stress of each die is increased. In particular, the stress of the top die is substantially increased at the outer edge of the die. This stress concentration will lead to the failure of the package. Therefore, proper selection of package material and structural design are essential for the ultra-thin die packages.

• Korean Journal of Heritage: History & Science
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• v.48 no.2
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• pp.142-157
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• 2015

This study examines how traditional knowledge functions in the specific techniques to make pottery in terms of the traditional knowledge on the pottery techniques of Onggi potters. It focuses on how traditional pottery manufacturing skills are categorized and what aspects are observed with regard to the techniques. The pottery manufacturing process is divided into the preparation step of raw material, the molding step of pottery, and the final plasticity step. Each step involves unique traditional knowledge. The preparation step mainly comprises the knowledge on different kinds of mud. The knowledge is about the colors and properties of mud, the information on the regional distribution of quality mud, and the techniques to optimize mud for pottery manufacturing. The molding step mainly involves the structure and shape of spinning wheels, the techniques to accumulate mud, ways to use different kinds of tools, the techniques to dry processed pottery. The plasticity step involves the knowledge on kilns and the scheme to build kilns, the skills to stack pottery inside of the kilns, the knowledge on firewood and efficient ways of wood burning, the discrimination of different kinds of fire and the techniques to stoke the kilns. These different kinds of knowledge may be roughly divided into three categories : the preparation of raw material, molding, and plasticity. They are closely connected with one another, which is because it becomes difficult to manufacture quality pottery even with only one incorrect factor. The contents of knowledge involved in the manufacturing process of pottery focused are mainly about raw material, color, shape, distribution aspect, fusion point, durability, physical property, etc, which are all about science. They are rather obtained through the experimental learning process of apprenticeship, not through the official education. It is not easy to categorize the knowledge involved. Most of the knowledge can be understood in the category of ethnoscience. In terms of the UNESCO world heritage of intangible cultural assets, the knowledge is mainly about 'the knowledge on nature and universe'. Unique knowledge and skills are, however, identified in the molding step. They can be referred to 'body techniques', which unify the physical stance of potters, tools they employ, and the conceived pottery. Potters themselves find it difficult to articulate the knowledge. In case stated, it cannot be easily understood without the experience and knowledge on the field. From the preparation of raw material to the complete products, the techniques and traditional knowledge involved in the process of manufacturing pottery are closely connected, employing numerous categories and levels. Such an aspect can be referred to as a 'techniques chain'. Here the techniques mean not only the scientific techniques but also, in addition to the skills, the knowledge of various techniques and levels including habitual, unconscious behaviors of potters.