• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 추계학술대회 논문집 Vol.21
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• pp.160-160
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• 2008

In practical etching process, etch ant is sprayed on the metal-deposited panel through nozzles collectively connected to the manifold and that panel is usually composed of many PCB(printed circuit board)'s. The etching uniformity, the difference between individual PCB's on the same panel, has become one of most important features of etching process. In this paper, the prediction of nozzle trajectory has been performed by the combination of algebraic formula and numerical simulation. With the pre-determined geometrical factors of nozzle distribution, the trajectories of individual nozzles were predicted with the change of process operational factors such as panel speed, nozzle swing frequency and so on. As results, two dimensional distribution of impulsive force of etchant spray which could be considered as a key factor determining the etching performance have been successfully obtained. Though only qualitative prediction of etching uniformity have been predicted by the process developed in this study, the expansion to the quantitative prediction of etching uniformity is expected to be apparent by this study.

• 한국표면공학회지
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• 제29권1호
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• pp.60-72
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• 1996

A photoetching process is widely used for small and high precision parts in machinery, electronic and semi-conductor industries. One of the high precision parts, grid is very important part of digitron which use electron display, and it is fabricated by only photoetching process because of high precision. In this study, to develop high precision digitron grid, characteristics of etching solution were investigated with electrochemical test, that was potentiodynamic test and immersion test in the ferric chloride solution and added some additives. Based on the electrochemical etching test, grid was fabricated by continuous photoetching process at various etching condition. From the result of measured line width and etching depth under-cut and etching factor were calculated. For the fabrication of 25$\mu\textrm{m}$ line width, optimal etching condition was etching temperature 40~$45^{\circ}C$, spray pressure 1.5kg/$\textrm{cm}^2$ and etching time 3~4min.

• 연구논문집
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• 통권23호
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• pp.29-43
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• 1993

Photoetching of AISI 304 stainless steel in ferric chloride solution has been studied. This paper investigated on the single side etching characteristics of 304 stainless steel, especially influence of etching temperature, spray pressure of ferric chloride etchant, and etching time with $50\mum$ and $75\mum$ line width photomask.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2001년도 춘계학술대회논문집D
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• pp.909-914
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• 2001

Fluid properties which are most commonly used to evaluate spray atomization characteristics, are important because they affect velocity and size distribution of droplets. The purpose of this study was to incorporate the significant characteristics in atomization process of industrial etching spray and how each of them affects the design of precise pressure-swirl nozzles. The experiment was carried out with different viscosity and density of fluid. The macro characteristics of liquid spray, such as the spray angle and shape were captured by PMAS and the micro characteristics of liquid spray, such as droplet size and velocity were obtained by PDA. The mean velocity and SMD of droplets were measured along axial and radial direction. It was found that the higher viscosity and density resulted in the larger SMD and the lower mean velocity of droplets.

• 전기화학회지
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• 제11권2호
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• pp.95-99
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• 2008

본 연구에서는 ESD(Electrostatic spray deposition) 코팅법을 이용하여 지르코늄 산화물을 티타늄에 코팅한 전극을 제조하였다. 전처리과정에서 티타늄 기판의 에칭 방법 효율과 에칭된 티타늄 기판에 지르코늄 산화물 막의 제조 및 전기 화학적 특성에 대하여 연구하였다. 염산 에칭은 티타늄 기판에 가늘고 균일한 홈이 생성된다. 강력한 산화제로 사용되는 오존과 차아염소산을 생성하는 효과적인 금속 산화물 전극의 제작과 물질의 특성에 대해 고찰하였고 참고문헌을 통해 지그코늄 산화물에 초점을 맞추었다. 지르코늄 산화물 전극의 제작의 재현성을 향상시키기 위한 코팅 방법으로 지르코늄 옥시클로라이드의 ESD 코팅법을 사용하였다. 티타늄 기판 위에 지르코늄 산화물 막의 형성에 대한 테스트로 SEM, XRD, Cyclic voltammery를 수행하였다.

• 반도체디스플레이기술학회지
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• 제21권3호
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• pp.74-79
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• 2022

In this study, the plasma corrosion resistance and the change in the number of contamination particles generated using the plasma etching process and cleaning process of coating parts for semiconductor plasma etching equipment were investigated. As the coating method, atmospheric plasma spray (APS) was used, and the powder materials were Y₂O₃ and Y₃Al₅O₁₂ (YAG). There was a clear difference in the densities of the coatings due to the difference in solubility due to the melting point of the powdered material. As a plasma environment, a mixed gas of CF₄, O₂, and Ar was used, and the etching process was performed at 200 W for 60 min. After the plasma etching process, a fluorinated film was formed on the surface, and it was confirmed that the plasma resistance was lowered and contaminant particles were generated. We performed a surface cleaning process using piranha solution(H₂SO₄(3):H₂O₂(1)) to remove the defect-causing surface fluorinated film. APS-Y₂O₃ and APS-YAG coatings commonly increased the number of defects (pores, cracks) on the coating surface by plasma etching and cleaning processes. As a result, it was confirmed that the generation of contamination particles increased and the breakdown voltage decreased. In particular, in the case of APS-YAG under the same cleaning process conditions, some of the fluorinated film remained and surface defects increased, which accelerated the increase in the number of contamination particles after cleaning. These results suggest that contaminating particles and the breakdown voltage that causes defects in semiconductor devices can be controlled through the optimization of the APS coating process and cleaning process.

• 한국결정성장학회지
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• 제33권4호
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• pp.153-157
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• 2023

반도체 회로를 제조하기 위해서 에칭, 세척, 증착 등의 공정들이 반복적으로 진행된다. 따라서 이러한 공정이 진행되면 진공장비 내부는 부식성이 높은 가혹한 플라즈마 환경에 노출되게 된다. 따라서 반도체 공정 장비의 내부를 플라즈마 노출에 강한 재료를 사용하여 코팅층의 에칭과 오염 입자의 생성을 최소화하여야 한다. 본 연구에서는 고상합성법에 의해 합성된 옥시불화이트륨 (YOF)를 이용한 증착층의 플라즈마 식각 특성을 향상시키기 위하여 YOF 분말에 AlF₃ 분말을 혼합하여 플라즈마 스프레이 공정으로 Al 금속위에 증착시키고 그 특성을 분석하였다. AlF₃ 혼합비율의 증가에 따른 증착층의 결정구조, 미세구조 및 화학조성 변화를 조사하고 증착된 코팅층의 플라즈마 식각율을 측정하여 AlF₃ 혼합비율과의 상관관계를 분석하였다.

• 대한기계학회논문집B
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• 제25권12호
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• pp.1813-1820
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• 2001

The purpose of this study was to investigate the significant characteristics in atomization process of industrial etching spray fur the design or Precise pressure-swirl nozzles. The experiment was carried out with different viscosities and densities of the liquid. The macro characteristics of liquid spray, such as the spray angle and breakup process were captured by PMAS and the micro characteristics of liquid spray. such as droplet size and velocity measurements were obtained by PDA. The droplet axial and radial velocity and SMD were measured along axial and radial direction. The RMS of two velocities was measured along radial direction. It was found that the fluid with higher kinematic viscosity resulted in the larger SMD and the lower mean droplet velocity. And we could divide breakup processes into three regions that is atomization, non-dilution and dilution one in spray of pressure-swirl nozzle. The radial as well as axial velocity of droplet played an important role in the atomization process of higher kinematic viscosity fluid.

• 한국레이저가공학회지
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• 제16권4호
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• pp.12-16
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• 2013

For mass production of electronic devices, the processing of the printing roll is one of the most important key technologies for printed electronics technology. A roll of printing process, the gravure printing that is used to print the electronic device is most often used. The indirect laser processing has been used in order to produce printing roll for gravure printing. It consists of the following processing that is coating of photo polymer or black lacquer on the surface of printing roll, pattering using a laser beam and etching process. In this study, we have carried out study on the coating and etching for $25{\mu}m$ line width on the printing roll. To do this goals, a $4{\mu}m$ coating thickness and 20% average coating thickness of the coating homogeneity of variance is performed. The factors to determine the thickness and homogeneity are a viscosity of coating solution, the liquid injection, the number of injection, feed rate, rotational speed, and the like. After the laser patterning, a line width of $25{\mu}m$ or less was confirmed to be processed through etching and the chromium plating process.

• 한국표면공학회지
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• 제27권3호
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• pp.158-165
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• 1994

Cu-Cr alloy thin film requires good quality of etching be used for TAB technology. The etched cross sec-tion was clean enough when the etching was performed in 0.1M $FeCl_3$ solution at $50^{\circ}C$. The etching rate was increased with the amount of $KMnO_4$. For enhanced profile of cross section and rate, the spray etchning was found to be superior compared to the immersion etching. A series of experiments were performed to improve the uniformity of the current distribution in electrodeposition onto the substrate with lithographic patterns. Copper was electrodeposited from quiescent-solution, paddle-agitated-solution, and air-bubbled-solution to in-vestigate the effect of the fluid flow. The thickness profile of the specimen measured by profilmetry has the non uniformity at feature scale in quiescent-solution, because of the longitudinal vortex roll caused by the natural convection. However, uniform thickness profile was achieved in paddle-agitated or air bubbled solu-tion.