• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.11a
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• pp.160-160
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• 2008

In practical etching process, etch ant is sprayed on the metal-deposited panel through nozzles collectively connected to the manifold and that panel is usually composed of many PCB(printed circuit board)'s. The etching uniformity, the difference between individual PCB's on the same panel, has become one of most important features of etching process. In this paper, the prediction of nozzle trajectory has been performed by the combination of algebraic formula and numerical simulation. With the pre-determined geometrical factors of nozzle distribution, the trajectories of individual nozzles were predicted with the change of process operational factors such as panel speed, nozzle swing frequency and so on. As results, two dimensional distribution of impulsive force of etchant spray which could be considered as a key factor determining the etching performance have been successfully obtained. Though only qualitative prediction of etching uniformity have been predicted by the process developed in this study, the expansion to the quantitative prediction of etching uniformity is expected to be apparent by this study.

• Journal of the Korean institute of surface engineering
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• v.29 no.1
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• pp.60-72
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• 1996

A photoetching process is widely used for small and high precision parts in machinery, electronic and semi-conductor industries. One of the high precision parts, grid is very important part of digitron which use electron display, and it is fabricated by only photoetching process because of high precision. In this study, to develop high precision digitron grid, characteristics of etching solution were investigated with electrochemical test, that was potentiodynamic test and immersion test in the ferric chloride solution and added some additives. Based on the electrochemical etching test, grid was fabricated by continuous photoetching process at various etching condition. From the result of measured line width and etching depth under-cut and etching factor were calculated. For the fabrication of 25$\mu\textrm{m}$ line width, optimal etching condition was etching temperature 40~$45^{\circ}C$, spray pressure 1.5kg/$\textrm{cm}^2$ and etching time 3~4min.

• 연구논문집
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• s.23
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• pp.29-43
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• 1993

Photoetching of AISI 304 stainless steel in ferric chloride solution has been studied. This paper investigated on the single side etching characteristics of 304 stainless steel, especially influence of etching temperature, spray pressure of ferric chloride etchant, and etching time with $50\mum$ and $75\mum$ line width photomask.

• Proceedings of the KSME Conference
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• 2001.06d
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• pp.909-914
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• 2001

Fluid properties which are most commonly used to evaluate spray atomization characteristics, are important because they affect velocity and size distribution of droplets. The purpose of this study was to incorporate the significant characteristics in atomization process of industrial etching spray and how each of them affects the design of precise pressure-swirl nozzles. The experiment was carried out with different viscosity and density of fluid. The macro characteristics of liquid spray, such as the spray angle and shape were captured by PMAS and the micro characteristics of liquid spray, such as droplet size and velocity were obtained by PDA. The mean velocity and SMD of droplets were measured along axial and radial direction. It was found that the higher viscosity and density resulted in the larger SMD and the lower mean velocity of droplets.

• Journal of the Korean Electrochemical Society
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• v.11 no.2
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• pp.95-99
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• 2008

This study has made the electrode that is coated zirconium oxide on the titanium by ESD(Electrostatic spray deposition) coating methode. It has investigated the effects of the etching method of a Ti substrate as the preparation, making of zirconium oxide film and electrochemical characteristics of the electrode that is etched on the titanium. The HCl etching develops a fine and homogeneous roughness on the Ti substrate. Fabrication and material properties of the metal oxide electrode, which is known to be so effective to generate ozone and hypochlorous acid (HOCl) as power oxidant, were studied. A proper metal oxide material is focus zirconium oxide through reference. A coating method to enhance the fabrication reproducibility of the zirconium oxide electrode was used ESD coating method by zirconium oxychloride. Zirconium oxide films on the Ti substrate were tested using SEM, XRD, Cyclic voltammetry.

• Journal of the Semiconductor & Display Technology
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• v.21 no.3
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• pp.74-79
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• 2022

In this study, the plasma corrosion resistance and the change in the number of contamination particles generated using the plasma etching process and cleaning process of coating parts for semiconductor plasma etching equipment were investigated. As the coating method, atmospheric plasma spray (APS) was used, and the powder materials were Y₂O₃ and Y₃Al₅O₁₂ (YAG). There was a clear difference in the densities of the coatings due to the difference in solubility due to the melting point of the powdered material. As a plasma environment, a mixed gas of CF₄, O₂, and Ar was used, and the etching process was performed at 200 W for 60 min. After the plasma etching process, a fluorinated film was formed on the surface, and it was confirmed that the plasma resistance was lowered and contaminant particles were generated. We performed a surface cleaning process using piranha solution(H₂SO₄(3):H₂O₂(1)) to remove the defect-causing surface fluorinated film. APS-Y₂O₃ and APS-YAG coatings commonly increased the number of defects (pores, cracks) on the coating surface by plasma etching and cleaning processes. As a result, it was confirmed that the generation of contamination particles increased and the breakdown voltage decreased. In particular, in the case of APS-YAG under the same cleaning process conditions, some of the fluorinated film remained and surface defects increased, which accelerated the increase in the number of contamination particles after cleaning. These results suggest that contaminating particles and the breakdown voltage that causes defects in semiconductor devices can be controlled through the optimization of the APS coating process and cleaning process.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.33 no.4
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• pp.153-157
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• 2023

In order to manufacture a semiconductor circuit, etching, cleaning, and deposition processes are repeated. During these processes, the inside of the processing chamber is exposed to corrosive plasma. Therefore, the coating of the inner wall of the semiconductor equipment with a plasma-resistant material has been attempted to minimize the etching of the coating and particle contaminant generation. In this study, we mixed AlF₃ powder with the solid-state reacted yttrium oxyfluoride (YOF) in order to increase plasma-etching resistance of the plasma spray coated YOF layer. Effects of the mixing ratio of AlF₃ with YOF powder on crystal structure, microstructure and chemical composition were investigated using XRD and FE-SEM. The plasma-etching ratios of the plasma-spray coated layers were calculated and correlation with AlF₃ mixing ratio was analyzed.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.25 no.12
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• pp.1813-1820
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• 2001

The purpose of this study was to investigate the significant characteristics in atomization process of industrial etching spray fur the design or Precise pressure-swirl nozzles. The experiment was carried out with different viscosities and densities of the liquid. The macro characteristics of liquid spray, such as the spray angle and breakup process were captured by PMAS and the micro characteristics of liquid spray. such as droplet size and velocity measurements were obtained by PDA. The droplet axial and radial velocity and SMD were measured along axial and radial direction. The RMS of two velocities was measured along radial direction. It was found that the fluid with higher kinematic viscosity resulted in the larger SMD and the lower mean droplet velocity. And we could divide breakup processes into three regions that is atomization, non-dilution and dilution one in spray of pressure-swirl nozzle. The radial as well as axial velocity of droplet played an important role in the atomization process of higher kinematic viscosity fluid.

• Laser Solutions
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• v.16 no.4
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• pp.12-16
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• 2013

For mass production of electronic devices, the processing of the printing roll is one of the most important key technologies for printed electronics technology. A roll of printing process, the gravure printing that is used to print the electronic device is most often used. The indirect laser processing has been used in order to produce printing roll for gravure printing. It consists of the following processing that is coating of photo polymer or black lacquer on the surface of printing roll, pattering using a laser beam and etching process. In this study, we have carried out study on the coating and etching for $25{\mu}m$ line width on the printing roll. To do this goals, a $4{\mu}m$ coating thickness and 20% average coating thickness of the coating homogeneity of variance is performed. The factors to determine the thickness and homogeneity are a viscosity of coating solution, the liquid injection, the number of injection, feed rate, rotational speed, and the like. After the laser patterning, a line width of $25{\mu}m$ or less was confirmed to be processed through etching and the chromium plating process.

• Journal of the Korean institute of surface engineering
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• v.27 no.3
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• pp.158-165
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• 1994

Cu-Cr alloy thin film requires good quality of etching be used for TAB technology. The etched cross sec-tion was clean enough when the etching was performed in 0.1M $FeCl_3$ solution at $50^{\circ}C$. The etching rate was increased with the amount of $KMnO_4$. For enhanced profile of cross section and rate, the spray etchning was found to be superior compared to the immersion etching. A series of experiments were performed to improve the uniformity of the current distribution in electrodeposition onto the substrate with lithographic patterns. Copper was electrodeposited from quiescent-solution, paddle-agitated-solution, and air-bubbled-solution to in-vestigate the effect of the fluid flow. The thickness profile of the specimen measured by profilmetry has the non uniformity at feature scale in quiescent-solution, because of the longitudinal vortex roll caused by the natural convection. However, uniform thickness profile was achieved in paddle-agitated or air bubbled solu-tion.