• Journal of the Semiconductor & Display Technology
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• v.2 no.1
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• pp.25-29
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• 2003

The fluid flow, mass transfer, heat transfer and film thickness variation during the spin coating process are numerically studied. The model is said to be I-dimensional because radial variations in film thickness, concentration and temperature are ignored. The finite difference method is employed to solve the equations that are simplified using the similarity transformation. In early time, the film thinning is due to the radial convective outflow. However that slows during the first seconds of spinning so the film thinning due to evaporation of solvent becomes sole. The time varing film thickness is analyzed according to the wafer spin speed, the various solvent fraction in the coating liquid, and the various solvent vapor fraction in the bulk of the overlying gas during the spin coating is estimated.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.9 no.6
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• pp.96-102
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• 2000

Spinning mechanism is generally used in coasting process on grass plates. Rebounding PR(Photo Resist) which leads to occur inferiority of coating process is caused by vibrational energy of whole coating system. In this study, the sensitivity analysis is performed to analyze and reduce vibrational terms in the spin coating system. The sensitivity analysis is bared on the numerical expression of this system. By the bond graph method. power flow of each system is represented by some basic bond graph elements. Any energy domain system is modeled using the unified elements. The modelled spin coater system is verified with power spectrum data measured by FFT analyzer. As the results of verifying model parameters and sensitivity analysis, principal factors causing vibration phenomenon are mentioned. A study on vibration method in the spin coating system is discussed.

• Journal of Sensor Science and Technology
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• v.26 no.5
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• pp.366-369
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• 2017

This work presents a detailed study of several parameters on the spray coating method for fabricating a flexible cantilever. Conventionally, spin coating method have been widely used in the microelectromechanical system (MEMS) fabrication process. However, the major drawback of this method is the difficulties in protecting various topography with photoresist film, particularly when the device is manufactured in high aspect ratio. It is also a challenging process to form a small pattern in the etched area. On the other hand, the commercial spray coating systems are not advantageous from an economic perspective and the technique is also providing less efficient. In order to solve these issues, we have developed a manual spray coating system which can be efficiently used by combining the accessories available in the laboratory. The developed spray coating system consists of a spin-coater, motorized stage, a spray gun with the capable of controlling centrifugal force, injection amount, injection angle, and spray range. The major advantage of the proposed spray coating system is its reasonable fabrication cost. Secondly, the system can be easily disassembled after finishing the coating experiment. Owing to the mentioned advantages, we sincerely believe that the proposed spray coating system can be effectively used in many related applications.

• Environmental Engineering Research
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• v.24 no.4
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• pp.646-653
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• 2019

Recovery of valuable metals in the industrial wastewater and sludge has attracted an attention owing to limited metallic resources in the earth. In this study, we firstly fabricated Ti/Ir-Ru electrodes by spin coating technique for effective recovery of Cu in electrowinning process. Two different Ti/Ir-Ru electrodes were fabricated using 100 and 500 mM of precursors (i.e., Ir-Ru). SEM-EDX and AFM revealed that Ir and Ru were homogenously distributed on the surface of Ti plate by the spin coating, in particular the electrode prepared by 500 mM showed distinct boundary line between Ir-Ru layer and Ti substrate. XRD, XPS, and cyclic voltammetry also revealed that characteristics of IrO₂, RuO₂, and TiO₂ and its electrocatalytic property increased as the concentration of coating precursor increased. Finally, we carried out Cu recovery experiments using two Ti/Ir-Ru as anodes in electrowinning process, showing that both anodes showed a complete removal of Cu (1 and 10 g/L) within 6 h reaction, but much higher kinetic rate constant was obtained by the anode prepared by 500 mM. The findings in this study can provide a fundamental knowledge for surface characteristics of Ti/Ir-Ru electrode prepared by spin coating method and its potential feasibility for effective electrowinning process.

• Journal of IKEEE
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• v.27 no.1
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• pp.78-84
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• 2023

In this paper, front color glass for Building Integrated Photovoltaic (BIPV) system was implemented by spin coating method using color solution. Solutions suitable for color solutions were investigated using pearlescent pigments and various solutions to implement color glass. One of investigated solutions, NOA 63 and NOA 65, which are ultraviolet light curing agents, were able to implement color glass with superior coating properties and color reproducibility than other solutions. Color glass realized by spin coating with a NOA 65 based color solution showed high transmittance of 86% in the visible and near-infrared wavelength bands, and the change in optical properties of color glass over time was insignificant, making it a suitable material for realizing color glass for BIPV Suitable as a color solution. The solution process method using the spin coating method is expected to facilitate the manufacturing process of front color glass for BIPV as it can produce color glass more easily and quickly than the existing physical deposition method or color glass manufacturing process using nanoparticles.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.26 no.6
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• pp.425-428
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• 2013

In this paper, we present a novel hydrophilic coating material (Wellture Finetech, Korea) which can be utilized as a coating layer for anti-contamination for electrical and electronic system. The coating material was deposited on 4 inch silicon wafer with several different film thickness. The film thickness was controlled by spin coating speed. After curing of the film, we have scratched by permanent marker to check self-cleaning property of the film. Also we have executed several mechanical tests of the films. As the spin coating speed is increased, the film thickness was thinned from 230 nm to 125 nm. Contact angle of the film was lowered from $30^{\circ}$ to $12^{\circ}$ as the spin coating speed is increased from 700 to 2,500 rpm. On permanent marker scratched film surface coated at 1,000 rpm, we have poured regular city water to investigate self cleaning property of the film. The scratches were gradually separated from the film surface due to super-hydrophilicity of the film. Hardness of spin coated film was 9H measured by ASTM D3363 method. and adhesion of all film was 5B tested by ASTM D3359 method. Also, to get exact hardness value of the film, we have utilized a nano-indenter. As spin speed is increased, the hardness of film was increased from 3 GPa to 5 GPa.

• Proceedings of the Korean Magnestics Society Conference
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• 1999.10a
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• pp.82-83
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• 1999

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.14 no.9
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• pp.757-761
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• 2001

We studied emitting properties of organic electroluminescent devices fabricated using the spin-coating and Langmuir-Blodgett(LB) technique. The LB technique has the advantage of precise control of the thickness better than spin-coating method. LB monolayer of poly(3-hexylthiophene)(P3HT) was deposited 27 layers onto the indium-tin-oxide(ITO) substrate as Y-type films by the vertical dipping method. In the absorption spectra, the λ$\_$max/ of P3HT-AA LB films and of spin-coating films showed about at 510, 545 and 590 nm corresponding to 2.43, 2.28, 2.10eV. And we observed that the turn-on voltage of devices deposited by LB method(10V) was higher than that of spin-coating method(8.5V) in voltage-current-luminance characteristic. In the logV-logJ characteristics of ITO/P3HT-AA LB/Al device, we confirmed that El device fabricated by LB method follows three conduction mechanisms: ohmic, space-charge-limited current(SCLC) conduction and trapped-carrier-limited space-charge current(TCLC) conduction.

• Proceedings of the KSME Conference
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• 2001.11b
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• pp.59-64
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• 2001

The fluid flow, mass transfer and film thickness variation during a wafer spin coating process are numerically studied. Governing equations for the cylindrical coordinates are simplified using the similarity transformation and solved efficiently using the finite difference method. Concentration dependent viscosity and the binary diffusivity of the coating liquid are used in the analysis. The time variational velocity components of the coating liquid and the film thickness are analyzed according to the various spin speed. When the evaporation is considered, the flow decease in the early times due to the increase of the viscosity and the resultant flow resistance. Effects of the two film thinning mechanism, the flow-out and evaporation are also considered in the analysis.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.11a
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• pp.115-116
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• 2008

The ferroelectric vinylidene fluoride-trifluoroethylene ($VF_2$-TrFE) and $Al_2O_3$ passivation layer for the Metal/Insulator/Ferroelectric/Semiconductor (MIFS) structure were deposited using spin coating and remote plasma atomic layer deposition (RPALD), respectively. A 2.5 ~ 3 wt % diluted solution of purified vinylidene fluoride-trifluoroethylene ($VF_2$: TrFE=70:30) in a DMF solution were prepared and deposited on silicon wafer at a optimized spin speed. After annealing in a vacuum ambient at 150 ~ $200^{\circ}C$ for 60 min, upper insulator layer were deposited at temperature ranging from 100 ~ $150^{\circ}C$ by RPALD. We described electrical and structural properties of MIFS fabricated by spin coating and RPALD methods.