• 제목/요약/키워드: Specific resistance ($K_2'$)

검색결과 605건 처리시간 0.033초

가스보일러용 STS 304의 부식특성에 미치는 용수의 비저항의 영향 (Effect of the Specific Resistance of Water on Corrosion Characteristics of STS 304 for Gas Boiler)

  • 임우조;김환식;윤병두
    • 수산해양교육연구
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    • 제19권3호
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    • pp.323-328
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    • 2007
  • This paper was studied on the effect of the specific resistance of water on corrosion characteristics of STS 304 for gas boiler. The electrochemical polarization test of STS 304 for gas boiler was carried out. And the polarization resistance, uniform corrosion, corrosion behavior by impressed potential and corrosion sensitivity of STS 304 with specific resistance were considered. The main results are as following: 1) With being low the specific resistance of water, the polarization resistance and corrosion potential of STS 304 decreases, while corrosion current density increases. 2) Under constant impressed potential, the corrosion sensitivity of STS 304 is large with being low the specific resistance due to synergy effect of Cl ion.

다공성 필터에서의 여과 분진층 비저항 연구 (Specific Resistance (K2´) of Dust Layer Deposited on Porous Media)

  • 이선희;이경미;조영민
    • 한국대기환경학회지
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    • 제20권3호
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    • pp.371-380
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    • 2004
  • In the dust separation by using porous filter media, the structure of dust layer deposited on the filter surface of filter medium directly affects the effective filtration. The present study has investigated the specific resistance (K$_2$') of the dust layer and its porosity ($\varepsilon$$_{c}$) for three different filters; FA composite filter, metal fiber filter and stainless filter. The specific resistance (K$_2$') increased and at the same time the cake porosity ($\varepsilon$$_{c}$) decreased with the increase of filtration velocity, possibly due to the compressible effect of dust layer. However, under the low dust concentration, subsequent dust particles would block the open channels through the layer resulting in high specific resistance of the layer. The FA composite filter among three filters was shown to be the most effective filter for dust cake filtration at low filtration velocities less than 0.1 m/s for an approximate dust concentration of 5 g/㎥.

우리나라 쟁기와 Plow의 산인저항의 관한 비교연구 (A Comparison Test of Eastern and Western Plow in Draft Resistance)

  • 최재갑
    • 한국농공학회지
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    • 제12권3호
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    • pp.2035-2042
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    • 1970
  • Korean Janggi and Western plow to have developed for a long time in the east and west were tested and compared in their draft resistance. The charaderistic of Korean Janggi and plow to be able to make deep plowing, on of the most important factors influeneed the increased yield, were ofserved. The study was undertaken to obtain these basic factors' to device and construct the deep plowing Janggi. The results were as follow; 1. The draft resistance of Korean Janggi far less than that of plow and on the dry field, the influence of soil moisture contant to the draft resistance was larger in the Korean Janggi than in the western plow, but on the rice paddy, there was not differences between them. 2. The plow was more stable than that of Janggi in their operation. 3. The relation ship between the specific draft resistance and plowing depth was shown bygthe carved equation. $$K=Ax+\frac{B}{x}+C$$(K ; specific draft restance, x; plowing depth) A, B, C; Constant controled by soil and instrument factor) 4. Minimam values of the specific draft resistance were as follow; a. On the dry field; Korean Janggi; x = $8{\sim}14cm$ $4K=280{\sim}330gr/cm^2$$ Westean plow; x=$10{\sim}12cm$ $$K=480{\sim}490gr/cm^2$$ 6. On the rice paddy; Korean Janggi; x=$8{\sim}12cm$ $$K=255{\sim}280gr/cm^2$ Western plow; x=$7{\sim}10cm$ $$K=415{\sim}420grc/m^2$$

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Structure Modeling of 100 V Class Super-junction Trench MOSFET with Specific Low On-resistance

  • Lho, Young Hwan
    • 전기전자학회논문지
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    • 제17권2호
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    • pp.129-134
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    • 2013
  • For the conventional power metal-oxide semiconductor field-effect transistor (MOSFET) device structure, there exists a tradeoff relationship between specific on-resistance ($R_{ON.SP}$) and breakdown voltage ($V_{BR}$). In order to overcome the tradeoff relationship, a uniform super-junction (SJ) trench metal-oxide semiconductor field-effect transistor (TMOSFET) structure is studied and designed. The structure modeling considering doping concentrations is performed, and the distributions at breakdown voltages and the electric fields in a SJ TMOSFET are analyzed. The simulations are successfully optimized by the using of the SILVACO TCAD 2D device simulator, Atlas. In this paper, the specific on-resistance of the SJ TMOSFET is successfully obtained 0.96 $m{\Omega}{\cdot}cm^2$, which is of lesser value than the required one of 1.2 $m{\Omega}{\cdot}cm^2$ at the class of 100 V and 100 A for BLDC motor.

SS41강의 부식피로파양에 미치는 해양환경인자의 영향 (The Influence of Marine Environmental Factor on the Corrosion Fatigue Fracture of SS41 Steel)

  • 김원영;임종문
    • Journal of Advanced Marine Engineering and Technology
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    • 제15권1호
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    • pp.51-58
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    • 1991
  • Corrosion fatigue test was performed by the use of plane bending fatigue tester in marine environment having various specific resistance from 25(natural sea water) to 5000.ohm.cm. It is in order to investigate the effects of marine environmental factor on the corrosion fatigue fracture of SS41 steel. The main results obtained are as follows; 1. The aspect ratio(b/a) of corner crack growing in natural sea water is lower than that in air. 2. The surface crack growth rate(da/dN) in marine environment is faster than that in air and da/dN delaies with the specific resistance increased. 3. The experimental constant m of paris rule [da/dN=C(${\delta}$K)$^m$] decrease with the specific resistance decreased and the effect of corrosion in proportion to the specific resistance is more sensitive than that of stress intensity factor range(${\delta}$K) under region II. 4. The accelerative factor(${\alpha}$) in marine environment is about 1.1-2.7 and .alpha. is increase under the low region of stress intensity factor range(${\delta}$K). 5. The electrode potential($E_0$) gets less noble potential with the specific resistance decreased.

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반응표면분석법을 이용한 전도성물질의 절연코팅 프로세스의 최적화 (Optimization of Process Variables for Insulation Coating of Conductive Particles by Response Surface Methodology)

  • 심철호
    • Korean Chemical Engineering Research
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    • 제54권1호
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    • pp.44-51
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    • 2016
  • 전도성 물질인 철 입자(iron particles)를 절연체로 코팅하여 제작한 압분자심(powder core)은 비저항이 작기 때문에 고주파 영역에서 와전류 손실이 크다. 이 결함을 해결하기 위해서는 압분자심의 비저항을 증가시킬 필요가 있다. 이 연구에서는 압분자심의 비저항을 증가시키기 위하여 유성볼밀을 사용하여 전기전도성 철 입자에 산화제2구리를 코팅하였다. 반응표면분석법을 사용하여 코팅변수를 최적화하였다. 최적화 시 인자는 CuO 질량분율, 밀 회전 수, 코팅시간, 볼 크기, 볼 질량, 시료 질량이며, 반응변수는 비저항이었다. 6인자-일부요인배치법에 의하면 주된 인자는 CuO 질량분율, 밀 회전 수, 코팅시간이었다. 3-인자 완전요인배치법과 최대경사법을 사용하여 3개 인자의 수준을 선정하였다. 최대경사법을 사용하여 최고의 비저항을 갖는 영역에 접근하였다. 최종적으로 Box-Behnken법을 사용하여 스크린한 인자들의 반응표면을 분석하였다. Box-Behnken법 결과에 의하면 CuO 질량분율과 밀 회전 수가 코팅공정 효율에 영향을 주는 주요 인자이었다. CuO 질량분율이 증가함에 따라 비저항은 증가하였다. 그에 반해서 밀 회전 수가 감소함에 따라 비저항은 증가하였다. 코팅공정을 최적화한 모델로부터 계산한 예측값과 실험값과는 통계적으로 유의하게 일치하였다($Adj-R^2=0.944$). 비저항의 최고값을 갖는 코팅조건은 CuO 질량분율은 0.4, 밀 회전 수는 200 rpm, 코팅시간은 15분이었다. 이 조건에서 코팅한 정제의 비저항 측정값은 $530k{\Omega}{\cdot}cm$이었다.

HEMT소자 공정 연구 (Part II. HEMT 구조에서의 Online 접촉저항) (A Study on HEMT Device Process (Part II. Ohmic Contact Resistance in GaAs/AlGaAs Hetero-Structure))

  • 이종람;이재진;박성호;김진섭;마동성
    • 대한전자공학회논문지
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    • 제26권10호
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    • pp.1545-1553
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    • 1989
  • The ohmic contact behavior in HEMT structure was compared with that in MESFET one throughout the specific contact resistance and microstructural change in both structures. A Au-Ge-Ni based metallization scheme was used and the alloying temperature of the ohmic materials was changed from 330\ulcorner to 550\ulcorner. The alloying temperature to obtain the minimum specific contact resistance in HEMT structure was 60k higher than that in MESFET. The volume fraction of NiAs (Ge) in MESFET structure increases with alloying temperature and/or the alloying time, which makes the decrease of specific contact resistance at the initial stage of ohmic metallization. In contrast, the volume fraction of NiAs(Ge) in HEMT structure was not dependent upon the specific contact resistance, which implies that the ohmic contacts are dominantly formed by the Ge diffusion to 2-DEG(two dimensional electron gas) layer.

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열처리된 그래핀 산화물을 정공주입층으로 이용한 유기발광 다이오드 (Thermally Adjusted Graphene Oxide as the Hole Transport Layer for Organic Light-Emitting Diodes)

  • 신성범
    • 한국생산제조학회지
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    • 제24권4호
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    • pp.363-367
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    • 2015
  • This paper reports on thermally adjusted graphene oxide (GO) as the hole transport layer (HTL) for organic light-emitting diodes (OLEDs). GO is generally not suitable for HTL of OLEDs because of intrinsic specific resistance. In this paper, the specific resistance of GO is adjusted by the thermal annealing process. The optimum specific resistance of HTL is found to be $10^2{\Omega}{\cdot}m$, and is defined by the maximum current efficiency of OLEDs, 2 cd/A. In addition, the reasons for specific resistance change are identified by x-ray photoelectron spectroscopy (XPS). First, the XPS results show that several functional groups of GO were detached by thermal energy, and the amount of epoxide changed substantially following the temperature. Second, the full width at half maximum (FWHM) of the C-C bond decreased during the process. That means the crystallinity of the graphene improved, which is the scientific basis for the change in specific resistance.

W/InGaN Ohmic 접촉의 전기적 구조적 특성연구 (Electrical and structure properties of W ohmic contacts to InGaN)

  • Han-Ki Kim;Tae-Yeon Seong
    • 한국재료학회:학술대회논문집
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    • 한국재료학회 1999년도 추계학술발표강연 및 논문개요집
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    • pp.76-76
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    • 1999
  • Low resistance ohmic contacts to the Si-doped InGaN(~$\times$10$^{19}$ ㎤) were obtained using the W metallization schemes. Specific contact resistance decreased with increasing annealing temperature. The lowest resistance is obtained after a nitrogen ambient annealing at 95$0^{\circ}C$ for 90s, which results in a specific contact resistance of 2.75$\times$10$^{-8}$$\textrm{cm}^2$. Interfacial reactions and surface are analyzed using x-ray diffraction, transmission electron microscopy (TEM) and scanning electron microscopy (SEM). The X-ray diffraction results show that the reactions between the W film and the InGaN produce a $\beta$-W$_2$N phase at the interface. TEM results also show that the $\beta$-W$_2$N has a rough interface, which increase contact area. It shows that the morphology of the contacts is stable up to a temperature as high as 95$0^{\circ}C$. Possible mechanisms are proposed to describe the annealing temperature dependence of the specific contact resistance.

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겉보기 응력 개념에 기반한 공구각에 따른 비절삭저항 변화 분석 (Analysis on Specific Cutting Resistance Variation by Tool Angles Based on a Concept of Representative Stres)

  • 전은채;최환진;이규민;이윤희;제태진;김정환;최두선
    • 한국기계가공학회지
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    • 제13권2호
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    • pp.64-72
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    • 2014
  • In the past, prism patterns have been linear triangular shapeswith a $90^{\circ}$ angle; however, new micro prism patterns having acute angles or obtuse angles have recently been the subject of demandin the display, lighting and photovoltaic industries. Micro-cutting experiments for micro-prism patterns having $60^{\circ}$, $90^{\circ}$, and $120^{\circ}$ angles on an electroplated Ni mold were performed and it was found in this study that the specific cutting resistance increased with a decrease in the tool angles (prism pattern angles). The cause of this variation had been thought to be the increase of the ploughing force due to tip rounding and the friction force due to the edge effect. However, the depth of the cut was large enough that it was possible to neglect these effects. Therefore, this study introduced the concept of representative stress of indentation. The measured stress was varied according to the indentation depth eventhoughthetestedspecimenswereidentical ; the varied stress was termed the representative stress. According to indentation theory, the strain that the Ni mold experienced increased with a decrease in the tool angle. Based on the stress-strain relationship, higher strain means higher stress and higher specific cutting resistance. Therefore, the specific cutting resistance was higher at smaller tool angles that had higher strain and stress.