• 한국생산제조학회지
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• 제8권3호
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• pp.76-82
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• 1999

This study was carried out to verify finding performance of dental diamond bur and investigate the possibility of AE application in density field. Work pieces were made of acryl and bovine respectively for the experiments in this study. Grinding test was conducted to get the data of grinding resistance and specific finding energy of low different types of diamond bur by using tool dynamometer. AE signal was acquired to verify grinding process in the AE measuring system. AErms value was increased as the grinding velocity and depth were increasing, but it decreased as the feed rate was increasing. The case of the small value of AE signal is due to abnormal grinding in D type diamond bur. By analyzing AErms start and finish time of grinding working, abnormal grinding state can be confined. Abnormal state can be found through the behavior of AE signal in the finding working. As a result, it is expected that forecast of abnormal state is possible using AE equipments under real time process.

• 한국기계가공학회지
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• 제1권1호
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• pp.55-62
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• 2002

This investigation reports the grinding characteristics of titanium alloy(Ti-6AI-4V). Grinding experiments were performed at various grinding conditions. The grinding forces were measured to investigate the grindability of titanium alloy with the five different wheels including Green carbide, Alumina, Resin Diamond, Resin CBN and Vitrified CBN. To investigate the grinding characteristics of titanium alloy grinding force, force ratio, specific grinding energy and grinding-ratio were measured. Surface roughness was also measured with tracer and the ground surfaces were observed with SEM Residual stress measurement was conducted on the X-Ray Diffractometer. Force ratio of grinding of titanium alloy was very lower than that of grinding of SKD-11 Surface roughness with Resin Diamond wheel was a little larger and rougher surface than that with other wheels Grinding ratio of titanium alloy was a little lower than that of other materials. Grinding ratio of titanium alloy with Diamond wheel was almost six times larger than that With CBN wheel. As a result of five different wheels, the most excellent wheel in grinding of Titanium alloy was Resin Diamond wheel.

• 한국자동차공학회논문집
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• 제2권6호
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• pp.38-49
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• 1994

In this study, grindability of some representative engineering ceramics are experimentally investigated using resin bond diamond wheel with conventional surface grinding machine, and proper grinding conditions which can be obtained from various experimental results are established also for mechanical components which are proper to domestic circumstances with high reliability. And through the results of experiment, it is confirmed that grinding energies of the ceramics, especially in the case of $Al_2O_3$, are lower than steel with same machining condition in the conventional grinding because of their fine-brittle fracture mode type removal process, though the ceramics are well-known to unmachinable materials. And moreover, the total pass numbers needed for spark-out process to be completed are depend on their mechanical properties because that grinding stiffness is different from each other. The grinding force, ginding power and ground surface roughness are also measured and compared. Furthermore, the experiments carried out in this study, some useful results are obtained with can guide to grind engineering ceramics with conventional surface grinding machine.

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 1999년도 춘계학술대회 논문집
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• pp.128-133
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• 1999

In recent years, LSI devices have become more powerful and lower-priced, caused by a development of various wafer materials and an increase in the diameter of wafers. On the other hand, these have created some serious problems in manufacturing of wafers because materials used as semiconductor substrate are very brittle. In view of this fact, there are some trials to apply shear-mode(or ductile-mode) grinding for efficient manufacturing of semiconductor wafers instead of conventional lapping process. In fact grinding process that has not only more excellent degree of accuracy but also more adaptable to fully automated manufacturing than lapping, is already used in Si machining field. This paper described the elementary studies to establish the grinding technology of wafers. First, we investigated the variation of grinding force and the transition of grinding mode as various grinding conditions. Then, it was inspected that the change of grinding force affected the integrity such as the topography and the roughness of ground surfaces, and led to the chemical defects generation and distribution in damaged layer. The degree of defects was estimated by FT-IR(Fourier Transformed Infrared) Spectroscopy and Auger Electron Spectroscopy

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 2000년도 춘계학술대회논문집 - 한국공작기계학회
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• pp.459-464
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• 2000

In this paper, it verifies the relationships between wheel velocity and surface roughness with the mirror surface grinding using electrolytic in-process dressing (ELID). In the general, as wheel velocity is high, surface roughness is better on the base of grinding theory. However, the relationships between wheel velocity and surface roughness is undefined due to the effect of electro-chemical dressing and the characteristics of materials. According to above relationships, ELID grinding experiment is carried out by following the change of wheel velocity. As the result of this study, it is found that surface roughness is not better as linearly as the increase of wheel velocity, but the limit of wheel velocity exists according to the characteristics of materials. Also, in contradiction to the present trend of high wheel velocity of manufacturing system for high surface integrity, it is able to expected to the base on the development of new ultra precision grinding method with the practicality of mirror surface grinding using ELID grinding method.

• 한국정밀공학회지
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• 제16권4호통권97호
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• pp.148-154
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• 1999

This study was carried out to verify grinding performance of dental diamond bur and investigate the possibility of AE application in dentistry field. Workpieces were made of acryl and bovine respectively for the experiments in this study. Grinding test was conducted to get the data of grinding resistance and specific grinding energy of four different types of diamond bur by using tool dynamometer. AE signal was acquired to verify grinding process in the AE measuring system. Tool wear was observed to find parameters about grinding characteristics of diamond bur by means of SEM picture. It was found that the wear of dental diamond bur could be detected with polishing of grinding material, removal of adhesive parts, wear of particles neighboring cutting nose, loss of material and elevation of temperature. The wear of B, C, D type diamond bur is due to wear and fracture of grain size. Abnormal state can be found through the behavior of AE signal in the grinding working. As a result, it is expected that forecast of abnormal state is possible using AE equipments under real time process.

• 한국기계가공학회지
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• 제21권6호
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• pp.36-43
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• 2022

Automobile brake discs are a major part of automobiles that are directly related to driver safety, and prevention of judder and squall noise is very important. This phenomenon occurs for complex reasons such as the precision and assembly of the brake module, and the material of the brake disc. The purpose of this study is to analyze the effect of the grinding wheel's grain size on the grinding conditions when machining cast iron, the material of the brake disc, and to derive the optimal grinding conditions through this.

• 한국공작기계학회논문집
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• 제11권3호
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• pp.86-92
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• 2002

In this study, experiments were carried out to investigate the characteristics of grinding and wear process of diamond wheel far ceramic materials. Normal component of grinding resistance of $Al_2$O$_3$ was less then that of $Si_3 N_4$ and $ZrO_2$. This seems to be the characteristics of ceramic tools on work pieces both of high hardness. For the case of $Si_3 N_4$ and $ZrO_2$, as the mesh number of wheel increases, the surface roughness decreases. For the case of $Al_2 O_3$, the surface roughness does not decreases. Specific binding energy decreases as the material removal rate per unit time increases. For the case of $Si_3 N_4$ and $ZrO_2$, grinding is carried out by abrasive wear processes. For the case of $Al_2 O_3$, grinding is carried out by grain shedding process due to brittle fracture.

• 한국기계가공학회지
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• 제16권5호
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• pp.40-46
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• 2017

A plasma gas control apparatus for semiconductor plasma etching processes securely holds a cathode for forming a plasma, confines the plasma during the plasma etching process, and discharges gas after etching. It is a key part of the etching process. With the advancement of semiconductor technology, there is increasing interest in parts for semiconductor manufacturing that directly affect wafers. Accordingly, in order to replace the plasma gas control device with a CVD-SiC material superior in mechanical properties to existing SiCs (Sintered-SiC, RB-SiC), a study on the grinding characteristics of CVD-SiC was carried out. It is confirmed that the optimal grinding condition was obtained when the result table feed rate was 2 m/min and the infeed depth was $5{\mu}m$.

• 한국기계가공학회지
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• 제17권1호
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• pp.16-22
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• 2018

Silicon carbide (SiC) is used in various semiconductor processes because it has superior thermal, mechanical, and electrical characteristics as well as higher chemical and corrosion resistance than existing materials. Due to these characteristics, various manufacturing technologies have been developed for SiC. A recent development among these technologies is Chemical Vapor Deposition SiC (CVD-SiC). Many studies have been carried out on the processing and manufacturing of CVD-SiC due to its different material characteristics compared to existing materials like RB-SiC or Sintered-SiC. CVD-SiC is physically stable and has excellent chemical and corrosion resistance. However, there is a problem with increasing the thickness, because it is manufactured through a deposition process. Additionally, due to its high strength and hardness, it is difficult to subject to machining.