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http://dx.doi.org/10.14775/ksmpe.2018.17.1.016

Analysis of Grinding Characteristics of Ceramic (SiC) Materials  

Park, Hwi-Keun (School of Mechanical Engineering, KUMOH UNIV.)
Park, Sang-Hyeon (School of Mechanical Engineering, KUMOH UNIV.)
Park, In-Seung (School of Mechanical Engineering, KUMOH UNIV.)
Yang, Dong-Ho (School of Mechanical Engineering, KUMOH UNIV.)
Cha, Seung-Hwan (School of Mechanical Engineering, KUMOH UNIV.)
Ha, Byeong-Cheol (School of Mechanical Engineering, KUMOH UNIV.)
Lee, Jong-Chan (School of Mechanical Engineering, KUMOH UNIV.)
Publication Information
Journal of the Korean Society of Manufacturing Process Engineers / v.17, no.1, 2018 , pp. 16-22 More about this Journal
Abstract
Silicon carbide (SiC) is used in various semiconductor processes because it has superior thermal, mechanical, and electrical characteristics as well as higher chemical and corrosion resistance than existing materials. Due to these characteristics, various manufacturing technologies have been developed for SiC. A recent development among these technologies is Chemical Vapor Deposition SiC (CVD-SiC). Many studies have been carried out on the processing and manufacturing of CVD-SiC due to its different material characteristics compared to existing materials like RB-SiC or Sintered-SiC. CVD-SiC is physically stable and has excellent chemical and corrosion resistance. However, there is a problem with increasing the thickness, because it is manufactured through a deposition process. Additionally, due to its high strength and hardness, it is difficult to subject to machining.
Keywords
Grinding Characteristics Analysis; Grinding Force; Material Removal Tate; Specific Grinding Energy; Surface Roughness;
Citations & Related Records
Times Cited By KSCI : 3  (Citation Analysis)
연도 인용수 순위
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