• 제목/요약/키워드: Solidification microstructure

검색결과 241건 처리시간 0.023초

AC4A 알루미늄 합금의 주조특성에 미치는 미량 첨가원소의 영향 (Effect of Minor Additives on Casting Properties of AC4A Aluminum Casting Alloys)

  • 오승환;김헌주
    • 한국주조공학회지
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    • 제37권5호
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    • pp.148-156
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    • 2017
  • The effects of minor additives on the casting properties of AC4A aluminum alloys were investigated. Measurements of the cooling curve and microstructure observations were conducted to analyze the effects of Ti-B and Sr minor elements during the solidification process. A fine grain size and an increase in the crystallization temperature for the ${\alpha}-Al$ solution were evident after the addition of 0.1wt% Al-5%Ti-1%B additive. The modification effect of the eutectic $Mg_2Si$ phase with the addition of 0.05% Al-10%Sr additive was prominent. A fine eutectic $Mg_2Si$ phase and a decrease in the growth temperature of the eutectic $Mg_2Si$ phase were evident. Fluidity, shrinkage and solidification-cracking tests were conducted to evaluate the castability of the alloy. The combined addition of Al-5%Ti-1%B and Al-10%Sr additives showed the maximum filling length owing to the effect of the fine ${\alpha}-Al$ grains. The macro-shrinkage ratio increased, while the micro-shrinkage ratio decreased with the combined addition of Al-5%Ti-1%B and Al-10%Sr additives. The macro-shrinkage ratio was nearly identical, while the micro-shrinkage ratio increased with the addition of the Al-10%Sr additive. The tendency of the occurrence of solidification cracking decreased owing to the effect of the fine ${\alpha}-Al$ grains and the modification of the $Mg_2Si$ phase with the combined addition of Al-5%Ti-1%B and Al-10%Sr additives.

용융-응고법으로 제조된 Sm123 초전도체의 결정성장 기구 (The Grain Growth Mechanism of Sm123 Superconductor in Melt-Textured Growth Method)

  • 한상철;성태현;한영희;이준성;김상준
    • 한국초전도저온공학회:학술대회논문집
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    • 한국초전도저온공학회 2001년도 학술대회 논문집
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    • pp.9-12
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    • 2001
  • The microstructure evolution and the peritectic solidification of Sm$Ba_{2}$$Cu_{3}$ $O_{7-\delta}$ superconducting materials during the isothermal annealing were studied over the temperature range 1030-$1060^{\circ}C$ The faceted growth of the peritectic phase and its dependence upon Sm-diffusion in the liquid phase are discussed. A growth model is proposed to explain the growth shape of Sm123 crystals.

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Ag 첨가 및 볼밀링에 의한 Bi-2223/Ag 초전도 선재의 특성변화 (The effect of Ag addition and high-energy ball milling on Bi-2223 tapes)

  • 김영순;오상수;류강식;정대영;안중호
    • 한국초전도저온공학회:학술대회논문집
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    • 한국초전도저온공학회 2000년도 KIASC Conference 2000 / 2000년도 학술대회 논문집
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    • pp.101-103
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    • 2000
  • In the present work, we have investigated the combined effect of high-energy milling and Agb addition on microstructure and superconducting properties for Bi-2223/Ag. tape. The addition of siver plays an important role in enhancing liquid phase formation, Resulting in densification and cracking during solidification. Further study is needed for the optimization of Ag content and heat-treatment which can reduce the cracking.

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고속압밀 열가소성수지 복합재료의 인장 특성 (Tensile Properties of Rapid Consolidated Thermoplastic Composites)

  • 김홍건;최창용;유기현;김성철;양성모;노홍길
    • 한국공작기계학회:학술대회논문집
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    • 한국공작기계학회 2002년도 추계학술대회 논문집
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    • pp.504-507
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    • 2002
  • Glass fiber reinforced PET (Poly-Ethylene-Terephthalate) matrix composite was manufactured by rapid press consolidation technique as functions of temperature, pressure and time in pre-heating, consolidation and solidification stages. The optimal manufacturing conditions for this composite were discussed based on the void content, tensile, interlaminar shear, and impact properties. A tensile test was attempted to investigate the mechanical properties of the composite. It is found that the level of crystallinity and microstructure affects on the tensile properties substantially.

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Lead-Free Solders and Processing Issues Relevant to Microelectronics Packaging

  • Kang, Sung K.
    • 한국마이크로전자및패키징학회:학술대회논문집
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    • 한국마이크로전자및패키징학회 2003년도 International Symposium
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    • pp.147-163
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    • 2003
  • European Union bans the usage of Pb in electronics from July 1 st, 2006. The Near-eutectic Sn-Ag-Cu alloys are the leading candidate Pb-free solders (for SMT card assembly). .The microstructure of Sn-Ag-Cu alloys is discussed in terms of solidification, composition and cooling rate. Methods of controlling Ag3Sn plates are discussed. .Thermo-mechanical fatigue behaviors of Sn-Ag-Cu solder joints are reviewed. Tin pest, whisker growth, electromigration of Pb-free solders are discussed.

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Cu-1.1wt% Al2O3 합금의 미세 조직과 기계적 성질 (Microstructure and Mechanical Properties of Cu-1.1wt% Al2O3 Alloy with Cu-1.1wt% Al2O3 Powders)

  • 김경환
    • 열처리공학회지
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    • 제14권2호
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    • pp.96-102
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    • 2001
  • $Al_2O_3$-copper alloy has been successfully made by gas atomization, mechanical alloying and hot pressing. In order to investigate microstructure and phase, it has been studied by using scanning electron microscope, transmission electron microscope and X-ray diffractometor. Mechanical properties have been examined using hardness tester and compressive tester according to annealing temperature. Although comparatively large Cu-Al powders are milled, the reaction between Cu-Al and $Cu_2O$ occurs and very fine $Al_2O_3$ particles in the matrix particles (5-10nm) are obtained. Compressive strength of this alloy is more than that of GlidCop Al60.

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가압연속주조법에 의한 SiCp/Al 합금기 복합재료의 조직 및 특성 (Microstructure and Characteristics of SiCp/Al-4.5wt%Cu-1wt%Mg Composites by Pressurized Continuous Compo-Casting)

  • 이학주;홍준표
    • 한국주조공학회지
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    • 제11권1호
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    • pp.71-78
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    • 1991
  • Microstructure and characteristics of the SiCp/Al-4.5wt%Cu-1wt%Mg composites fabricated by the combination of the compocasting and the pressurized continuous casting process, which is one of the processes to decrease the limitations of the size, and shops of the products, are investigated. The main results are as follows: 1) the SiCp/Al alloy matrix composites can be made continuously 2) as the amount of SiCp addition increases; (1) the degree of directional solidification of matrix structure decreases, and that of SiCp dispersion improves, (2) wear resistance improves, and especially these composites show the excellent wear resistance under the high sliding speed and high final load condition, (3) wear mechanism of these composites is changed from adhesive wear into abrasive wear, and the tendency of that becomes outstanding with increasing sliding speed.

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저압주조품의 미세조직과 기계적성질에 미치는 금형온도의 영향 (Effect of the Mold Temperatures on the Microstructure and Mechanical Properties of Low Pressure Die-Cast Product)

  • 이정근;박종성;김명호
    • 한국주조공학회지
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    • 제18권3호
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    • pp.254-261
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    • 1998
  • Microstructure and mechanical properties of the low pressure die-cast Al wheels were investigated by microscope, image analyzer, NDT (non-destructive test), and tensile test. The variation of SDAS (secondary dendrite arm spacing), porosity per unit area, quality grade, and tensile properties with the mold temperatures were examined. SDAS was gradually decreased with a decrease in temperature. However, the lowest value of porosity per unit area was observed at the mold temperature of $405^{\circ}C$ and the optimum mold temperature was found to be $405^{\circ}C$. Besides, from the observation of pore morphology, it was also found that the pore formation was mainly caused by shrinkage during solidification. The tensile strength, elongation, and impact toughness were markedly decreased, however the yield strength was nearly constant. The decrease of mechanical properties is attributed to the increase of porosity.

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탄소섬유 강화 Cu 기지 금속 복합재료의 Squeeze Cast 조직 및 내마멸특성 (Microstructure and Wear Properties of Squeeze Cast Carbon Fiber/Copper Alloy Metal Matrix Composite)

  • 김남수;지동철;조경목;박익민
    • 한국주조공학회지
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    • 제12권3호
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    • pp.238-247
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    • 1992
  • A carbon fiber(CF) reinforced Cu-10%Sn alloy matrix composite was successfully fabricated by squeeze casting method employing preheated graphite mold and proper process controlling factors. The matrix solidification microstructure of the Cu-10%Sn/CF composite reveals ${\alpha}-dendrite$ and ${\alpha}+{\delta}$ eutectoid. To compare the squeeze cast Cu-10%Sn/CF compostie with PM route fabricated Cu-graphite composites for electric contact material, mechanical wear and electrical arc wear tests were performed. Mechanical wear rate of the Cu-10%Sn/CF is much lower than that of the Cu-graphite composite. Weight loss with a variation of contact number in electrical arc wear tests shows a similar trend between the squeeze cast Cu-10%Sn/CF and PM Cu-graphite composites.

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