• 대한치과보철학회지
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• 제31권2호
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• pp.191-205
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• 1993

In order to compare the strength of soldered joints relative to the various sol dering method, soldering processes were performed using Palladium based ceramo-metal alloy(Bond-on 4)and Nickel-cromium alloy(Vera Bond). The obtained data include difference in strength between presoldering and postsoldering The data also contain difference among postsoldered groups for 3 difference soldering methods(torch, infrared. Oven) The following results were obtained : 1. For postsoldering with Pd alloy, the oven-using group showed the highest strength while the difference in strength between the torch-using group and the infrared machine group was negligible. 2. For Pd alloy with the torch method, postsoldering resulted in the higher strength than presoldering. 3. There was a negligible difference in strength between presoldering and postsoldering when Ni-Cr alloy with torch method is used. 4. Through microscopic study of the fractured surfaces, the torch-using group showed more porosity than both the oven-using and the infrared machine groups. 5. In terms of fracturing patterns, the oven-using group showed adhesive failure while both the torch and the infrared machine groups showed cohesive failure and cohesive-adhesive failure.

• Progress in Superconductivity
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• 제7권2호
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• pp.179-183
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• 2006

As a material for SFCL(Superconducting Fault Current Limiter), BSCCO tube with metal stabilizer is a promising candidate, assuring the stability and large power capacity, For the application, the proper soldering technique, which overcome the difficulties of the joining between BSCCO and metal stabilizer, is required. In this study, after soldering In-Bi solder and In-Sn solder with BSCCO superconductor, welding properties between BSCCO and solders were investigated. Because ceramic materials is difficult to weld, Ag electro-plating on BSCCO 2212 is used for intermetallic layer. To find out the best welding condition for superconductor, soldering is tested in the maximum temperature from $155^{\circ}C\;to\;165^{\circ}C$ in the reflow oven. By investigating the composition and thickness of IMC (lntermetallic Compound) created in the reaction of Ag with solder, we analyzed the welding properties of High-Tc superconductor from a micro point of view.

• Current Photovoltaic Research
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• 제5권3호
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• pp.83-88
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• 2017

The growth of intermetallic compounds is an important factor in the reliability of solar cells. Especially, the temperature change in the soldering process greatly affects the thickness of the intermetallic compound layer. In this study, we investigated the intermetallic compound growth by Sn-diffusion in solder joints of solar cells. The thickness of the intermetallic compound layer was analyzed by IR lamp power and hot plate temperature control, and the correlation between the intermetallic compound layer and the adhesive strength was confirmed by a $90^{\circ}$ peel test. In order to investigate the growth of the intermetallic compound layer during isothermal aging, the growth of the intermetallic compound layer was analyzed at $85^{\circ}C$ and 85% for 500 h. In addition, the activation energy of Sn was calculated. The diffusion coefficient of the intermetallic compound layer was simulated and compared with experimental results to predict the long-term reliability.

• 한국재료학회지
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• 제31권11호
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• pp.601-607
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• 2021

Laser cladding a surface treatment process that grants superior characteristics such as toughness, hardness, and corrosion resistance to the surface, and rebuilds cracked molds; as such, it can be a strong tool to prolong service life of mold steel. Furthermore, compared with the other similar coating processes - thermal spray, etc., laser cladding provides superior bonding strength and precision coating on a local area. In this study, surface characteristics are studied after laser cladding of low carbon steel using 18%Cr-2.5%Ni-Fe powder (Rockit404), known for its high hardness and excellent corrosion resistance. A diode laser with wavelength of 900-1070 nm is adopted as laser source under argon atmosphere; electrical power for the laser cladding process is 5, 6, and 10 kW. Fundamental surface characteristics such as crossectional microstructure and hardness profile are observed and measured, and special evaluation, such as a soldering test with molten ALDC12 alloy, is conducted to investigate the corrosion resistance characteristics. As a result of the die-soldering test by immersion of low carbon alloy steel in ALDC12 molten metal, the clad layer's soldering thickness decreases.

• 한국초전도ㆍ저온공학회논문지
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• 제12권2호
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• pp.9-12
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• 2010

A lamination system using reflow soldering was developed to enhance the mechanical properties of high temperature superconductor (HTS) tape. The laminated coated conductor tape was fabricated using the continuous lamination process. The mean, maximum, and minimum tensile loads in a T-peel test of the laminated coated conductor were 9.9 N, 12.5 N, and 7.6 N, respectively. The critical current ($I_c$) distributions of the non-laminated and laminated coated conductor were compared using anon-contact Hall probe method. The transport $I_c$ nearly matched the non-contact $I_c$; however, some degraded Ic regions were found on the length of 800 cm of laminated coated conductor. We confirmed that the cause of the partially degraded $I_c$ was due to an increase in line tension by (1) solidification induced by a change of composition that usually occurs in molten brass (Cu, Zn) in solder, or (2) non-homogeneity of the thickness of the coated conductor or metal tapes. We suggest that reflow soldering is a promising method for reinforced HTS tape if the controlling solder thickness and lamination guide are modified.

• 한국초전도ㆍ저온공학회논문지
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• 제10권1호
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• pp.24-27
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• 2008

For the development of superconducting fault current limiters(SFCLs) having large current capacity, we fabricated an SFCL element that consists of Bi-2212 superconductor and Cu-Ni alloy tubes. First, Ag was plated on the surface of the Bi-2212 for the enhancement of soldering process. On the Ag-plated Bi-2212 tube, a Cu-Ni alloy tube was soldered using optimized solders and soldering conditions. The BSCCO/Cu-Ni composite was processed mechanically to have a helical shape for the improvement of the SFCL characteristics. The total current path of the SFCL element was 1330 mm long with 12 turns, and had critical current of 340 A at 77 K. Finally, we carried out the fault test using the fabricated SFCL element. It showed successful current limiting performance under the fault condition of 50 $V_{rms}$ and 5.5 kA. From the results, the rated voltage of the SFCL element was decided to be 0.4 V/cm, and the power capacity was 12 kVA at 77 K. The fabrication process of the SFCL and the fault test results will be presented.

• 마이크로전자및패키징학회지
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• 제13권1호통권38호
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• pp.23-29
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• 2006

Si-웨이퍼와 FR-4 기판을 상온에서 초음파 접합한 후, 접합부의 신뢰성을 평가하였다. Si-웨이퍼 상의 UBM(Under Bump Metallization)은 위에서부터 Cu/ Ni/ Al을 각각 $0.4{\mu}m,\;0.4{\mu}m,\;0.3{\mu}m$의 두께로 전자빔으로 증착하였다. FR-4 기판위의 패드는 위에서부터 Au/ Ni/ Cu를 각각 $0.05{\mu}m,\;5{\mu}m,\;18{\mu}m$의 두께로 전해 도금하여 형성하였다. 접합용 솔도로는 Sn-3.5wt%Ag을 두께 $100{\mu}m$으로 압연하여 사용하였다. 시편의 초음파 접합을 위하여 초음파 접합 시간을 0.5초에서 3.0초까지 0.5초 단위로 증가시키면서 상온에서 접합하였으며, 이 때 출력은 1,400W로 하였다. 실험 결과, 상온 초음파 접합법에 의해 신뢰성 있는 'Si-웨이퍼/솔더/FR-4기판' 접합부를 얻을 수 있었다. 접합부의 전단 강도는 접합 시간에 따라 증가하여 접합 시간 2.5초에서 65N으로 가장 높게 측정되었다. 이 후 접합 시간 3.0초에서는 전단 강도가 34N으로 감소하였는데, 이는 초음파 접합시간이 과도해지면서 Si-웨이퍼와 솔더 사이의 계면을 따라 균열이 발생되었기 때문으로 판단된다. 초음파 접합에 의해 Si-웨이퍼와 솔더 사이에서 생성된 금속간 화합물은 ($(Cu,Ni)_{6}Sn_{5}$)으로 확인되었다.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
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• pp.181-199
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• 2004

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
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• pp.135-144
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• 2004

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
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• pp.59-78
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• 2004