• 마이크로전자및패키징학회지
• /
• 제24권2호
• /
• pp.1-9
• /
• 2017

Recently, there has been a continuous researches on solders having sophisticated and improved performance due to demand for high-density and miniaturization of electronics, and development of solder for automotive electronics which can be used in harsh environment. When developing a new solder alloy, there is a wettability of solder on substrate for things to consider, and the wetting balance test is one of the methods for measuring that one. In this paper, the wetting balance test is introduced, and the calculus of the surface tension of solder and the contact angle between solder and substrate using wetting curve obtained is introduced too. In detail, the principle and test method of the wetting balance test, the introduction of the parameters with important meaning in the wetting curve, the method of calculating the contact angle as well as the surface tension of the solder using the shape of the solder meniscus.

• The Journal of Advanced Prosthodontics
• /
• 제4권4호
• /
• pp.254-258
• /
• 2012

Implant-supported overdenture is a reliable treatment option for the patients with edentulous mandible when they have difficulty in using complete dentures. Several options have been used for implant-supported overdenture attachments. Among these, bar attachment system has greater retention and better maintainability than others. SFI-Bar$^{(R)}$ is prefabricated and can be adjustable at chairside. Therefore, laboratory procedures such as soldering and welding are unnecessary, which leads to fewer errors and lower costs. A 67-year-old female patient presented, complaining of mobility of lower anterior teeth with old denture. She had been wearing complete denture in the maxilla and removable partial denture in the mandible with severe bone loss. After extracting the teeth, two implants were placed in front of mental foramen, and SFI-Bar$^{(R)}$ was connected. A tube bar was seated to two adapters through large ball joints and fixation screws, connecting each implant. The length of the tube bar was adjusted according to inter-implant distance. Then, a female part was attached to the bar beneath the new denture. This clinical report describes two-implant-supported overdenture using the SFI-Bar$^{(R)}$ system in a mandibular edentulous patient.

• 한국태양에너지학회:학술대회논문집
• /
• 한국태양에너지학회 2009년도 추계학술발표대회 논문집
• /
• pp.246-250
• /
• 2009

String & tabbing step in the crystalline PV module manufacturing process for the temperature directly affects solar cells. In fact, in the manufacture of PV modules tend to be temperature factor and the corresponding changes n the output shows the same characteristics. In this journal, it will be considered about thermal characteristics, especially changes of characteristic in high temperature of the solar cell through experiment that we measure electric output characteristics of solar cells after those are applied with high temperature changes for two seconds. And we can think about the possibility of efficiency improvements over looks in PV module manufacturing processes.

• 대한전기학회논문지:전기기기및에너지변환시스템부문B
• /
• 제51권12호
• /
• pp.670-675
• /
• 2002

AC loss is an important issue in the design of high-T$_{c}$ superconducting Power cables. The cables consists of a number of Bi-2223 tapes wound on a former. In such cables tapes have different critical current characteristics intrinsically. And they are electrically connected to each other and current leads by soldering. These make loss measurements considerably complex, especially for short samples of laboratory size. Special cautions are required in the positioning of voltage leads for measuring the true loss voltage. In this work the at losses in a single layer model cable have been experimentally investigated for different contacts and arrangements of voltage leads. The results show that the losses are not dependent on both arrangements and contact positions of the voltage leads. This implies that loss flux is only in a cylindrical conductor section. The measured losses also agree well with those based on a monoblock model and are independent of frequencies. This means that the measured AC loss of the model cable is purely hysteretic in nature.e.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2001년도 추계학술대회 논문집
• /
• pp.205-208
• /
• 2001

Steady state and transient thermal analysis has been done by a finite element method in a diode of 12kV blocking voltage for microwave oven. The diode was fabricated by soldering ten pieces of 1200V diodes in series, capping a dummy wafer at the far end of diode series, and finally copper wire bonded for building anode and cathode terminal. In order to achieve high voltage and reliability, the edge of each diode was beveled and passivated by resin and epoxy with a thickness of 25$\mu\textrm{m}$ and 3,700$\mu\textrm{m}$, respectively. The chip size, thickness and material properties were very important factor for high voltage diode package. And also, thermal stress value was highest in the edge of diode and solder. So, design of edge in silicon was very important to thermal stress.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2005년도 하계학술대회 논문집 Vol.6
• /
• pp.262-263
• /
• 2005

For mechanical and electrical stability and environment protection, Cu and stainless steel stabilizer is laminated to Ag layer to produce a composite neutral-axis(N-A) architecture in which the YBCO layer is centered between the oxide buffered metallic substrate and stabilizer strip lamination. this architecture allows the wire to meet operational requirements including stresses at cryogenic temperature, winding tensions, mechanical bending requirements thermal and electrical stability under fault conditions. we have experimentally studied mechanical properties of laminated stainless steel stabilizer on YBCO coated conductors. we have laminated YBCO coated conductors by continuous dipping soldering process. we have investigated lamination interface between solder and stabilizer, YBCO coated conductor. we evaluated bonding properties tensile / shear bonding strength, peeling strength laminated YBCO coated conductors.

• 한국태양에너지학회 논문집
• /
• 제35권1호
• /
• pp.29-34
• /
• 2015

The photovoltaic ribbon attached the flux reduces the solar module manufacturing process and the pollution. This paper presents an analytical method for solving the continuous flux drying system of photovoltaic ribbon. Also, some experiments of the drying of photovoltaic ribbon are carried out in order to design the drying system. Numerical results indicate the air temperature, the air velocity, the air pressure and the timewise temperature variation of ribbon during drying process. In case of the drier process length is short, 400mm, the photovoltaic ribbon is wet. Thus, another study of drying system is necessary to improve the drying ability. As a result, multi-stage drier system is proposed and shown to be good drying ability.

• 대한금속재료학회지
• /
• 제49권3호
• /
• pp.211-220
• /
• 2011

To improve the low ductility and high strain-rate sensitivity in Sn-Bi based solder alloys, the influences of the minor additions of alloying elements (Ag, Mn, In) were investigated. The strain-stress curves of various Sn-40Bi(-X) alloys, including a pre-suggested Sn-40Bi-0.1Cu composition were measured using a tensile testing machine. As a result, the elongation and ultimate tensile strength (UTS) values were compared. The small addition (0.5 wt.%) of Ag significantly enhanced the ductility and high strain-rate sensitivity of the alloys at strain rates of $10^{-4}$ to $10^{-2}\;s^{-1}$ mainly due to the increase and refinement of eutectic lamellar structures. The microstructure change increased the area of grain boundaries, thus ameliorating the grain boundary sliding mode. It was also found that Mn is an effective element in enhancing the ductility, especially at the strain rates of $10^{-3}$ to $10^{-2}\;s^{-1}$ The enhancement is likely attributed to the fine and homogeneous microstructure in the alloys containing Mn.

• 센서학회지
• /
• 제30권2호
• /
• pp.88-93
• /
• 2021

In this paper, a folding sensor based on capacitance is proposed. The sensor was developed to sense the length and angle data for the milli-scale actuators without causing any interference to the actuating joints. For the sensing and testing the robotic joint with reducing the cost and complexity aspects of manufacturing, a simple composition was adopted. The sensor comprises a pair of copper tapes, papers, and wires. The complete sensing unit is constructed by bonding the tapes with the papers and soldering the wire to the copper parts. For accuracy, a teensy 4.0 board, which has a 12-bit ADC resolution, is employed. Furthermore, the sensed analog data is not translated into the unit of capacitance for accuracy; however, it is filtered using a low-pass filter and subsequently, a Butter-worth filter. The data obtained demonstrate a periodic waveform, which implies that the data are in good agreement with the hypothesis set prior to the experiments. Compared to other milli-scale sensors, this could be a better option for sensing the length and angle data for milliscale actuators.

• 한국마이크로전자및패키징학회:학술대회논문집
• /
• 한국마이크로전자및패키징학회 2000년도 Proceedings of 5th International Joint Symposium on Microeletronics and Packaging
• /
• pp.17-17
• /
• 2000

The issue of reflow profiling continues to be a complex topic. The pains often associated with profiling can be reduced greatly if certain guidelines are followed and if there is a strong understanding of the variables that can be encountered during the reflow process. This paper shall discuss the appropriate guidelines and trouble shooting methods for reflow profiling, and in particular shall focus upon the benefits of implementing the linear ramp-to-spike profile. Delta T(T) is defined as the variation of temperature found on an assembly during the reflow process. Too large of a T can result in soldering defects, so to combat T a Ramp-Soak-Spike(RSS) reflow profile often is utilized. However, when using a newer-style reflow oven, the T often is minimized or eliminated, thus, the soak zone of the reflow profile becomes an unnecessary step. Because of this, the implementation of a linear Ramp-To-Spike(RTS) reflow profile should be considered. Benefits such as reduced energy costs, reduced solder defects, increased efficiency, improved wetting, and a simplification of the reflow profile process may be experienced when using the RTS profile. Included in this paper are the suggested process parameters for setting up the RSS and RTS profiles and the chemical and metallurgical reactions that occur at each set point of these profiles. The paper concludes with a discussion and pictures of several profile-related defects. Each of these defects is described, analyzed, and instructions are given for troublshooting these defects.