• 제목/요약/키워드: Soldering

검색결과 392건 처리시간 0.03초

웨팅밸런스법을 통한 젖음성 평가와 솔더의 젖음 특성 (Wettability Evaluation by Wetting Balance Test and Wetting Characteristics of Solders)

  • 전욱상;;정재필
    • 마이크로전자및패키징학회지
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    • 제26권3호
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    • pp.1-6
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    • 2019
  • Wettability is an important factor to decide solderability of solder, flux, other soldering-related materials and soldering conditions. The wettability also affects the reliability of solder joint. Wetting balance test is a good method for quantitatively measuring wettability between solder and substrate. The wetting balance test is easy to reproduce the wetting experiment and to measure the wetting time and force. And this test provides wetting curve to calculate the surface tension of the molten solder. Development of new solder has been continued in accordance with various and harsh environment in the electronics industry. In this paper, the principle of wetting balance test and recent research issues including nano-composite solder are explained.

알루미늄 주조용 SKD61 금형강의 표면처리 방법에 따른 특성 평가 (Characteristic Evaluation According to the Surface Treatment Method of SKD61 Mold Steel for Aluminum Casting)

  • 최세원;김철우;김용호;유효상
    • 열처리공학회지
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    • 제34권6호
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    • pp.281-286
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    • 2021
  • Arc ion plating (AIP), laser cladding, and nitriding are methods that can prevent mold damage or repair and create cracks and breakages on the die surface. The dissolution and soldering behavior of coated SKD61 by using arc ion plating, laser cladding, and nitriding was investigated. The structure of the coating was investigated as a function of deposition conditions by X-ray diffraction and the crystallographic orientation was determined using the texture factor. The TiAlN film deposited with AIP showed excellent corrosion resistance in the molten aluminum alloy at 680℃. In this paper, we have detailed the corrosion and mass loss phenomena associated with these steel-cast metal interactions.