A Study on Bonding Pattern Error Detecting of Flip-chip Solder Bump using the Intensity Distribution Map of X-ray Image (X-ray 영상의 Intensity 분포도를 이용한 플립칩 솔더범프 접합패턴 오차검출 연구)
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- Proceedings of the Korean Society of Precision Engineering Conference
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- 2009.06a
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- pp.641-642
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- 2009