• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.15 no.12
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• pp.1027-1032
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• 2002

(Pb$\_$0.4/Ca$\_$0.6/)(Fe$\_$1/2/Nb$\_$1/2/)O$_3$ system was modified by 10 mol% Pb(Zn$\_$1/2/W$\_$1/2/)O$_3$ addition and their sinterability and microwave properties were investigated as a function of the amount of flux (0.975PbO-0.025SnO$_2$). With increasing flux content, single perovskite phase was maintained up to 3 wt% flux addition and further addition led to the presence of Pb-rich second phase which was confirmed by EDS analysis. The apparent densities of PCFN-PZW specimen increased and showed maximum values at 2.5 wt% flux addition for the Ts=1000$^{\circ}C$ and 2.0wt% flux addition for the Ts=1050$^{\circ}C$, respectively. The dielectric constant and Q$.$f values strongly depended on the variation of density and microstructure, where the optimum values of $\varepsilon$$\_$r/ = 91.95, Q$.$f = 5938GHz, TCF = +8.15ppm/$^{\circ}C$ were obtained for the 2.5wt% flux added PCFN-PZW specimen sintered at 1000$^{\circ}C$ for 4h.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.05a
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• pp.126-129
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• 2002

This article presents that the affecting factors to solderability and initial reliability. It was discussed that effect of the solder ball hardness and composition on the reliability of solder joints. In this study, lead free solder alloys with compositions of Sn-Cu, Sn-Ag, Sn-Ag-Cu, Sn-Ag-Cu-Bi were applied to the $\muBGA$ packages. As a result of experiments, the high degree of hardness with the displacement of 0.22mm was obtained Sn-2.0Ag-0.7Cu-3.0Bi. The shear strength of lead free solder was higher than of Sn-37Pb solder, and it was increased about 150% in Sn-2.0Ag-0.7Cu-3.0Bi.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.11a
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• pp.105-108
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• 2002

환경에 관한 관심이 증대되면서 Sn37Pb 솔더를 대체하기 위한 새로운 무연솔더의 개발이 진행되고 있다1). 또한 연구의 초점이 되고 있는 것이 플럭스의 사용에 관한 것이다. 플럭스는 솔더의 산화막을 제거하는데 필수적이지만, 플럭스 세정제의 독성 문제로 무플럭스 솔더링에 대한 관심이 크게 증대되고 있다2),3). 무플럭스 솔더링의 방법에는 여러 가지가 있으며, 그 중 한가지가 플라즈마를 이용한 방법이다4). 본 연구에서는 솔더표면의 이물질과 산화막을 제거하기 위한 플라즈마 처리가 접합 후, 접합부에 미치는 영향에 대해서 알아보았다. 기판은 Evaporator를 이용하여 Au/Cu/Ni/Al UBM을 증착한 Si-wafer를 사용하였다. 사용된 솔더는 Sn37Pb, Sn3.5Ag와 Sn3.5Ag0.7Cu 솔더볼이며, 열중 및 적외선 겸용 리플로 머신과 Ar＋H$_2$를 이용한 플라즈마 에쳐를 사용하여 범프를 형성하였다. 플라즈마 처리가 계면의 미세조직과 기계적 강도에 끼치는 영향을 알아보기 위하여 플라즈마 처리된 시편과 리플로 한 후의 시편을 비교 분석하였다. 전단시험기로 계면의 강도를 측정하였으며, 주사전자현미경으로 범프의 표면과 계면 및 전단파면을 관찰하고 이에 대하여 고찰하였다. 산화막제거를 위한 플라즈마 처리가 저음점인 솔더의 미세조직을 기존의 솔더링 접합부와는 다르게 변화시킴으로써 솔더부의 전체적인 특성에 영향을 끼치는 것을 알 수 있었다.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.17 no.6
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• pp.575-579
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• 2004

Package reliability test was conducted to investigate the effect of solder paste composition at BGA Package. It was found that the shape and size of the phase form are affected by the processing parameters. The material have used to fill in the via was Sn/36Pb/2Ag and Sn/0.75Cu type solder paste. Sn/36Pb/2Ag and Sn/0.75Cu paste were fabricated on Tape-BGA substrates by screen printing process, and via ball mount data were characterized with variations of dwell time of 85 seconds at reflow peak temperature at 22$0^{\circ}C$ or 24$0^{\circ}C$. The test condition was MRT 30 $^{\circ}C$/60 %RH/96 HR. Failures formed of a ball-off in solder paste process were observed by using a Optical Microscope and SEM(Scanning Electron Microscope). It was concluded that intermetallic layer growth played important roles in increasing solder fatigue strength for addition of Ag composition. The degradation of shear strength of solder composition is discussed.

• Journal of Welding and Joining
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• v.25 no.3
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• pp.57-63
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• 2007

Electrochemical migration characteristics of Pb-free solder alloys are quantitatively correlated with corrosion characteristics in harsh environment conditions. In-situ water drop test and corrosion resistance test for Sn-3.0Ag-0.5Cu solder alloys were carried out in NaBr and NaF solutions to obtain the electrochemical migration lifetime and pitting potential, respectively. Sn-3.0Ag-0.5Cu solder alloy shows similar ionization and electrochemical migration behavior with pure Sn because of Ag and Cu do not migrate due to the formation of resistant intermetallic compounds inside solder itself. Electrochemical migration lifetime in NaBr is longer than in NaF, which seems to be closely related to higher pitting potential in NaBr than NaF solution. Therefore, it was revealed that electrochemical migration lifetime of Sn-3.0Ag-0.5Cu solder alloys showed good correlation to the corrosion resistance, and also the initial ionization step at anode side is believed to be the rate-determining step during electrochemical migration of Pb-free solders in these environments.

• Journal of Sensor Science and Technology
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• v.9 no.3
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• pp.242-247
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• 2000

$Pb_{0.99}[(Zr_{0.6}Sn_{0.4})_{0.9}Ti_{0.1}]_{0.98}Nb_{0.02}O_3(PNZST)$ thin films were deposited by RF magnetron sputtering on $(La_{0.5}Sr_{0.5})CoO_3(LSCO)/Pt/Ti/SiO_2/Si$ substrate using a PNZST target with excess PbO of 10 mole%. The thin films deposited at substrate temperature of $500^{\circ}C$, and at RF power of 80W were crystallized to a perovskite phase after rapid thermal annealing(RTA). The thin films annealed at $650^{\circ}C$ for 10 seconds in air exhibited the good structures and electrical properties. The fabricated PNZST capacitor had a remanent polarization value of about $20\;{\mu}C/cm^2$ and coercive field of about 50 kV/cm. The reduction of the polarization after $2.2{\times}10^9$ switching cycles was less than 10%.

• Journal of Sensor Science and Technology
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• v.11 no.1
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• pp.48-53
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• 2002

Ferroelectric $Pb_{0.99}[(Zr_{0.6}Sn_{0.4})_{1-x}Ti_x]_{0.98}Nb_{0.02}O_3$(PNZST) thin films were deposited by a RF magnetron sputtering on $(La_{0.5}Sr_{0.5})CoO_3$(LSCO)/Pt/Ti/$SiO_2$/Si substrate using a PNZST target with excess PbO of 10 mole%. The crystallinity and electrical properties of the thin films with various composition ratio were investigated. The thin films deposited at the substrate temperature of $500^{\circ}C$ and the power of 80 W were crystallized to a perovskite phase after rapid thermal annealing(RTA) at $650^{\circ}C$ for 10 seconds in air. A PNZST thin films with Ti of 10 mole% showed the good crystallinity and ferroelectric properties. The remanent polarization and coercive field of the PNZST capacitor were about $20\;{\mu}C/cm^2$ and 50 kV/cm, respectively. The reduction of the polarization after $2.2{\times}10^9$ switching cycles was less than 10%.

• Proceedings of the KWS Conference
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• 2007.11a
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• pp.235-237
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• 2007

In this paper, fabrication of Sn-3.0Ag-0.5Cu solder bumping having accurate composition and behavior of intermetallic compounds(IMCs) growth at interface between Sn-Ag-Cu bumps and Cu substrate were studied. The ternary alloy of the Sn-3.0Ag-0.5Cu solder was made by two binary(Sn-Cu, Sn-Ag) electroplating on Cu pad. For the manufacturing of the micro-bumps, photo-lithography and reflow process were carried out. After reflow process, the micro-bumps were aged at $150^{\circ}C$ during 1 hr to 500 hrs to observe behavior of IMCs growth at interface. As a different of Cu contents(0.5 or 2wt%) at Sn-Cu layer, behavior of IMCs was estimated. The interface were observed by FE-SEM and TEM for estimating of their each IMCs volume ratio and crystallographic-structure, respectively. From the results, it was found that the thickness of $Cu_3Sn$ layer formed at Sn-2.0Cu was thinner than the thickness of that layer be formed Sn-0.5Cu. After aging treatment $Cu_3Sn$ was formed at Sn-0.5Cu layer far thinner.

• Proceedings of the KWS Conference
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• 2003.11a
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• pp.86-88
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• 2003

The characteristic of induction heating solder bump(solder ball: Sn-37Pb, Sn-3.5Ag, Sn-3.0Ag-0.5Cu) has analyzed in this paper. The initial condition of induction heating depends on the time and current. The shape of lead-free solder bump is better than lead solder. The shear strength of lead solder bump has decreased with aging time. The average of shear strength of solder bump is about 10N, 11N, and 11N respectively. The lead-free solder bump's shear strength is better than lead solder and varies irregularly with aging time.

• Conservation Science in Museum
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• v.10
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• pp.1-13
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• 2009

A part of the bronze bell from Goryeo (918-1392) in the collection of Buyeo National Museum was missing, and it was noted to retain corrosion products and burial accretions. Chemical analysis showed that the chemical composition of the bronze bell is Cu (74.18%), Sn (9.58%), Pb (15.77%), and very small amounts of As, Fe, Sb, Bi, and Ag. It was noted that the microstructure of the bronze bell was mainly made up of α phase and α+δ eutectoid phase, and gray (S) and black (Pb segregation) prevailed. Conservation treatment has been done for the preservation of this bronze bell.