• 제목/요약/키워드: Smart packaging

검색결과 96건 처리시간 0.034초

FedEx Earth Smart: Practices of Environment-Friendly Management

  • Jung, Young-Su
    • 융합경영연구
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    • 제3권4호
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    • pp.21-27
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    • 2015
  • With the recent increasing interest in sustainability management, the latest environmental report tends to be substituted by the expanded sustainability management report. In this work, I would like to introduce the management pattern of a global enterprise that values environmental soundness (environmental friendly) and implements eco-friendly measures. The enterprise chosen in this study is FedEx. In this article, FedEx case is presented how companies can adopt environmental friendly management in their businesses. FedEx has maintained an eco-friendly management since the introduction of the company's eco-friendly transport trucks in 2003, following its development in 2000. In 2005, it installed a solar power plant that can supply up to 80% of the electricity consumed by Oakland Logistics Center in California, USA. FedEx has published the "Global Enterprise Citizenship Report," which contains its business developments in 2009. FedEx has worked hard to minimize the influence caused by packaging of goods to the environment and appealed to customers to use recycled products as much as they can. FedEx also encourages customers to use packaging materials efficiently. A considerable amount of energy has been expended in the eco-friendly programs of FedEx. Although thousands of FedEx vehicles and aircraft operate daily with using large amounts of electricity and fuel, FedEx focuses on energy savings and global environment protection.

Hands-On Experience-Based Comprehensive Curriculum for Microelectronics Manufacturing Engineering Education

  • Ha, Taemin;Hong, Sang Jeen
    • Transactions on Electrical and Electronic Materials
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    • 제17권5호
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    • pp.280-288
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    • 2016
  • Microelectronic product consumers may already be expecting another paradigm shift with smarter phones over smart phones, but the current status of microelectronic manufacturing engineering education (MMEE) in universities hardly makes up the pace for such a fast moving technology paradigm shift. The purpose of MMEE is to educate four-year university graduates to work in the microelectronics industry with up-to-date knowledge and self-motivation. In this paper, we present a comprehensive curriculum for a four-year university degree program in the area of microelectronics manufacturing. Three hands-on experienced-based courses are proposed, along with a methodology for undergraduate students to acquire hands-on experience, towards integrated circuits (ICs) design, fabrication and packaging, are presented in consideration of manufacturing engineering education. Semiconductor device and circuit design course for junior level is designed to cover how designed circuits progress to micro-fabrication by practicing full customization of the layout of digital circuits. Hands-on experienced-based semiconductor fabrication courses are composed to enhance students’ motivation to participate in self-motivated semiconductor fab activities by performing a series of collaborations. Finally, the Microelectronics Packaging course provides greater possibilities of mastered skillsets in the area of microelectronics manufacturing with the fabrication of printed circuit boards (PCBs) and board level assembly for microprocessor applications. The evaluation of the presented comprehensive curriculum was performed with a students’ survey. All the students responded with “Strongly Agree” or “Agree” for the manufacturing related courses. Through the development and application of the presented curriculum for the past six years, we are convinced that students’ confidence in obtaining their desired jobs or choosing higher degrees in the area of microelectronics manufacturing was increased. We confirmed that the hypothesis on the inclusion of handson experience-based courses for MMEE is beneficial to enhancing the motivation for learning.

TONYMOLY Cosmetic Company: A Small but Smart Marketing Player

  • Song, Ji-Hee;Lee, Sungho
    • Asia Marketing Journal
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    • 제15권1호
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    • pp.169-188
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    • 2013
  • Established in 2006 as the forward integration effort by Taesung Industry, the major cosmetic packaging company, TONYMOLY has phenomenally grown to one of the major cosmetic brand companies in the submarket called, 'one brand-shop' of cosmetic market since 2008, after overcoming the crisis of 'going out of business' in a couple of early years. Within a relatively short period of time, TONYMOLY's performances have dramatically improved in terms of metrics such as growth in sales revenue, the number of stores, the average sales per store, transaction value per customer, the number of monthly transactions, the number of membership-based customers, and overseas sales. In this case study, we have examined TONYMOLY's recent marketing activities which may explain the plausible reasons behind the substantial growth of a small but smart cosmetic company. Above all, the first key success factor of TONYMOLY would be found in its adherence to the clear philosophy of the customer value proposition and/or the differentiated position of TONYMOLY as a brand of providing value. Second, this brand concept of value was first penetrated and welcomed among the foothold customer target group of mid and late teens with appropriate products, while the target groups were later expanded into the age group of twenties along with expansion of relevant products. Third, its differentiation efforts have been concrete and meaningful by utilizing unique ingredients in its product development and marketing efforts, unique fun packaging, and continuously introducing new hit-selling products as well as managing steady-selling products. Fourth, TONYMOLY has been smart enough to use its limited marketing money efficiently and effectively in its marketing communication activities. Viral marketing, PPL, and concentrated media planning and execution turned out to produce effective and efficient market-based performances such as awareness, word-of-mouth, and sales. Lastly, the marketing leadership of CEO and top management, emphasizing communications and interactions, was confirmed in the relationship quality with and trust level of its franchisees and internal employees. These key success factors may explain the recent phenomenal market performances of TONYMOLY. Despite recent successes, the major issues are presented for TONYMOLY to consider for maintaining its sustainable advantages and growth. The first issue concerns TONYMOLY's choice of growth philosophy between product/brand-centric marketing and customer-centric marketing. The second challenging issue relates to how TONYMOLY can cope with 'growing pains' plausibly accompanied with the rapid growth.

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Determination of electrical and geometric properties of brown eggs

  • Sung Yong Joe;Jun Hwi So;Seon Ho Hwang;Soon Jung Hong;Seung Hyun Lee
    • 농업과학연구
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    • 제49권4호
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    • pp.857-869
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    • 2022
  • Eggs are considered an excellent complete food because they contain many major energy sources, including protein. Eggs are one of the most widely consumed foods worldwide, and egg consumption is steadily increasing. Eggs are generally classified according to their quality and weight. Various characteristics of eggs must be considered for the design and effective utilization of equipment used for the transport, processing, packaging, and storage of eggs. In this study, egg surface area, volume, density, etc. were measured according to the grade of the egg. The values of several geometrical properties that were measured tended to increase with increasing egg grade. The smallest grade eggs had the lowest shell thickness and density. The electrical conductivity of the eggshell and its contents was measured with a self-made electrode and equipment. The egg shell showed properties similar to insulators, and as the thickness increased, the electrical conductivity tended to increase. The electrical conductivity of the egg yolk showed almost constant values under all conditions. The electrical conductivity of the egg white and mixture was particularly low at 0.1 kHz. Fouling and electrode corrosion occurred in a low frequency region due to the egg white. In this study, various geometric and electrical characteristics of eggs were measured, and based on this, factors that could serve as new indicators for egg processed production were analyzed and investigated.

철근 사출 궤적 추적을 위한 시작지점 검출 방법 (Start Point Detection Method for Tracing the Injection Path of Steel Rebars)

  • 이준목;강대성
    • 한국정보기술학회논문지
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    • 제17권6호
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    • pp.9-16
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    • 2019
  • 최근 제조 공정을 개선하려는 기업들은 스마트 팩토리를 도입, 이에 따른 도약이 특별히 눈에 띈다. 이는 최소한의 수동 제어를 통해 완벽하게 생산시설의 프로세스를 수행하는 스마트 팩토리의 영역을 최대화하고 추론의 오차를 최소화 하는 것이 최종 목적이다. 본 연구는 무인 생산, 관리, 포장, 배송 관리를 위한 프로젝트의 일부로써 무인생산의 자동화 설비의 철근 추적을 통해 롤러의 자동 교정을 수행하기 위해 철근 추적 시작점 검출에 대한 연구이며, 시작지점부터 끝점까지의 위치를 정확히 추적해야 하는 요구사항을 만족해야 한다. 추적성능을 높이기 위해서는 시작점 설정이 주요한데 기존의 시간 기반 검출방법을 통해서는 조도, 분진 등 환경에 따라 추적오류의 발생 확률이 높다. 본 논문에서는 환경에 따른 오차를 줄이기 위해 고속 IR카메라의 평균 밝기 변화를 이용한 시작점 검출 방법을 제안하며, 제안 사항을 통해 15%이상의 성능 향상을 확인하였다.

3-Dimensional Micro Solder Ball Inspection Using LED Reflection Image

  • Kim, Jee Hong
    • International journal of advanced smart convergence
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    • 제8권3호
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    • pp.39-45
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    • 2019
  • This paper presents an optical technique for the three-dimensional (3D) shape inspection of micro solder balls used in ball-grid array (BGA) packaging. The proposed technique uses an optical source composed of spatially arranged light-emitting diodes (LEDs) and the results are derived based on the specular reflection characteristics of the micro solder balls for BGA A vision system comprising a camera and LEDs is designed to capture the reflected images of multiple solder balls arranged arbitrarily on a tray and the locations of the LED point-light-source reflections in each ball are determined via image processing, for shape inspection. The proposed methodology aims to determine the presence of defects in 3D BGA shape using the statistical information of the relative positions of multiple BGA balls, which are included in the image. The presence of the BGA balls with large deviations in relative position imply the inconsistencies in their shape. Experiments were conducted to verify that the proposed method could be applied to inspection without sophisticated mechanism and productivity problem.

마이크로 인몰드 공정기술 기반 전자소자 제조 및 응용 (Recent Progress in Micro In-Mold Process Technologies and Their Applications)

  • 김성현;권영우;홍석원
    • 마이크로전자및패키징학회지
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    • 제30권2호
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    • pp.1-12
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    • 2023
  • 전 세계적 모바일 스마트 기기 혁명은 사람이 접하는 모든 공간에서 독립된 형태의 전기회로를 요구하고 있으며, 전자기기간 연결된 사물인터넷의 구현은 사용자 측면에서 운용이 쉽고 지속 가능한 디지털 생태계 인프라 구축에서 매우 중요한 위치를 차지하고 있다. 이러한 기술은 자동차 전장품, 가정용 가전제품 및 웨어러블 기기의 생산 기술 발전으로 이어지고 있으며, 특히 최근 소개된 인몰드 전자기기(in-mold electronics, IME)는 기존의 대량 공정의 장점을 극대화할 수 있는 기술로 대두되고 있다. 이 기술은 평평한 2차원 기판에 기능성 잉크를 인쇄하고, 3차원 형상으로 열/사출 성형하여 경량화 및 저비용으로 장치를 생산해내는 경제성 강점을 이유로 산업적인 가치를 평가받고 있다. 본 논문에서는 인몰드 전자 장치의 제조기술 및 응용 측면에 대한 가장 최신의 국내외 연구 그룹에서 제안된 기술 개발을 소개하고자 한다. 신체 표면상에서 독립된 형태의 바이오센서 전자소자의 운용을 위한 생체 모사 기술, 에너지 소자, 생체신호 모니터링 센서들을 인몰드 기술로 구현하는 기술 및 장치 구성은, 4차 산업혁명과 함께 성장 중인 유연인쇄전자 기술과 융합되어 회로 기판 제조기술의 혁신을 가져올 것으로 기대된다.

유연 기판상 ITO 전극의 굽힘변형 및 굽힘피로에 따른 전기적 신뢰성 연구 (Electrical Reliability of ITO Film on Flexible Substrate During bending Deformations and Bending Fatigue)

  • 설재근;김병준
    • 마이크로전자및패키징학회지
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    • 제24권4호
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    • pp.47-52
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    • 2017
  • 휘거나 구부릴 수 있는 유연 전자 소자(flexible electronics) 개발을 위해 이러한 변형 조건에서 사용이 가능한 유연한 투명전극재료에 대한 많은 관심이 기울여 지고 있다. 본 연구에서는 현재 투명 전극 소재로 가장 널리 사용 중인 ITO 박막을 이용하여 굽힘 실험 및 반복 피로 실험을 진행하며 전기적 특성 변화를 연구 하였다. 응력 상태에 따른 차이를 보기 위해, ITO 필름의 상대적 위치에 따라 외측 및 내측 굽힘 두 조건으로 실험을 진행하였으며, 외측 굽힘보다 보다 내측 굽힘 조건에서 굽힘 실험 및 피로 실험 모두 우수한 전기적 안정성을 보였다. 외측 굽힘 및 내측 굽힘 시 응력 상태가 각각 인장 응력, 압축 응력이 ITO 필름에 가해지게 되며 이에 따라 균열 형성 및 전파 거동에 차이가 나타나는 것을 FE-SEM 표면 관찰을 통해 확인하였다. 이는 결국 전기적 안정성과도 밀접히 연관된 것을 확인하였다. 본 연구를 통해 가장 대표적인 투명전극재료인 ITO 필름의 다양한 기계적변형에 대한 신뢰성을 이해하고, 이를 통해 향후 고신뢰성 유연전자소자용 전극을 위한 디자인에 활용할 수 있을 것으로 기대한다.

고감도 그림자 무아레 기법을 이용한 모바일 전자부품의 변형 측정 (Deformation Measurement of Electronic Components in Mobile Device Using High Sensitivity Shadow Moiré Technique)

  • 양희걸;주진원
    • 마이크로전자및패키징학회지
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    • 제24권1호
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    • pp.57-65
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    • 2017
  • 모바일 기기 내부에 있는 전자부품들은 반도체 칩이나 그 밖의 여러 가지 재료로 구성되어 있다. 이러한 전자부품들은 매우 얇고, 구성된 재료들은 다양한 열팽창 계수를 가지고 있으므로 온도 변화나 외부 하중에 의해서 쉽게 굽힘이 일어난다. 그림자 무아레 방법은 비접촉으로 전체 영역에 걸친 면외변위를 측정하는 광학적 방법이지만 측정 감도를 $50{\mu}m/fringe$ 이내로 하기 어려워서 반도체 패키지의 굽힘변형을 측정하기에는 적당하지 않은 면이 있었다. 본 논문에서는 그림자 무아레 기법의 여러 실험조건들을 최적화하여 $25{\mu}m/fringe$의 향상된 감도를 갖는 측정 방법을 구현하였다. 또한 이로부터 위상이동에 의해 기록되는 4장의 그림자 무늬를 영상 처리하여 감도가 4배 향상된 그림자 무늬를 얻어내고 이를 스마트폰의 소형 전자부품들에 적용하여 온도변화에 따라 발생하는 굽힘 변위를 $5{\mu}m/fringe$의 고감도로 측정하였다.

무선 데이터 전송 시스템이 장착된 웨어러블 저항식 스트레인 센서 (Wearable Resistive Strain Sensor Networked by Wireless Data Transfer System)

  • 오제헌;이성주;신혜린;김승록;유주현;박진우
    • 마이크로전자및패키징학회지
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    • 제25권3호
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    • pp.43-47
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    • 2018
  • 본 연구에서는 silver nanowire (AgNW)를 polydimethylsiloxane (PDMS) 기판에 embedding하여 손가락 움직임을 전기 신호로 읽을 수 있는 투명 저항식 변형 센서를 제작하였다. 이후 bluetooth를 이용한 무선 통신의 방식으로 변형 센서가 내는 데이터를 컴퓨터와 스마트폰 앱으로 전송하는 근거리 통신을 가능하게 하였다. 최종적으로 데이터 가공공정을 통하여 스마트폰 앱으로 변형 센서에 의한 손가락 움직임을 읽고 이미지를 변환시키는 프로그램을 제작하여 컴퓨터와 스마트폰 앱으로 확인하였다.