• International Journal of Computer Science & Network Security
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• v.24 no.2
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• pp.53-58
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• 2024

This paper presents a novel miniaturized 3-D cubic antenna for use in wireless sensor network (WSN) application. The geometry of this antenna is designed as a cube including a meander dipole antenna. A truly omnidirectional pattern is produced by this antenna in both E-plane and H-plane, which allows for non-intermittent communication that is orientation independent. The operating frequency lies in the ISM band (centered in 2.45 GHz). The dimensions of this ultra-compact cubic antenna are 1.25*1.12*1cm3 which features a length dimension λ/11. The coefficient which presents the overall antenna structure is Ka=0.44. The cubic shape of the antenna is allowing for smart packaging, as sensor equipment may be easily integrated into the cube hallow interior. The major constraint of WSN is the energy consumption. The power consumption of radio communication unit is relatively high. So it is necessary to design an antenna which improves the energy efficiency. The parameters considered in this work are the resonant frequency, return loss, efficiency, bandwidth, radiation pattern, gain and the electromagnetic field of the proposed antenna. The specificity of this geometry is that its size is relatively small with an excellent gain and efficiency compared to previously structures (reported in the literature). All results of the simulations were performed by CST Microwave Studio simulation software and validated with HFSS. We used Advanced Design System (ADS) to validate the equivalent scheme of our conception. Input here the part of summary.

• Composites Research
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• v.37 no.3
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• pp.143-149
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• 2024

This paper measures the mechanical properties of corrugated cardboard, an eco-friendly packaging material, and applies these measurements to the MAT_PAPER model in LS-DYNA for finite element analysis. Although MAT_PAPER is primarily designed for modeling the behavior of paper, this research demonstrates its applicability to corrugated cardboard as well. Tensile, compression, and shear behaviors of a corrugated cardboard were measured and analyzed, and based on these results, six yield surfaces were derived and integrated into the MAT_PAPER model. By comparing the finite element analysis of the material tests and the low velocity collapse analysis of the corrugated cardboard square boxes with each experimental results, it was shown that the behavior of corrugated cardboard could be equivalently considered well by the MAT_PAPER model. However, since the model is not rate-dependent, the high strain rate properties of liner materials were measured and used for strain rate correction. Consequently, this matches well with the results of the high-speed compression tests of the corrugated cardboard square boxes.

• Journal of the Korean Society for Nondestructive Testing
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• v.31 no.4
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• pp.382-390
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• 2011

Smart sensors embedable in composite wind turbine blades have been required to be researched for monitoring the health status of large wind turbine blades during real-time operation. In this research, the feasibility of packaged FBG sensor probes was studied through the experiments of composite blade trailing edge specimens in order to detect cracking and debonding damages. The instants of cracking and debonding generated in the shear web were confirmed by rapid changes of the wavelength shifts from the bare FBG sensor probes. Packaged FBG sensor probes were proposed to remove the fragile property of bare FBG sensor probes attached on composite wind blade specimens. Strain and temperature sensitivity of fabricated probes installed on the skin of blade specimen were almost equal to those of a bare FBG sensor. Strain sensitivity was measured to be ${\mu}{\varepsilon}$/pm in a strain range from to 0 to 600 ${\mu}{\varepsilon}$, and the calculated temperature sensitivity was to be 48 pm/$^{\circ}C$ in the heating test up to 80 degree.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.18 no.12
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• pp.57-64
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• 2017

Today, due to the environmental regulations regarding air pollution in the EU, the use of EPS (Styrofoam) as the cushioning material in the packaging industry is decreasing. In effect, air cushioning based cushioning materials are rapidly expanding into the market and replacing EPS, due to their excellent buffering ability and environmental friendliness. This is a new selective filling type air filling material manufacturing technology that affords improvements in the amount of raw materials required, its processing and its aesthetic appearance compared to the conventional air filling cushioning materials. In this study, a multi-stage air cell filling valve molding technology is developed based on selective filling technology, which allows packages to be selectively filled in various forms by applying valve forming structure technology. This multi-stage air cell filling valve molding technology is a technique in which a plurality of injection ports are formed by laminating three layers of films, viz. a first injection film, a valve film, and a second injection film having valve ends. In the conventional technology, a separate external air injection path for injecting air into a plurality of connected air bags is needed. However, in the proposed system, an external air injection path is formed inside the air bag, Due to the lack of need for an injection furnace, the raw material and process are reduced and air is injected and then discharged, while the air bag is reduced in length to 63 ~ 66% of its normal value. The outer surface of the outer air injection path is integrated inside by maintaining the original length of the cross section, while the unnecessary folded air is injected into the interior of the air bag, This smart air filling type cushioning material manufacturing technology constitutes a big improvement over the existing technologies.

• The Journal of Korea Institute of Information, Electronics, and Communication Technology
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• v.16 no.5
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• pp.230-238
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• 2023

Small and medium-sized food manufacturing enterprises are largely reliant on manual labor, from inputting raw materials to palletizing the final product. Recently, there has been a trend toward smartness and digitization through the implementation of robotics and sensor data technology. In this study, we examined the effectiveness of improvement through 3D simulation on two repetitive work processes within a food manufacturing company. These processes involve workers whose speed cannot match the capacity of the applied equipment. Two manual processes were selected: the weighing and packing process performed by workers after skewer assembly, and the manual batch process of counting randomly delivered frozen foods, packing (both internal and external), and palletizing. The production volume, utilization rate, and number of workers were chosen as verification indicators. As a result of the simulation for improving the 3D process, production increased by 13.5% and 56.8% compared to the existing process, respectively. This was particularly evident in the process of applying palletizing robots. In both processes, as the utilization rate and number of input workers decreased, robots could replace tasks with high worker fatigue, thereby reducing work overload. This study demonstrates the potential to visually compare the process flow improvement using 3D simulations and confirms the possibility of pre-validation for improvement.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.1
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• pp.55-65
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• 2020

The use of underfill materials in semiconductor packages is not only important for stress relieving of the package, but also for improving the reliability of the package during shock and vibration. However, in recent years, as the size of the package becomes larger and very thin, the use of the underfill shows adverse effects and rather deteriorates the reliability of the package. To resolve these issues, we developed the package using a solid epoxy material to improve the reliability of the package as a substitute for underfill material. The developed solid epoxy was applied to the package of the application processor in smart phone, and the reliability of the package was evaluated using thermal cycling reliability tests and numerical analysis. In order to find the optimal solid epoxy material and process conditions for improving the reliability, the effects of various factors on the reliability, such as the application number of solid epoxy, type of PCB pad, and different solid epoxy materials, were investigated. The reliability test results indicated that the package with solid epoxy exhibited higher reliability than that without solid epoxy. The application of solid epoxy at six locations showed higher reliability than that of solid epoxy at four locations indicating that the solid epoxy plays a role in relieving stress of the package, thereby improving the reliability of the package. For the different types of PCB pad, NSMD (non-solder mask defined) pad showed higher reliability than the SMD (solder mask defined) pad. This is because the application of the NSMD pad is more advantageous in terms of thermomechanical stress reliability because the solderpad bond area is larger. In addition, for the different solid epoxy materials with different thermal expansion coefficients, the reliability was more improved when solid epoxy having lower thermal expansion coefficient was used.