• 대한기계학회논문집
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• 제16권11호
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• pp.2159-2168
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• 1992

본 연구에서는 CWS 액적의 가열 및 연소에 관한 현상규명에 있어서 액적크기, CWS 석탄함량 및 연소분위기 가스온도, CWS 액적중의 미분된 석탄입자의 크기와 특히 분위기중의 산소농도의 변화에 의한 영향을 파악하고자 한다.

• Geomechanics and Engineering
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• 제17권6호
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• pp.543-551
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• 2019

In China, serious environmental problems are induced by the extremely soft construction waste slurries in many urban areas, and there is no appropriate method to treat it presently. In this paper, four model tests were conducted to investigate the efficiency of waste slurry treatment by combining three conditioning agents which can change characteristics of the slurries with a traditional vacuum preloading method. The tests of size analysis of particle aggregate were conducted to investigate the influence of different conditioning agents on the size distributions of particle aggregate. During the model test, the discharged water volumes were monitored. The pore-size distribution and void ratio of the waste slurries after the vacuum preloading were measured by mercury intrusion porosimetry (MIP). It is found that 1) During the natural precipitation, volume of water out of the organic agent is higher than that of the mixed agent, but it is smaller than that of the mixed agent in the vacuum preloading stage; 2) the mixed agent has a higher total volume of water out than the organic agent and the inorganic agent after test, while the organic agent and the inorganic agent have little difference with respect to the drainage effect. The results demonstrate that the combination of mixed conditioning agent and vacuum preloading for the solid-liquid separation in waste slurry has a satisfactory effect and can be applied in engineering practice.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 하계학술대회 논문집 Vol.4 No.1
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• pp.304-307
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• 2003

Replacement of aluminum by copper for interconnections in the semiconductor industry has raised a number of important issues. The integration of copper interconnection can be carried out by CMP(chemical mechanical polishing) is used to planarize the surface topography. In this experiments, we evaluated the optimization of several conditions for chemical additives during Cu CMP process. It was presented that the main cause of grown particle size is tartaric acid. The particle size was in inverse propotion to a quantity of bead and the time of milling process. The slurry stabilizer and oxidizer have been shown to have very good effect by addition in later milling process.

• 한국윤활학회:학술대회논문집
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• 한국윤활학회 1999년도 제30회 추계학술대회
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• pp.263-268
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• 1999

Langasite, a new piezoelectric material was polished by CMP(chemical mechanical polishing). To enhance the polishing rate, alumina abrasives were added to commercial ILD1300 slurry which contains silica abrasive. The effect of added alumina 0 the silica slurry on the polishing rate and damage of langasite was investigated, Experimental results show that the polishing rate and roughness increases with increasing added alumina particle size, Crystallinity of the langasite is also lowered by alumina addition.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 하계학술대회 논문집 Vol.4 No.1
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• pp.308-311
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• 2003

The mesoporous TiO2 film for the dye-sensitized solar cell was prepared by the spin coating using nano particle $TiO_2$ slurry. In order to obtain the good dispersion of nano size $TiO_2$ particles in slurry, the pH of solvent, the sort and quantity of solvent additive and the quantity of surfactant were adjusted. The experimental range of pH was $2\;{\sim}\;4$. The basic solvent for slurry was dilute $HNO_3$ and the solvent additives were ethylene glycol, propylene glycol and butylene glycol. The degree of particle dispersion was indirectly estimated by the viscosity of slurry and the microstructure after sintering. As results, the lower the pH of solvent was the lower the viscosity of the slurry became. The addition of ethylene glycol and propylene glycol to dilute $HNO_3$ brought about the lowering of viscosity and the enhancement of stability in slurry. The addition of surfactant lowered the viscosity of slurry. It was possible to obtain the homogeneous and uniformly dispersed mesoporous TiO2 film using the dilute HNO3 solvent of pH 2 with the addition of ethylene glycol, propylene glycol and neutral surfactant.

• Korean Journal of Chemical Engineering
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• 제35권12호
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• pp.2355-2364
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• 2018

We evaluated the effect of particle size and associated dynamics on a hydrocyclone separation process in order to understand the movement of the particle trajectories inside the hydrocyclone via numerical analysis, with particles of acid hydrolysis residues discharged in $TiO_2$ production via the sulfate method as a case study. The values obtained from the numerical simulation were successfully compared with those from experimental tests in the literature, allowing a description of the dynamics of the particles, their acting forces, and their relevant properties together with separation efficiency. The results showed that particle motion is jointly controlled by the drag force, the pressure gradient force and the centrifugal force. With increasing particle size, the influence of the drag force is weakened, whereas that of the centrifugal force and pressure gradient is strengthened. Factors including particle density, slurry viscosity, and inlet slurry flow rate also contribute to a clear and useful understanding of particle motion behavior in the hydrocyclone as a method for improving the separation efficiency.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2005년도 하계학술대회 논문집 Vol.6
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• pp.40-41
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• 2005

In this study, we proposed CMP micro-scratches generated by contaminative particle which existed on the wafer surface prior to CMP process. The CMP micro-scratches are one of the slurry abrasive related damage. To reduce the micro-scratches, research efforts have been devoted to the optimization of slurry abrasive size distribution. In addition of slurry abrasive, it was found that contaminative particles also were major CMP micro-scratch source.

• 대한설비공학회:학술대회논문집
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• 대한설비공학회 2008년도 하계학술발표대회 논문집
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• pp.1105-1110
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• 2008

An experimental study was performed to control Ice Packing Factor (IPF) of ice slurry in a pipe in a real time. This paper presented the concept that IPF can be adjusted by the amount of the solution contained to ice slurry. Based on this concept, we designed IPF controller consisting of the outlet tube providing ice slurry and the upper tube discharging only a solution through holes, and investigated the technical validity and efficiency of the controller experimentally. As a result, the original proposed IPF controller could not control IPF of ice slurry in a pipe. This is because an ice of ice slurry was drained out into not only the outlet but also the upper of the controller due to the size of the holes relatively large compared to the ice particle. Therefore, we changed the hole size of IPF controller surface using fine meshes and then, observed that IPF in a pipe was increased by $4{\sim}7$ percent when the hole size was $80{\mu}m$ and less.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 제5회 영호남 학술대회 논문집
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• pp.12-14
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• 2003

As the integrated circuit device shrinks to the smaller dimension, the chemical mechanical polishing (CMP). process was required for the global planarization of inter-metal dielectric (IMD) layer with free-defect. However, as the IMD layer gets thinner, micro-scratches are becoming as major defects. Micro-scratches are generated by agglomerated slurry, solidified and attached slurry in pipe line of slurry supply system. It is well known that the presence of hard and larger size particles in the CMP slurries increases the defect density and surface roughness of the polished wafers. In this paper, we have studied. aging effect the of CMP slurry as a function of particle size. We prepared and compared the self-developed silica slurry by adding of abrasives before and after annealing. As our preliminary experiment results, we could be obtained the relatively stable slurry characteristics comparable to original silica slurry in the slurry aging effect.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 춘계학술대회 논문집 반도체재료
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• pp.34-37
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• 2001

As the integrated circuit device shrinks to smaller dimensions, chemical mechanical polishing (CMP) process was required for the global planarization of inter-metal dielectric (IMD) layer with free-defect. However, as the inter-metal dielectrics (IMD) layer gets thinner, micro-scratches are becoming as major defects. Micro-scratches are generated by agglomerated slurry, solidified and attached slurry in pipe line of slurry supply system. To prevent agglomerated slurry particle from inflow, we installed 0.5${\mu}m$ POU (point of use) filter, which is depth-type filter and has 80% filtering efficiency for the $1.0{\mu}m$ size particle. In this paper, we studied the relationship between defect generation and pad count to understand the exact efficiency of the slurry filtration, and to find out the appropriate pad usage. Our preliminary results showed that it is impossible to prevent defect-causing particles perfectly through the depth-type filter. Thus, we suggest that it is necessary to optimize the flow rate of slurry to overcome depth type filters weak-point, and to install the high spray of de-ionized Water (DIW) with high pressure.