• Title/Summary/Keyword: Slurry flow

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Estimation of Evaporation Rate of Swine Slurry Using the Natural Evaporation System(NES) in summer (여름철 자연증발시스템(NES)의 腞슬러리 증발효율 평가)

  • Kim, K.Y.;Choi, H.L.;Kim, J.G.
    • Journal of Animal Science and Technology
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    • v.44 no.4
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    • pp.459-474
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    • 2002
  • The purpose of this study was to establish the optimal operation condition of the natural evaporation system(NES) which was used for reducing swine slurry. Especially the main point of this study is to estimate the effect of climate condition(clear & rainy) and spray type(batch & flow) for the evaporation rate of swine slurry applying the NES in summer. Experiment was performed from June to August, which was generally regarded as summer in Korea, with the spray type of batch in 2000 and that of flow in 2001. As a result of experiment for batch and flow type, the averaged evaporation rate was measured into 2.71 and 3.59 l/ton . $m^2$ . day on clear days and 0.62 and 0.66 l/ton . $m^2$ . day on raint days, respectively. Based on the calculated evaporation rate by the climate condition and the spray type, it was proved that the averaged reduction rate for total input(1t/day) were 15.99% and 3.19% on clear and rainy days and the evaporation rate of the flow type was superior to that of the batch type by 5%, approximately. Therefore, it was concluded that the supplementary equipment, such as fan, should by operated in rainy days and the spray type of flow rather than that of batch should be recommended to increase the evaporation rate in the natural evaporation system(NES).

Pitch-based carbon fibers from coal tar or petroleum residue under the same processing condition

  • Kim, Jiyoung;Im, Ui-Su;Lee, Byungrok;Peck, Dong-Hyun;Yoon, Seong-Ho;Jung, Doo-Hwan
    • Carbon letters
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    • v.19
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    • pp.72-78
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    • 2016
  • Spinnable pitches and carbon fibers were successfully prepared from petroleum or coal pyrolysis residues. After pyrolysis fuel oil (PFO), slurry oil, and coal tar were simply filtered to eliminate the solid impurities, the characteristics of the raw materials were evaluated by elemental analysis, 13C nuclear magnetic resonance spectrometer, matrix-assisted laser desorption/ionization time-of-flight mass spectrometer (MALDI-TOF-MS), and so on. Spinnable pitches were prepared for melt-spinning carbon fiber through a simple distillation under strong nitrogen flow, and further vacuum distillation to obtain a high softening point. Carbon fibers were produced from the above pitches by single-hole melt spinning and additional heat treatment, for oxidization and carbonization. Even though spinnable pitches and carbon fibers were processed under the same conditions, the melt-spinning and properties of the carbon fiber were different depending on the raw materials. A fine carbon fiber could not be prepared from slurry oil, and the different diameter carbon fibers were produced from the PFO and coal tar pitch. These results seem to be closely correlated with the initial characteristics of the raw materials, under this simple processing condition.

Effect of Surface Roughness of Sapphire Wafer on Chemical Mechanical Polishing after Lap-Grinding (랩그라인딩 후 사파이어 웨이퍼의 표면거칠기가 화학기계적 연마에 미치는 영향)

  • Seo, Junyoung;Lee, Hyunseop
    • Tribology and Lubricants
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    • v.35 no.6
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    • pp.323-329
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    • 2019
  • Sapphire is currently used as a substrate material for blue light-emitting diodes (LEDs). The market for sapphire substrates has expanded rapidly as the use of LEDs has extended into various industries. However, sapphire is classified as one of the most difficult materials to machine due to its hardness and brittleness. Recently, a lap-grinding process has been developed to combine the lapping and diamond mechanical polishing (DMP) steps in a single process. This paper studies, the effect of wafer surface roughness on the chemical mechanical polishing (CMP) process by pressure and abrasive concentration in the lap-grinding process of a sapphire wafer. In this experiment, the surface roughness of a sapphire wafer is measured after lap-grinding by varying the pressure and abrasive concentration of the slurry. CMP is carried out under pressure conditions of 4.27 psi, a plate rotation speed of 103 rpm, head rotation speed of 97 rpm, and slurry flow rate of 170 ml/min. The abrasive concentration of the CMP slurry was 20wt, implying that the higher the surface roughness after lapgrinding, the higher the material removal rate (MRR) in the CMP. This is likely due to the real contact area and actual contact pressure between the rough wafer and polishing pad during the CMP. In addition, wafers with low surface roughness after lap-grinding show lower surface roughness values in CMP processes than wafers with high surface roughness values; therefore, further research is needed to obtain sufficient surface roughness before performing CMP processes.

Application of Semi-continuous Ambient Aerosol Collection System for Elemental Analysis (대기입자의 원소성분 배출특성연구를 위한 반-연속식 입자채취시스템 적용)

  • Park, Seung-Shik;Ko, Jae-Min;Lee, Dong-Soo
    • Journal of Korean Society for Atmospheric Environment
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    • v.28 no.1
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    • pp.39-51
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    • 2012
  • Aerosol slurry samples were collected in 60-min interval using Korean Semi-continuous Elements in Aerosol Sampler (KSEAS) between May 19 and June 6, 2010 at an urban site of Gwangju. The $PM_{2.5}$ samples were collected with a flow rate of 16.7 L/min and particles are grown by condensation of water vapor in a condenser maintained at ${\sim}5^{\circ}C$ after saturation by direct injection of steam. The resulting droplets are collected in a liquid slurry with a airdroplet separator. Concentrations of 16 elements (Al, Fe, Mn, Ca, K, Cu, Zn, Pb, Cd, Cr, Ti, V, Ni, Co, As, Se) in the collected slurry samples were determined off-line by ICP-MS. KSEAS sample analysis encompassed the sampling periods for which 24-hr average elemental species concentrations were calculated for comparison with those derived from 24-hr integrated filter samples. Relationship between elemental species measured by two methods indicated high correlation coefficients (r), mostly greater than r of 0.80. However, we note that concentrations of Al, K, Ca, Mn, and Fe, which are often associated with crustal elemental particles, in the KSEAS samples, were substantially lower (1.4~11 times) than those found in the typical filter-based samples. This discrepancy is probably due to difficulties in transferring insoluble dust particles to the collection vials in the KSEAS. Temporal profiles of elemental concentrations indicate that some transient events in their concentrations are observed over the sampling periods. For the elemental species studied, atmospheric concentrations during the transient events increased by factors of 4 in Mn~80 in Zn, compared to their background levels. Principle component analyses were applied to the hourly KSEAS data sets to identify sources affecting the concentrations of the metal constituents observed. In this study, we conclude that hourly measurements for particle-bound elemental constituents were extremely useful for revealing the short-term variability in their concentrations and developing insights into their sources.

Visualizing test on the pass-through and collision characteristics of coarse particles in a double blade pump

  • Tan, Minggao;Lian, Yichao;Liu, Houlin;Wu, Xianfang;Ding, Rong
    • International Journal of Naval Architecture and Ocean Engineering
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    • v.10 no.1
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    • pp.1-8
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    • 2018
  • As the key equipment in deep ocean mining, the slurry pump suffers from wear and blocking problems. In this paper, high-speed photography technique is applied to track the movement rule of single particle of the coarse particle solid-liquid two-phase flow in a double blade slurry pump. The influences of particle diameter and particle density on the pass-through and collision characteristics of particles are analyzed as well. The results show that the average of the passing pump time first decreases and then increases when the particle diameter increases. The average of the passing pump time decreases by 22.7%, when the particle density increases from $1.09g/cm^3$ to $1.75g/cm^3$. Besides, the particle density has great influence on the location where the particle hits the tongue. Most particles of $1.09g/cm^3$ hit the tongue on the left side, while collision location of particles of $1.75g/cm^3$ is mainly on the top and at the right side of the tongue. The research can provide a basis for the optimization design of slurry pump in deep ocean mining system.

Enrichment of valuable elements from vanadium slag using superconducting HGMS technology

  • He, Sai;Yang, Chang-qiao;Li, Su-qin;Zhang, Chang-quan
    • Progress in Superconductivity and Cryogenics
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    • v.19 no.1
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    • pp.17-21
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    • 2017
  • Vanadium slags is a kind of vanadiferous solid waste from steelmaking process. It not only occupies land, pollutes environment, but also leads to waste of resources. Based on the difference of magnetic susceptibility of different particles caused by their chemical and physical properties from vanadium slag, a new technology, superconducting high gradient magnetic separation was investigated for separation and extraction of valuable substances from vanadium slag. The magnetic concentrate was obtained under optimal parameters, i.e., a particle size -200 mesh, a magnetic flux density of 0.8 T, a slurry concentration of 5 g/L, an amount of steel wools of 25 g and a slurry flow velocity of 2 L/min. The content of $Fe_2O_3$ in concentrate could be increased from 39.6% to 55.0% and $V_2O_5$ from 2.5% to 4.0%, respectively. The recovery rate is up to 42.9%, and the vanadium slag has been effectively reused.

Preparation and Characterization of $TiO_2$ Membranes for Microfiltration ($TiO_2$ 정밀여과막의 제조 및 특성)

  • 한상욱;최세영;현상훈;조철구;강한규
    • Journal of the Korean Ceramic Society
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    • v.33 no.6
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    • pp.700-708
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    • 1996
  • TiO2 membranes for microfiltration were prepared on $\alpha$-alumina support tube by slurry coating. The coating layer was obtained by flowing TiO2 slip on the inner surface of the alumina support. TiO2 membranes were heat-treated at 9$25^{\circ}C$ for 2 hrs. The thickness of the unsupported membrane was about 10${\mu}{\textrm}{m}$. The mean pore diameter of the membranes were 0.09 and 0.15${\mu}{\textrm}{m}$ respectively and the pure water flux was 900~1,200ι/m2.hr at room temperature and 1 bar. For a possible application of oily wastewater treatement an kerosene/wa-ter emulsion was separated in terms of flux and removal efficiency. In 60 min of operating time the flux of TiO2 membranes was 50~100 ι/m2.hr and removal efficiency was over 97% at 3kgf/cm2 of operating pres-sure and 600 ml/min of flow rate. TiO2 membranes could be recycled by reheat treatments at $600^{\circ}C$ for 2 hrs.

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The Effect of Pad Groove Dimension on Polishing Performance in CMP (CMP에서 패드 그루브의 채수가 연마특성에 미치는 영향)

  • Park, Ki-Hyun;Kim, Hyung-Jae;Jeong, Young-Seok;Jeong, Hae-Do;Park, Jae-Hong
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2004.07b
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    • pp.1308-1311
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    • 2004
  • It is very important that get polishing characteristic that to be stable that accomplish planarization of high efficiency in chemical mechanical polishing, and there is repeatability Groove of pad causes much effects in flow of slurry among various factors that influence in polishing characteristic, is expected to cause change of lubrication state and polishing characteristic in contact between wafer and pad. Therefore, divided factors of pad groove by groove pattern, groove profile, groove dimensions. This research wishes to study effect that dimension of pad groove gets in polishing performance. When changed dimension (width, depth, pitch of groove) of groove, measured change of removal rate and friction force. According as groove dimension changes, could confirm that removal rate and friction force change. While result of this experiment studies effect of pad groove in CMP, it is expected to become small help.

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Development of Microstructure Pad and Its Performances in STI CMP (미세 표면 구조물을 갖는 패드의 제작 및 STI CMP 특성 연구)

  • Jeong, Suk-Hoon;Jung, Jae-Woo;Park, Ki-Hyun;Seo, Heon-Deok;Park, Jae-Hong;Park, Boum-Young;Joo, Suk-Bae;Choi, Jae-Young;Jeong, Hae-Do
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.21 no.3
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    • pp.203-207
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    • 2008
  • Chemical mechanical polishing (CMP) allows the planarization of wafers with two or more materials. There are many elements such as slurry, polishing pad, process parameters and conditioning in CMP process. Especially, polishing pad is considered as one of the most important consumables because this affects its performances such as WIWNU(within wafer non-uniformity) and MRR(material removal rate). In polishing pad, grooves and pores on its surface affect distribution of slurry, flow and profile of MRR on wafer. A subject of this investigation is to apply CMP for planarization of shallow trench isolation structure using microstructure(MS) pad. MS pad is designed to have uniform structure on its surface and manufactured by micro-molding technology. And then STI CMP performances such as pattern selectivity, erosion and comer rounding are evaluated.