• Proceedings of the Korean Society of Precision Engineering Conference
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• 2010.05a
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• pp.301-302
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• 2010

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.05d
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• pp.105-108
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• 2003

CMP(chemical mechanical polishing) process has been attracted as an essential technology of multi-level interconnection. However, the COO(cost of ownership) is very high, because of high consumable cost. Especially, among the consumables, slurry dominates more than 40 %. So, we focused how to reduce the consumption of raw slurry. In this paper, We have studied the CMP (chemical mechanical polishing) characteristics of slurry by adding of raw alumina abrasive and annealed alumina abrasive. As a experimental results, we obtained the comparable slurry characteristics compared with original silica slurry in the view point of high removal rate and low non-uniformity. Therefore, we can reduce the cost of consumables(COC) of CMP process for ULSI applications.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.05c
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• pp.145-148
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• 2003

Recently, the recycle of CMP (chemical mechanical polishing) slurries have been positively considered in order to reduce the high COO (cost of ownership) and COC (cost of consumables) in CMP process. Among the composition of slurries (buffer solution, bulk solution, abrasive particle, oxidizer, inhibitor, suspension, antifoaming agent, dispersion agent), the abrasive particles are one of the most important components. Especially, the abrasive particles of slurry are needed in order to achieve a good removal rate. However, the cost of abrasives, is still very high. In this paper, we have collected the silica abrasive powders by filtering after subsequent CMP process for the purpose of abrasive particle recycling. And then, we have studied the possibility of recycle of reused silica abrasive through the analysis of particle size and hardness. Also, we annealed the collected abrasive powders to promote the mechanical strength of reduced abrasion force. Finally, we compared the CMP characteristics between self-developed KOH-based silica abrasive slurry and original slury, As our experimental results, we obtained the comparable removal rate and good planarity with commercial products. Consequently, we can expect the saving of high cost slurry.

• Journal of the Korean Society for Precision Engineering
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• v.18 no.11
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• pp.168-173
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• 2001

The chemical mechanical polishing (CMP) is generally consisted of pad, slurry including abrasives and so on. However, there are some problems in a general CMP: defects, a high Cost of Consumable (CoC), an environmental problem. The slurry including abrasives especially gives rise to not only increase a CoC, but also prohibition from achieving an eco-process. This paper introduces an abrasive capsulation pad to achieve an eco-process decreasing abrasives used is CMP. The binder wth a water a water swelling and a water soluble characteristic is used for an auto-conditioning, and the $CeO_2$abrasive is selected for an abrasive capsulation pad. Comparing with a conventional CMP, an abrasive capsulation pad appears good characteristics in ILD CMP and is able to achieve an eco-process decreasing wasted slurry.

• Proceedings of the KIEE Conference
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• 2006.10a
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• pp.81-82
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• 2006

Chemical mechanical polishing (CMP) technology has been widely used for global planarization of multi-level interconnection for ULSI applications. However, the cost of ownership and cost of consumables are relatively high because of expensive slurry. In this paper, so as to investigate the influence of mixed abrasive slurry (MAS), such as $ZrO_2$, $CeO_2$, and $MnO_2$ for Ti-CMP application.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2012.10a
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• pp.37-38
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• 2012

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2008.06a
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• pp.361-362
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• 2008

• Tribology and Lubricants
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• v.27 no.1
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• pp.34-39
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• 2011

In this study, finite element analysis of particle-surface collision using 2-dimensional elements was performed to observe the effects of abrasive size and impact angle. The result of the simulation on the change in abrasive size revealed that larger abrasive particle induced larger contact stress due to force transfer through slurry fluid as the particle moved and pushed the fluid. This observation brought an important finding that the slurry fluid could make the workpiece surface soften and then change the mechanical properties of the surface layer such as elastic modulus and yield strength. As for the impact angle, it was found that the contact stress increased with the angle of impact and jumped up at a specific angle. Such result would be attributed to the complex effects of the impact velocity and angle.

• Journal of the Korean Society for Precision Engineering
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• v.21 no.7
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• pp.22-29
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• 2004

As a result of high integration of semiconductor device, the global planarization of multi-layer structures is necessary. So the chemical mechanical polishing(CMP) is widely applied to manufacturing the dielectric layer and metal line in the semiconductor device. CMP process is under influence of polisher, pad, slurry, and process itself, etc. In comparison with the general CMP which uses the slurry including abrasives, fixed abrasive pad takes advantage of planarity, resulting from decreasing pattern selectivity and defects such as dishing & erosion due to the reduction of abrasive concentration especially. This paper introduces the manufacturing technique of fixed abrasive pad using hydrophilic polymers with swelling characteristic in water and explains the self-conditioning phenomenon. And the tungsten CMP using fixed abrasive pad achieved the good conclusion in terms of the removal rate, non-uniformity, surface roughness, material selectivity, micro-scratch free contemporary with the pad life-time.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.10a
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• pp.198-201
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• 2002

An internal finishing process by the application of magnetic abrasive machining has been developed as a new technology to obtain a fine inner surface of pipe. In this paper, a slurry circulation system was designed and manufactured. Its finishing characteristics was experimently investigated by various effective factors such as dry, water flow, oil flow with a slurry. From the experimental results, it was found that the materal removal and surface roughness were good in oil flow with slurry. The slurry circulation system is effective on the internal finishing of non-ferromagnetic pipe(SUS304).