• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2007년도 추계학술대회 논문집
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• pp.217-218
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• 2007

• 펄프종이기술
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• 제46권2호
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• pp.1-7
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• 2014

Causticizing calcium carbonate (CCC) is produced as a by-product in the causticization step of the kraft pulping process. It is often calcined in a rotary lime kiln after being dewatered and reused in the causticizing process. But for the China mill, the conventional recycled way is difficult because the CCC is mainly obtained from non-wood pulping materials, which higher silicon content led to serious silicon obstacle. So it is often discarded as solid waste or used in landfill after dewatering and secondary pollution is brought. In order to prevent its secondary pollution, recent years, the CCC is used as a filler in China papermaking industry. In mill trials, the CCC can be used to replace an amount of precipitated calcium carbonate (PCC). Unfortunately, the application scope and dosage of CCC have been limited due to its lower sizing efficiency than PCC. In this study, the reason for the lower sizing efficiency of alkyl ketene dimer (AKD) when CCC was used as a filler was investigated. The results showed that the materials in green liquid, such as insoluble matter in green liquid, silicon and metal ions, were a little influence on the sizing efficiency of AKD. The higher BET and BJH pore volume of the CCC were the main reason for lower sizing efficiency of AKD when it was used as filler.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2001년도 추계학술대회 논문집
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• pp.139-143
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• 2001

In manufacturing process of semiconductor package, thermal stress owing to high temperature in moulding and bubbles generated in chip bonding process become main causes to producing void. Therefore, on this study we evaluated quantitatively void size by ultrasonic spectroscopy method which analyze the frequency of this received pulse using pulses with broad band frequency, and after destructive test we verified effectiveness of sizing void by ultrasonic spectroscopy as we find error degree between the real size of void and the sizing void by ultrasonic spectroscopy.

• 한국정밀공학회지
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• 제10권3호
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• pp.182-190
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• 1993

In manufacturing process of semiconductor package, the thermal stress owing to high temperature in moulding and the bubbles generated in chip bonding process become main causes to produce void. On this study we evaluated quantitatively void size by use of ultrasonic spectroscopy method which analyze the reflective pulses with broad band frequency in frequency domain, and after destructive testing we verified effectiv- eness of sizing void by use of ultasonic spectroscopy.

• 한국군사과학기술학회지
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• 제10권1호
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• pp.22-32
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• 2007

This paper describes a study of a helicopter database for the sizing stage of a preliminary design process. The database includes specifications and performance parameters for more than 150 conventional single rotor helicopters currently in market. Design parameters, including configuration and weight parameters, have been analyzed and trend curve equations(regression equations) are derived using the regression analysis method. Finally, the applicability of this research result was verified whether the method is reliable for being adopted as a useful design tool in the early stage of a helicopter design process.

• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 2006년도 Extended Abstracts of 2006 POWDER METALLURGY World Congress Part2
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• pp.745-746
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• 2006

This lecture introduces new press, adapter and control concepts to size multi-level sintered components. The essential thing here is that the advantages of the multi-plate technology have been applied to the sizing adapter concept. Thus, the new concept meets the demands for a modern P/M manufacture and offers sufficient potential to size any future, complex sintered components such as synchronizer hubs, oil pump wheels and VCT parts with highest precision. Furthermore, it outlines a new flexible concept for the parts transfer, including feeding, orientation and lubrication while responding to the high demands on process stability and short change-over times.

• 펄프종이기술
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• 제45권4호
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• pp.9-15
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• 2013

An oxidized starch ester was prepared and used for surface sizing. Esterification of starch decreased both Brookfield viscosity and Brabender viscosity substantially even though the solids level was increased by 2% from 14% to 16%. Surface sizing with the esterified starch gave better performance in tensile strength, stiffness and compressive strength than surface sizing with oxidized starch in the laboratory. Advantages in strength improvement, however, were not obtained when it was applied in commercial papermaking process. This was attributed to the fact that the influence of starch types has been nullified by high pressure penetration that occurs in the commercial papermaking process. Drying energy consumption, however, decreased by 3.3% by substituting the low solids oxidized starch with a high solids starch ester.

• 소성∙가공
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• 제9권6호
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• pp.615-623
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• 2000

The industrial application of hydroforming has a great potential in saying cost and achieving dimensional accuracy in automotive industry presently. The aim of the following article is to investigate the effect of process parameters on hydroformed part. Firstly, we have to investigate the change of mechanical properties for sheet and pipe material according to various radius/thickness ratio(r/t). The change of mechanical properties affects the yield stress more than the total elongation. Increase of yield stress for pipe has a bad influence on formability of hydroforming. Among the roll-forming process, the sizing process didn't change mechanical properties. The process parameters such as the initial pressure, mandrel shape and friction have seriously influenced on formability of hydroforming. Therefore we need to check formability of given material through the FE analysis in the beginning stage of process design and the predicted hydroforming process parameters ate generally a good starting point for the prototype tryout stage. The results of pretending, hydroforming analysis using FE model are good agreement with experimental results.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2004년도 하계종합학술대회 논문집(2)
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• pp.455-458
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• 2004

We present an efficient heuristic algorithm to reduce glitch power dissipation in combinational circuits. In this paper, the total number of glitches are reduced by replacing existing gates with functionally equivalent ones and by gate sizing which classified into three types and by buffer insertion which classified into two types. The proposed algorithm combines gate freezing, gate sizing. and buffer insertion into a single optimization process to maximize the glitch reduction. Our experimental results show an average of $67.8\%$ glitch reduction and $32.0\%$ power reduction by simultaneous gate freezing, gate sizing, and buffer insertion.

• 펄프종이기술
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• 제34권1호
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• pp.7-11
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• 2002

The print quality of a ink jet printer is generally affected by three major components of the printing process: printer, ink formulation, and paper. The result of this study indicated that the surface sized paper with oxidized starch and cationic starch differed ink jet print quality in terms of ink spread and black optical density of the print image. Paper properties, like air permeability and siting degree, which may influence the ink jet printing were also measured. It was found that black print quality was controlled by starch level and ionic charge on the paper surface. Cationic surface sizing starch improved black ink jet print quality.