• Title/Summary/Keyword: Size and Shape Optimization

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A Study on the Injection Molding Process of Inline Skate Frame Using Moldflow (Moldflow를 이용한 인라인스케이트 프레임의 사출성형공정에 관한 연구)

  • Lee, Hyoung-Woo;Park, Chul-Woo
    • Journal of Advanced Marine Engineering and Technology
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    • v.34 no.2
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    • pp.289-295
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    • 2010
  • Injection molding process is one of the most important methods to produce plastic parts with high efficiency and low cost. Today, injection molded parts have been increased dramatically the demand for high strength and quality applications. In this study, In-line skates are made of Al alloy and plastic materials to replace the frame for the optimization process is all about. I interpreted through mold design, Injection molding process that minimizes the runner and the gate dimension will determine the size and shape. Runner and gate dimensions of change based on availability of the product, I'll discuss the injection molding. This report investigates that the optimum injection molding condition for minimum of shrinkage. The FEM Simulation CAE tool, Moldflow, is used for the analysis of injection molding process.

A Study of the Using Application Program Interface (API) for Improving Productivity in Construction Engineering (건설 엔지니어링 생산성 향상을 위한 Application Program Interface(API) 활용방안에 대한 연구)

  • Park, Gi-Back;Jung, Young-Ho;Ham, Nam-Hyuk;Kim, Jae-Jun
    • Journal of KIBIM
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    • v.3 no.3
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    • pp.29-38
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    • 2013
  • Domestic construction industry is larger in size, and its shape is more complex. As a result, collaboration and information management tasks are difficult to manage in a way that conventional 2D-based exchange of information. BIM technology was introduced as a solution for this. But BIM only provides a very limited set of features such as Constructability review, clash detection in reality. and duplication of work and a lot of iterations occurs in BIM process. Thus, it takes quite a lot time to work. We studied how to improve the work efficiency by connecting API to business processes. Using the API in the integration process by automating repetitive tasks, reduce a significant amount of work time Using API (Automation, Optimization, Interoperability, Analysis) can solve the task problem that does not solved by the basic features, If we make good use of the combined API will be improved productivity.

Effects of electrode configurations on uniformity of copper films on flexible polymer substrate prepared by ECR-MOCVD (ECR-MOCVD에 의해 연성 고분자 기판에 제조된 구리막의 균일도에 전극의 형태가 미치는 영향)

  • 전법주;이중기
    • Journal of the Korea Institute of Military Science and Technology
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    • v.7 no.1
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    • pp.34-46
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    • 2004
  • Copper films were prepared by using ECR-MOCVD(Electron Cyclotron Resonance Metal Organic Chemical Vapor Deposition) coupled with a DC bias system. The DC bias is connected to the electrode which placed 1∼3cm above the polymer substrate. The pulse electrical field around the electrode attracts the positive charged copper ions generated from the dissociation of copper precursor, $Cu(hfac)_2$, under ECR plasma. Condensation of supersaturated copper ions in the space between the electrode and substrate, makes it possible to deposit copper film on the polymer substrate even at room temperature. In this study, optimization of the electrode configuration was carried out in order to obtain the uniform films. The uniformity of the deposited films were closely related to the parameters of electrode geometry such as electrode shape, thickness, grid size and the spacing between electrodes. The most uniform copper film was observed with the electrode that enabled uniform electrical field distribution across the whole dimension of electrode.

Analysis of grain size controlled rheology material dynamics for prediction of solid particle behavior during compression experiment (레오로지 소재의 압축 실험 시 고상입자 거동 예측을 위한 결정립 동역학 해석)

  • Kim H.I.;Kim W.Y.;Kang C.G.
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2005.10a
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    • pp.649-652
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    • 2005
  • It is reported that semi-solid forming process takes many advantages over the conventional forming process, such as long die lift, good mechanical properties and energy saves. Rheology material has a thixotropic, pseudo-plastic and shear-thinning characteristic. Therefore, general plastic or fluid dynamic analysis is not suitable for the behavior of rheology material. So it is difficult for a numerical simulation of the rheology process to be performed because complicated processes such as the filling to include the state of the free surface and solidification in the phase transformation must be considered. Moreover, it is important to predict the deformation behavior for optimization of net shape forging process with semi-solid materials and to control liquid segregation for mechanical properties of materials. In this study, so, molecular dynamics simulation was performed for the control of liquid segregation in compression experiment as a part of study on analysis of rheology forming process.

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Optimization of VIGA Process Parameters for Power Characteristics of Fe-Si-Al-P Soft Magnetic Alloy using Machine Learning

  • Sung-Min, Kim;Eun-Ji, Cha;Do-Hun, Kwon;Sung-Uk, Hong;Yeon-Joo, Lee;Seok-Jae, Lee;Kee-Ahn, Lee;Hwi-Jun, Kim
    • Journal of Powder Materials
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    • v.29 no.6
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    • pp.459-467
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    • 2022
  • Soft magnetic powder materials are used throughout industries such as motors and power converters. When manufacturing Fe-based soft magnetic composites, the size and shape of the soft magnetic powder and the microstructure in the powder are closely related to the magnetic properties. In this study, Fe-Si-Al-P alloy powders were manufactured using various manufacturing process parameter sets, and the process parameters of the vacuum induction melt gas atomization process were set as melt temperature, atomization gas pressure, and gas flow rate. Process variable data that records are converted into 6 types of data for each powder recovery section. Process variable data that recorded minute changes were converted into 6 types of data and used as input variables. As output variables, a total of 6 types were designated by measuring the particle size, flowability, apparent density, and sphericity of the manufactured powders according to the process variable conditions. The sensitivity of the input and output variables was analyzed through the Pearson correlation coefficient, and a total of 6 powder characteristics were analyzed by artificial neural network model. The prediction results were compared with the results through linear regression analysis and response surface methodology, respectively.

Optimization of Crystallization Condition for Transparent LAS Glass-ceramic Via Differential Thermal Analysis (DTA를 통한 LAS계 투명 결정화 유리의 결정화 조건 최적화)

  • Moon, Yun-Gon;Lim, Tae-Young;Lee, Mijai;Kim, Jin-Ho;Jeon, Dae-Woo;Hwang, Jonghee
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.29 no.2
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    • pp.101-105
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    • 2016
  • The basic characteristics of glass are highly fragile and brittle consequences the ultimate purpose of glass manufacturing is to make a transparent glass with complex shape. In order to solve this problem, mechanical properties of glass can be increased by crystallization of its amorphous glass. However, glass-ceramics has become opaque through crystallization process due to the distracted interface of glass by precipitated particles. This study has been investigated thermal processing conditions of LAS transparent glass-ceramic by using DTA (differential thermal analysis), in order to control size of precipitated particle and then fabricate transparent glass-ceramic. DTA indicated that crystallization peak area was declined with increased nucleation temperature. Subsequently, we have been established optimum temperature for crystallization depending on the nucleation temperature. The transmission and thermal expansion were measured after crystallization, and the size of precipitated particle was identified in range of 20~100 nm by FE-SEM. In addition, by setting the optimized crystallization condition, with high transmission and low thermal expansion glass was synthesized through this experiment.

Shape Scheme and Size Discrete Optimum Design of Plane Steel Trusses Using Improved Genetic Algorithm (개선된 유전자 알고리즘을 이용한 평면 철골트러스의 형상계획 및 단면 이산화 최적설계)

  • Kim, Soo-Won;Yuh, Baeg-Youh;Park, Choon-Wok;Kang, Moon-Myung
    • Journal of Korean Association for Spatial Structures
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    • v.4 no.2 s.12
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    • pp.89-97
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    • 2004
  • The objective of this study is the development of a scheme and discrete optimum design algorithm, which is based on the genetic algorithm. The algorithm can perform both scheme and size optimum designs of plane trusses. The developed Scheme genetic algorithm was implemented in a computer program. For the optimum design, the objective function is the weight of structures and the constraints are limits on loads and serviceability. The basic search method for the optimum design is the genetic algorithm. The algorithm is known to be very efficient for the discrete optimization. However, its application to the complicated structures has been limited because of the extreme time need for a number of structural analyses. This study solves the problem by introducing the size & scheme genetic algorithm operators into the genetic algorithm. The genetic process virtually takes no time. However, the evolutionary process requires a tremendous amount of time for a number of structural analyses. Therefore, the application of the genetic algorithm to the complicated structures is extremely difficult, if not impossible. The scheme genetic algorithm operators was introduced to overcome the problem and to complement the evolutionary process. It is very efficient in the approximate analyses and scheme and size optimization of plane trusses structures and considerably reduces structural analysis time. Scheme and size discrete optimum combined into the genetic algorithm is what makes the practical discrete optimum design of plane fusses structures possible. The efficiency and validity of the developed discrete optimum design algorithm was verified by applying the algorithm to various optimum design examples: plane pratt, howe and warren truss.

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The Characteristics of Viscosity Behavior of EMC for Semi-conductor Encapsulant -The Prediction of Viscosity by Mooney Equation- (반도체 봉지제용 EMC의 점도거동 특성 연구 -Mooney식을 이용한 점도예측-)

  • Kim, In Beom;Bae, Doo Han;Lee, Myung Cheon;Lee, Euy Soo;Yun, Hyo Chang;Lim, Jong Chan
    • Applied Chemistry for Engineering
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    • v.10 no.6
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    • pp.949-953
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    • 1999
  • Because epoxy molding compound(EMC) for semi-conductor encapsulants contains high concentrations of fillers, its flow behaviors are affected much by the concentrations and properties of those fillers. This paper reports the effects of a filler concentration, shape, size, and size distributions on the viscosity behavior of EMC(epoxy/silica). In addition, the prediction of viscosity behavior was performed using the Mooney equation. The maximum packing volume in the Mooney equation was calculated by Ouchiyama's packing model and Taguchi's optimization method, while the shpae factor was determined by fitting the experimental data. The results showed that the Mooney equation predicted the viscosity behavior of EMC very well.

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Simulated Annealing for Overcoming Data Imbalance in Mold Injection Process (사출성형공정에서 데이터의 불균형 해소를 위한 담금질모사)

  • Dongju Lee
    • Journal of Korean Society of Industrial and Systems Engineering
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    • v.45 no.4
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    • pp.233-239
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    • 2022
  • The injection molding process is a process in which thermoplastic resin is heated and made into a fluid state, injected under pressure into the cavity of a mold, and then cooled in the mold to produce a product identical to the shape of the cavity of the mold. It is a process that enables mass production and complex shapes, and various factors such as resin temperature, mold temperature, injection speed, and pressure affect product quality. In the data collected at the manufacturing site, there is a lot of data related to good products, but there is little data related to defective products, resulting in serious data imbalance. In order to efficiently solve this data imbalance, undersampling, oversampling, and composite sampling are usally applied. In this study, oversampling techniques such as random oversampling (ROS), minority class oversampling (SMOTE), ADASYN(Adaptive Synthetic Sampling), etc., which amplify data of the minority class by the majority class, and complex sampling using both undersampling and oversampling, are applied. For composite sampling, SMOTE+ENN and SMOTE+Tomek were used. Artificial neural network techniques is used to predict product quality. Especially, MLP and RNN are applied as artificial neural network techniques, and optimization of various parameters for MLP and RNN is required. In this study, we proposed an SA technique that optimizes the choice of the sampling method, the ratio of minority classes for sampling method, the batch size and the number of hidden layer units for parameters of MLP and RNN. The existing sampling methods and the proposed SA method were compared using accuracy, precision, recall, and F1 Score to prove the superiority of the proposed method.

High Performance ESD/Surge Protection Capability of Bidirectional Flip Chip Transient Voltage Suppression Diodes

  • Pharkphoumy, Sakhone;Khurelbaatar, Zagarzusem;Janardhanam, Valliedu;Choi, Chel-Jong;Shim, Kyu-Hwan;Daoheung, Daoheung;Bouangeun, Bouangeun;Choi, Sang-Sik;Cho, Deok-Ho
    • Transactions on Electrical and Electronic Materials
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    • v.17 no.4
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    • pp.196-200
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    • 2016
  • We have developed new electrostatic discharge (ESD) protection devices with, bidirectional flip chip transient voltage suppression. The devices differ in their epitaxial (epi) layers, which were grown by reduced pressure chemical vapor deposition (RPCVD). Their ESD properties were characterized using current-voltage (I-V), capacitance-voltage (C-V) measurement, and ESD analysis, including IEC61000-4-2, surge, and transmission line pulse (TLP) methods. Two BD-FCTVS diodes consisting of either a thick (12 μm) or thin (6 μm), n-Si epi layer showed the same reverse voltage of 8 V, very small reverse current level, and symmetric I-V and C-V curves. The damage found near the corner of the metal pads indicates that the size and shape of the radius governs their failure modes. The BD-FCTVS device made with a thin n- epi layer showed better performance than that made with a thick one in terms of enhancement of the features of ESD robustness, reliability, and protection capability. Therefore, this works confirms that the optimization of device parameters in conjunction with the doping concentration and thickness of epi layers be used to achieve high performance ESD properties.