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The facial tissue expansion to achieve the natural cervicomental angle (자연스러운 목턱각 성형을 위한 안면부 조직확장술)

  • Lee, Ki Eung;Koh, Jang Hyu;Seo, Dong Kook;Lee, Jong Wook;Choi, Jae ku;Jang, Young Chul
    • Archives of Plastic Surgery
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    • v.36 no.5
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    • pp.629-636
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    • 2009
  • Purposes: Wide scars occurring on the lower face and neck are a source of both functional and esthetic problems. Consequently, we can use skin grafts, pedicled flaps, free flaps, and tissue expansion for the reconstruction of this area. Compared with other reconstruction techniques, tissue expansion is advantageous in that it enables the maintenance of a color and texture similar to that of the adjacent tissue. However, the conventional method of tissue expansion has been reported to lead to an unnatural cervicomental angle and to the deformity of adjacent structures. We have therefore made efforts to prevent these problems through the use of several operative procedures. Methods: Forty-one patients with lower facial and cervical scars underwent tissue expansion. The tissue expansion was performed using a rectangular-shaped Nagosil$^{(R)}$ tissue expansion device. On insertion of the tissue expander, the intermediate area of superficial fat layer was dissected and then the tissue expander was inserted to make a flap that was as thin as possible. In advancement of the flap, a capsule-formed by the tissue expander-was used for the interrupted fixed suture of the flap to the fascia of the platysma muscle of the neck. This procedure was performed multiple times and also performed between the flap and the periosteum of the mandible, such that the tension was removed during the suture of the flap margin. Finally, the patients were fitted with a Jobst$^{(R)}$ facial garment in order to stabilize the operation site at least twelve months. Results: The most prevalent location of the scar was the cheek (15 cases), followed by the chin in 14 cases and the neck in 12 cases. The mean size of scar was $55.7{\pm}39.4cm^2$. Conclusions: Using our procedures, we have experienced no significant deformities and have also achieved a more natural cervicomental angle in the patients.

Dynamics and die design in continuous and patch slot coating processes (Continuous 와 pattern slot 코팅 공정에서의 유동특성과 다이 설계)

  • Kim Su-Yeon;Shim Seo-Hoon;Shin Dong-Myeong;Lee Joo-Sung;Jung Hyun-Wook;Hyun Jae-Chun
    • Proceedings of the Korean Society of Rheology Conference
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    • 2006.06a
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    • pp.81-84
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    • 2006
  • Slot coating process, in continuous and patch modes, has been applied for the many precise coating products, e.g., flat panel displays and second batteries. However, manufacturing uniform coating products is not a trivial task at high-speed operations because various flow instabilities or defects such as leaking, bubbles, ribbing, and rivulets are frequently observed in this process. It is no wonder, therefore, that many efforts to understand the various aspects of dynamics and coating windows of this process have been made both in academia and industry. In this study, as the first topic, flow dynamics within the coating bead in slot coating process has been investigated using the one-dimensional viscocapillary model by lubrication approximation and two-dimensional model by Flow-3D software. Especially, operability windows in both 1D and 2D cases with various slot die lip designs have been successfully portrayed. Also, effects of process conditions like viscosity and coating gap size on slot coating window have been analyzed. Also, some experiments to find minimum coating thickness and coating windows have been conducted using slot die coater implemented with flow visualization device, corroborating the numerical results. As the second topic, flow dynamics of both Newtonian and Non-Newtonian fluids in patch or pattern slot coating process, which is employed in manufacturing IT products such as secondary batteries, has been investigated for the purpose of optimal process designs. As a matter of fact, the flow control in this system is more difficult than in continuous case because od its transient or time-dependent nature. The internal die and die lip designs for patterned uniform coating products have been obtained by controlling flow behaviors of coating liquids issuing from slot. Numerical simulations have been performed using Fluent and Flow-3D packages. Flow behavior and pressure distribution inside the slot die has been compared with various die internal shapes and geometries. In the coating bead region, efforts to reduce irregular coating defects in head and tail parts of one patterned coating unit have been tried by changing die lip shapes. It has been concluded that optimal die internal design gas been developed, guaranteeing uniform velocity distribution of both Newtonian and shear thinning fluids at the die exit. And also optimal die lip design has been established, providing the longer uniform coating layer thickness within one coating unit.

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Investigation on the Electrical Characteristics of mc-Si Wafer and Solar Cell with a Textured Surface by RIE (플라즈마기반 표면 Texturing 공정에 따른 다결정 실리콘 웨이퍼 표면물성과 태양전지 동작특성 연구)

  • Park, Kwang-Mook;Jung, Jee-Hee;Bae, So-Ik;Choi, Si-Young;Lee, Myoung-Bok
    • Journal of the Korean Vacuum Society
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    • v.20 no.3
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    • pp.225-232
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    • 2011
  • Reactive ion etching (RIE) technique for maskless surface texturing of mc-silicon solar wafers has been applied and succeed in fabricating a grass-like black-silicon with an average reflectance of $4{\pm}1%$ in a wavelength range of 300~1,200 nm. In order to investigate the optimized texturing conditions for mass production of high quantum efficiency solar cell Surface characteristics such as the spatial distribution of average reflectance, micrscopic surface morphology and minority carrier lifetime were monitored for samples from saw-damaged $15.6{\times}15.6\;cm^2$ bare wafer to key-processed wafers as well as the mc-Si solar cells. We observed that RIE textured wafers reveal lower average reflectance along from center to edges by 1% and referred the origin to the non-uniform surface structures with a depth of 2 times deeper and half-maximum width of 3 times. Samples with anti-reflection coating after forming emitter layer also revealed longer minority carrier lifetime by 40% for the edge compared to wafer center due to size effects. As results, mc-Si solar cells with RIE-textured surface also revealed higher efficiency by 2% and better external quantum efficiency by 15% for edge positions with higher height.

Carbon-induced reconstructions on W(110)

  • Kim, Ji-Hyeon;Rojas, Geoff;Anders, Axel;Kim, Jae-Seong
    • Proceedings of the Korean Vacuum Society Conference
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    • 2010.02a
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    • pp.362-362
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    • 2010
  • Today, vast attention has been paid to periodic arrays of nanostructures due to their potential for applications such as memory with huge storage density. Such application requires large-scale fabrication of well ordered nano-sized structures. One of the most widely used methods for the ordered nanostructures is lithography. This top-down process, however, has the limit to reduce size. Here the promising alternative is the self-organization of ordered nano-sized structures such as large scale 2d carbon-induced reconstructions on W(110). In the present study, we report on the first well-resolved atomic resolution STM studies of the well-known R($15{\times}3$) and R($15{\times}12$) carbon induced reconstruction of the W(110). From the atomic image of R($15{\times}3$) for different values of tunneling gap resistance, we can tell there are no missing atoms in unit cells of R($15{\times}3$) and some atomic displacements are substantial from the clean W(110), even though not all the imaged position of atoms correspond to tungsten, but may include those of carbon. We are considering two cases; First case is related to lattice deformation, or top layer of W(110) is deformed in the process of relief of strain caused by random inserting of carbon atoms possibly in the interstitial position. In the second case, R($15{\times}3$) unit cell results from a coincidence lattice between clean W(110) substrate and tungsten carbide overlayer which has rectangular atomic arrangement and giving R($15{\times}3$) coincidence lattice. beta-W2C showing rectangular unit cell should be a candidate. Further, we report on new reconstructions. Unlike the well-known R($15{\times}12$) consisting of two parts, two inner structures between two "Backbone" structures. The new reconstruction, which we found for the first time, contains more parts between the "Backbone"s. Sometimes we can observe the reconstruction consists of only inner parts without "Backbone" parts. Thus, the observed reconstruction can be built by constructing of two types of "Lego"-like block. Moreover, the rectangle shape of "Backbone" transform to parallelogram-like shape over time, the so-called wavy-R($15{\times}12$). Adsorption of hydrogen can be the reason for this transformation.

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The Effects of Electrode Distance on the Formation of $(ZnS)_{1-x}(SiO_2)_x$ Protective Films in Phase Change Optical Disk by R.F. Sputtering Method (R.F. Sputtering 방법에 의한 상변화형 광디스크의 $(ZnS)_{1-x}(SiO_2)_x$ 보호막 형성에 미치는 전극거리의 영향)

  • Lee, Jun-Ho;Kim, Do-Hun
    • Korean Journal of Materials Research
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    • v.9 no.12
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    • pp.1245-1251
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    • 1999
  • Phase-change optical disk very rapid recording, high densification of data, resulting in high feedback rate and good C/N(carrier to noise) ratio of a feedback signal. However, repetitive thermal energy may cause the deformation of a disk or the lowering of an eliminability and a cyclability of the recording. The lowering of the cyclability can be reduced by insertion of thin layer of ZnS-$SiO_2$ dielectric thin film in appropriate disk structure between the upper and lower part of the recording film. Using the Taguchi method, optimum conditions satisfying both the optimized quality characteristic values and the scattering values for film formation were found to be the target R.F. power of 200W, the substrate R.F. power of 20W, the Ar pressure of 6mTorr, and the electrode distance of 6cm. From the refractive index data, the existence of the strong interaction between the electrode distance and Ar pressure was confirmed, and so was the large effect of the electrode distance on transmittance. According to the analysis of TEM and XRD, the closer the electrode distance was, the finer was the grain size due to the high deposition rate. However, the closer electrode distance brought the negative effect on the morphology of the film and caused the reduction of transmittance. AFM and SEM analyses showed that the closer the electrode distance was, the worse was the morphology due to the high rate of the deposition. Under optimum condition, the deposited thin film showed a good morphology and dense microstructure with less defects.

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Studies on the Interfacial Reaction between electroplated Eutectic Pb/Sn Flip-Chip Solder Bump and UBM(Under Bump Metallurgy) (전해 도금법을 이용한 공정 납-주석 플립 칩 솔더 범프와 UBM(Under Bump Metallurgy) 계면반응에 관한 연구)

  • Jang, Se-Yeong;Baek, Gyeong-Ok
    • Korean Journal of Materials Research
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    • v.9 no.3
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    • pp.288-294
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    • 1999
  • In the flip chip interconnection using solder bump, the Under Bump Metallurgy (UBM) is required to perform multiple functions in its conversion of an aluminum bond pad to a solderable surface. In this study, various UBM systems such as $Al 1\mu\textrm{m} / Ti 0.2\mu\textrm{m} / Cu 5\mu\textrm{m}, Al 1\mu\textrm{m} / Ti 0.2\mu\textrm{m} / Cu 1\mu\textrm{m}, al 1\mu\textrm{m}/Ni 0.2\mu\textrm{m} / Cu 1\mu\textrm{m} and Al 1\mu\textrm{m}/Pd 0.2\mu\textrm{m} / Cu 1\mu\textrm{m}$ for flip chip interconnection using the low melting point eutectic 63Sn-37Pb solder were investigated and compared to their metallurgical properties. $100\mu\textrm{m}$ size bumps were prepared for using an electroplating process. The effects of the number of reflows and aging time on the growth of intermetallic compounds(IMC) were investigated. $Cu_6Sn_5$ and $Cu_3Sn$ IMC were abserved after aging treatment in the UBM system with thick coper $(Al 1\mu\textrm{m}/Ti 0.2\mu\textrm{m}/Cu 5\mu\textrm{m})$. However only the $Cu_6Sn_5$ was detected in the UBM system with $1\mu\textrm{m}$ thick copper even after 2 reflow and 7 day aging at $150^{\circ}C$. Complete Cu consumption by Cu-Sn IMC growth gives rise to a direct contact between solder inner layer such as Ti, Ni and Pd, and hence to possibly cause reactions between two of them. In this study, however, only for the Pd case, IMC of PdSn. was observed by Cu consumption. UBM interfacial reactions with s이der affected the adhesion strength ot s이der balls after s이der reflow and annealing treatment.

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Determination of Hydraulic Conductivities in the Sandy Soil Layer through Cross Correlation Analysis between Rainfall and Groundwater Level (강우-지하수위 상관성 분석을 통한 사질토층의 수리전도도 산정)

  • Park, Seunghyuk;Son, Doo Gie;Jeong, Gyo-Cheol
    • The Journal of Engineering Geology
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    • v.29 no.3
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    • pp.303-314
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    • 2019
  • Surface permeability and shallow geological structures play significant roles in shaping the groundwater recharge of shallow aquifers. Surface permeability can be characterized by two concepts, intrinsic permeability and hydraulic conductivity, with the latter obtained from previous near-surface geological investigations. Here we propose a hydraulic equation via the cross-correlation analysis of the rainfall-groundwater levels using a regression equation that is based on the cross-correlation between the grain size distribution curve for unconsolidated sediments and the rainfall-groundwater levels measured in the Gyeongju area, Korea, and discuss its application by comparing these results to field-based aquifer test results. The maximum cross-correlation equation between the hydraulic conductivity derived from Zunker's observation equation in a sandy alluvial aquifer and the rainfall-groundwater levels increases as a natural logarithmic function with high correlation coefficients (0.95). A 2.83% difference between the field-based aquifer test and root mean square error is observed when this regression equation is applied to the other observation wells. Therefore, rainfall-groundwater level monitoring data as well as aquifer test are very useful in estimating hydraulic conductivity.

Reliable multi-hop communication for structural health monitoring

  • Nagayama, Tomonori;Moinzadeh, Parya;Mechitov, Kirill;Ushita, Mitsushi;Makihata, Noritoshi;Ieiri, Masataka;Agha, Gul;Spencer, Billie F. Jr.;Fujino, Yozo;Seo, Ju-Won
    • Smart Structures and Systems
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    • v.6 no.5_6
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    • pp.481-504
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    • 2010
  • Wireless smart sensor networks (WSSNs) have been proposed by a number of researchers to evaluate the current condition of civil infrastructure, offering improved understanding of dynamic response through dense instrumentation. As focus moves from laboratory testing to full-scale implementation, the need for multi-hop communication to address issues associated with the large size of civil infrastructure and their limited radio power has become apparent. Multi-hop communication protocols allow sensors to cooperate to reliably deliver data between nodes outside of direct communication range. However, application specific requirements, such as high sampling rates, vast amounts of data to be collected, precise internodal synchronization, and reliable communication, are quite challenging to achieve with generic multi-hop communication protocols. This paper proposes two complementary reliable multi-hop communication solutions for monitoring of civil infrastructure. In the first approach, termed herein General Purpose Multi-hop (GPMH), the wide variety of communication patterns involved in structural health monitoring, particularly in decentralized implementations, are acknowledged to develop a flexible and adaptable any-to-any communication protocol. In the second approach, termed herein Single-Sink Multi-hop (SSMH), an efficient many-to-one protocol utilizing all available RF channels is designed to minimize the time required to collect the large amounts of data generated by dense arrays of sensor nodes. Both protocols adopt the Ad-hoc On-demand Distance Vector (AODV) routing protocol, which provides any-to-any routing and multi-cast capability, and supports a broad range of communication patterns. The proposed implementations refine the routing metric by considering the stability of links, exclude functionality unnecessary in mostly-static WSSNs, and integrate a reliable communication layer with the AODV protocol. These customizations have resulted in robust realizations of multi-hop reliable communication that meet the demands of structural health monitoring.

Distribution of Magnetic Field Depending on the Current in the μ-turn Coil to Capture Red Blood Cells (적혈구 포획용 미크론 크기 코일에 흐르는 전류의 크기에 따른 자기장 분포 특성)

  • Lee, Won-Hyung;Chung, Hyun-Jun;Kim, Nu-Ri;Park, Ji-Soo;Lee, Sang-Suk;Rhee, Jang-Roh
    • Journal of the Korean Magnetics Society
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    • v.25 no.5
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    • pp.162-168
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    • 2015
  • The ${\mu}$-turn coil having a width of ${\mu}m$ on the GMR-SV (giant magnetoresistance-spin valve) device based on the antiferromagnetic IrMn layer was fabricated by using the optical lithography process. In the case of GMR-SV film and GMR-SV device, the magnetoresistance ratios and the magnetic sensitivities are 4.4%, 2.0%/Oe and 1.6 %, 0.1%/Oe, respectively. In the y-z plane the distribution of magnetic field of GMR-SV device and $10{\mu}$-turns coil which put under the several magnetic bead(MB)s with a diameter of $1{\mu}m$ attached to RBC (red blood cell) was analyzed by the computer simulation using the finite element method. When the AC currents of 20 kHz from 0.1 mA to 10.0 mA flow to the 10 turns ${\mu}$-coil, the magnetic field at the position of $z=0{\mu}m$ at the center of coil was calculated from $30.1{\mu}T$ to $3060{\mu}T$ in proportion to the current. The magnetic field at the position of $z=10{\mu}m$ was decreased to one-sixth of that of $z=0{\mu}m$. It was confirmed that the $10{\mu}$-turn coil having enough magnitude of magnetic field for the capture of RBC is possible to use as a biosensor for the detection of magnetic beads attached to RBC.

Studies of mulberry seedling preparation by cattage method sapling (II) Study of cultivating method of mulberry root-stock (상수 재육채묘법에 관한 시험 (II) 상수 묘목의 육성법에 관한 시험)

  • 박병희;유근섭;조철호;김문협
    • Journal of Sericultural and Entomological Science
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    • v.3
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    • pp.37-43
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    • 1963
  • This experimental work was carried out to know the best method in producing the root stock effectively. The major experimental work was carried out by using Kairyo-Nezumigaeshi, and the comparative works were carried out by using Ichi-Hei, Kairyo-Nezumigaeshi, Ro-Soh, Yongchon-Chuwoo and Suwon No. 4. Results obtained from the test are as follows. 1. The larger size of the branch burried, the better live ratio and the quality of the sapling was found, and there was no significant difference between the top part and bottom part of the branch from the point of view of the ratio, but it was found that the top part showed better live ratio and quality. Mean time there was no difference in live ratio between the two sprouts root-stock type and the three sprouts root-stock type. 2. When the live ratio and sapling quality was compared from the aspect of the new root development, the heavy and medium developed root type showed better result than the poor developed one. 3. For the ambushing depth test of the root-stock, the root-stock which was painted with paraffin on the top and exposed in the air was found to have best live ratio. Mean time, even though paraffin was not painted all the top of the root-stock, the one which was exposed the top of it or the one ambushed with thin soil layer, showed better live ratio than the one deep ambushed. 4. There was difference for the live ratio between the perpendicularly ambushed root-stock and the lied ambushed mot-stock, but the former method showed better sapling quality. 5. The soil nature did not show any difference for the live ratio between the sand loam and clay loam, but the former one showed better sapling quality. 6. There was no difference live ratio between the mulberry varieties, but Yongchon-Chuwoo showed best sapling quality. 7. The grafted sapling production cost was 2.30 won and cattage sapling cost was 1.61 won.

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