• Journal of the Korean Society of Propulsion Engineers
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• v.8 no.4
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• pp.16-25
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• 2004

Theoretical analysis for predicting the heat transport limitation of a copper powder sintered wick heat pipe was performed. The heat pipe diameter was 8mm and water was used for working fluid. The particle diameter was classified by 5 different meshes, and each capillary pressures and heat transport limitations. thermal resistances were analyzed according to the operating temperatures, wick thicknesses and inclination angles, based on the effective capillary radius($r_c$), porosity($\varepsilon$), Permeability (K). The wick capillary limitation was increased according as the particle diameter and the wick thickness and the operating temperature were increased. As the porosity and the capillary radius were larger. then the heat transport limitation was higher. The thermal resistance was greatly increased according as the wick thickness was increased.

• Proceedings of the KSME Conference
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• 2004.04a
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• pp.1487-1492
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• 2004

For the present study, three heat pipes with different thickness of sintered metal wick were manufactured, and their operational performances, such as capillary limit and thermal resistance were tested and compared with theoretical predictions. Experimental results showed good agreement with those by the theoretical model, and that seemed to present that the sintering process we had developed in the present study was valid.

• Proceedings of the KSME Conference
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• 2004.04a
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• pp.1528-1533
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• 2004

In this study, we have manufactured the LHP(Loop Heat Pipe) with sintered metal wick and investigated the working characteristics of LHP experimentally.Water was used as a working fluid and fill charge rate was changed. LHP basically consist of the separated vapor/liquid channels, evaporator having sintered metal wick(effective pore diameter :$16{\sim}19{\mu}m$), and condenser cooled by water. The diameter of vapor/liquid line tube are 3.2mm/6.35mm, respectively. Heat transfer rate and thermal resistance was represented to study the basic characteristics of LHP at each conditions

• Proceedings of the KSME Conference
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• 2008.11b
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• pp.2357-2362
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• 2008

LHP is different from a conventional heat pipes in design and heat and fluid flow passages. The situations of the former is much complex than the latter. In LHPs, evaporation occurs at the contact interface between the heating plate and the porous wick, so some micro channels machined at the contact interface serve to let the vapor flow out of the evaporator. This complexity of contact geometry was known to cause a high resistance to heat flow. The present work was to study the problem of heat passage across the contact surface for LHPs and determine those values contact resistance. For two cases of contact structures, the thermal contact resistances were examined experimentally, one being obtained through mechanical contact under pressure and the other through sintered bonding. Nickel powder wick and copper plate were used for specimens. The result showed that a substantial reduction of contact resistance of an order of degree could be obtainable by sintered bonding.

• Proceedings of the Korea Society for Energy Engineering kosee Conference
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• 2003.11a
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• pp.291-297
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• 2003

For the present study, three heat pipes with different thickness of sintered metal wick were manufactured, and their operational performances, such as capillary limit and thermal resistance were tested and compared with theoretical predictions. Experimental results showed good agreement with those by the theoretical model, and that seemed to present that the sintering process we had developed ;n the present study was valid.

• Proceedings of the KSR Conference
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• 2008.11b
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• pp.1710-1716
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• 2008

The Loop Heat Pipe (LHP) operates to pump the working fluid by means of the capillary force in a wick structure. Particularly, it is difficult to design and manufacture the evaporator consisted of a grooved container and a compensation chamber as well as the wick structure. This study is related to design and manufacture the grooved container coupled with wick structure, the properties of the wick structure such as the permeability, the porosity, and the maximum capillary pressure were measured to apply the cooling technology for Insulated Gate Bipolar Transistor (IGBT). The container of the LHP was manufactured by the electrical discharge process and the wick structure was sintered with the nickel particle by an axial-press apparatus with the pulse electronic discharge. As results, the properties of the wick were experimentally obtained about 60% of the porosity, 35kPa of the maximum capillary force and $1.53{\times}10-13m2$ of the permeability.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.12 no.3
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• pp.227-234
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• 2000

An experimental study was performed for understanding the limiting power and heat transfer characteristics of an MHP having the diameter of 3 or 4 mm which could be applied to cooling of miniature electronic equipment such as the notebook PC CPU etc. The experimental parameters which are inclination, structure of the wick, the length of the condenser and the total heat pipe were considered. The MHP with a woven-wired wick has the advantages of the improvement in capillary limit, the effective attachment tightly toward wall and the convenience in construction of wick. Cooling performance of the present MHP was compared with that of MHP with grooved, fine fiber and sintered type wick which were applied by existing enterprises. With respect to the inclination of$ -5^{\circ}$ , an MHP having the diameter of 3 or 4 mm shows the limiting power of 6~14 W. Therefore, it is expected that the MHP of the present study has sufficient applicability of cooling of notebook PC of which the amount of heat generated is about 12 W.

• Proceedings of the SAREK Conference
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• 2006.06a
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• pp.339-345
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• 2006

This these was conducted to investigate tile characteristics of a frozen start up for a VCHP which has water as a working fluid and Nitrogen as a non-condensible gas. The tested heat pipe was made of a copper tube with the outer diameter of 12.7 mm, the length of 340 mm, and the sintered metal wick had the thickness of 0.7 mm. This experiment was conflicted under the thermal load, inclined angle and cooling conditions.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.31 no.10
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• pp.823-831
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• 2007

This paper presents the experimental and simulation study of a loop heat pipe (LHP) that can be applied to present electronics, space missions and thermal control systems. The present experimental study was carried out employing sintered alumina ceramic wick ($d=2.96\;{\mu}m$, ${\phi}=0.61$). High purity R-134a, R-22 and water were also used as alternative working fluids in addition to ammonia. The experimental study showed that the maximum heat transfer performance for the test LHP in the vertical top heating mode was over 100 Watts when ammonia was used as the working fluid. The simulation results have been compared with the experimental results to validate a simulation model based on the thermal resistance network that was developed to evaluate the performance of LHPs, focusing on their prospective applications in electronics. The simulation model is based on the loop overall energy, mass, and momentum balance. The simulation program can predict the effects of various parameters which affect the performance of LHP within 5% compared with the experimental results.

• Proceedings of the KSME Conference
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• 2004.11a
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• pp.1241-1246
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• 2004

The heat flux on a chip is rapidly increasing with decreasing the size of one. It is necessary to properly cool the high heat flux chip. One of the promising cooling methods is to apply CPL heat pipes with porous materials, for example PVA, polyethylene, and powder sintered metal plate and with microchannels in the evaporator. A small scale CPL heat pipe with PVA as wick was designed and manufactured. Since the height difference between the evaporator and the condenser is a crucial parameter in the CPL heat pipes, the performance of the heat pipes depending on the parameter was investigated. The parameter is higher the performance is better. However, the improvement rate of the performance does not increase the increase rate of the height. In addition to, the parameter effect depending on heat input was investigated.