• 한국추진공학회지
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• 제8권4호
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• pp.16-25
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• 2004

구리분말 소결윅 히트파이프의 열수송 한계를 예측하는 이론적 해석을 수행하였다. 히트파이프의 직경은 8 mm이고 물을 작동유체로 사용하였다. 입자의 직경을 대표적인 5 가지로 분류하여 각각의 유효 모세관 반경($r_c$) 기공률($\varepsilon$), 투파율(K)을 토대로 작동온도와 윅 두에 그리고 경사각에 따른 모세관압력과 열수송 한계, 열저항을 분석하였다. 소결윅의 모세관한계는 입자 직경이 크고 윅 두께가 증가하며 작동온도가 높을수록 증가했다 기공률과 모세관 반경이 증가할수록 열수송 한계가 높아졌으며, 윅 두께가 증가함에 따라 열저항이 크게 상승하였다.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2004년도 춘계학술대회
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• pp.1487-1492
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• 2004

For the present study, three heat pipes with different thickness of sintered metal wick were manufactured, and their operational performances, such as capillary limit and thermal resistance were tested and compared with theoretical predictions. Experimental results showed good agreement with those by the theoretical model, and that seemed to present that the sintering process we had developed in the present study was valid.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2004년도 춘계학술대회
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• pp.1528-1533
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• 2004

In this study, we have manufactured the LHP(Loop Heat Pipe) with sintered metal wick and investigated the working characteristics of LHP experimentally.Water was used as a working fluid and fill charge rate was changed. LHP basically consist of the separated vapor/liquid channels, evaporator having sintered metal wick(effective pore diameter :$16{\sim}19{\mu}m$), and condenser cooled by water. The diameter of vapor/liquid line tube are 3.2mm/6.35mm, respectively. Heat transfer rate and thermal resistance was represented to study the basic characteristics of LHP at each conditions

• 대한기계학회:학술대회논문집
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• 대한기계학회 2008년도 추계학술대회B
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• pp.2357-2362
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• 2008

LHP is different from a conventional heat pipes in design and heat and fluid flow passages. The situations of the former is much complex than the latter. In LHPs, evaporation occurs at the contact interface between the heating plate and the porous wick, so some micro channels machined at the contact interface serve to let the vapor flow out of the evaporator. This complexity of contact geometry was known to cause a high resistance to heat flow. The present work was to study the problem of heat passage across the contact surface for LHPs and determine those values contact resistance. For two cases of contact structures, the thermal contact resistances were examined experimentally, one being obtained through mechanical contact under pressure and the other through sintered bonding. Nickel powder wick and copper plate were used for specimens. The result showed that a substantial reduction of contact resistance of an order of degree could be obtainable by sintered bonding.

• 한국에너지공학회:학술대회논문집
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• 한국에너지공학회 2003년도 추계 학술발표회 논문집
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• pp.291-297
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• 2003

For the present study, three heat pipes with different thickness of sintered metal wick were manufactured, and their operational performances, such as capillary limit and thermal resistance were tested and compared with theoretical predictions. Experimental results showed good agreement with those by the theoretical model, and that seemed to present that the sintering process we had developed ;n the present study was valid.

• 한국철도학회:학술대회논문집
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• 한국철도학회 2008년도 추계학술대회 논문집
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• pp.1710-1716
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• 2008

The Loop Heat Pipe (LHP) operates to pump the working fluid by means of the capillary force in a wick structure. Particularly, it is difficult to design and manufacture the evaporator consisted of a grooved container and a compensation chamber as well as the wick structure. This study is related to design and manufacture the grooved container coupled with wick structure, the properties of the wick structure such as the permeability, the porosity, and the maximum capillary pressure were measured to apply the cooling technology for Insulated Gate Bipolar Transistor (IGBT). The container of the LHP was manufactured by the electrical discharge process and the wick structure was sintered with the nickel particle by an axial-press apparatus with the pulse electronic discharge. As results, the properties of the wick were experimentally obtained about 60% of the porosity, 35kPa of the maximum capillary force and $1.53{\times}10-13m2$ of the permeability.

• 설비공학논문집
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• 제12권3호
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• pp.227-234
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• 2000

An experimental study was performed for understanding the limiting power and heat transfer characteristics of an MHP having the diameter of 3 or 4 mm which could be applied to cooling of miniature electronic equipment such as the notebook PC CPU etc. The experimental parameters which are inclination, structure of the wick, the length of the condenser and the total heat pipe were considered. The MHP with a woven-wired wick has the advantages of the improvement in capillary limit, the effective attachment tightly toward wall and the convenience in construction of wick. Cooling performance of the present MHP was compared with that of MHP with grooved, fine fiber and sintered type wick which were applied by existing enterprises. With respect to the inclination of$ -5^{\circ}$ , an MHP having the diameter of 3 or 4 mm shows the limiting power of 6~14 W. Therefore, it is expected that the MHP of the present study has sufficient applicability of cooling of notebook PC of which the amount of heat generated is about 12 W.

• 대한설비공학회:학술대회논문집
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• 대한설비공학회 2006년도 하계학술발표대회 논문집
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• pp.339-345
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• 2006

This these was conducted to investigate tile characteristics of a frozen start up for a VCHP which has water as a working fluid and Nitrogen as a non-condensible gas. The tested heat pipe was made of a copper tube with the outer diameter of 12.7 mm, the length of 340 mm, and the sintered metal wick had the thickness of 0.7 mm. This experiment was conflicted under the thermal load, inclined angle and cooling conditions.

• 대한기계학회논문집B
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• 제31권10호
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• pp.823-831
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• 2007

This paper presents the experimental and simulation study of a loop heat pipe (LHP) that can be applied to present electronics, space missions and thermal control systems. The present experimental study was carried out employing sintered alumina ceramic wick ($d=2.96\;{\mu}m$, ${\phi}=0.61$). High purity R-134a, R-22 and water were also used as alternative working fluids in addition to ammonia. The experimental study showed that the maximum heat transfer performance for the test LHP in the vertical top heating mode was over 100 Watts when ammonia was used as the working fluid. The simulation results have been compared with the experimental results to validate a simulation model based on the thermal resistance network that was developed to evaluate the performance of LHPs, focusing on their prospective applications in electronics. The simulation model is based on the loop overall energy, mass, and momentum balance. The simulation program can predict the effects of various parameters which affect the performance of LHP within 5% compared with the experimental results.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2004년도 추계학술대회
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• pp.1241-1246
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• 2004

The heat flux on a chip is rapidly increasing with decreasing the size of one. It is necessary to properly cool the high heat flux chip. One of the promising cooling methods is to apply CPL heat pipes with porous materials, for example PVA, polyethylene, and powder sintered metal plate and with microchannels in the evaporator. A small scale CPL heat pipe with PVA as wick was designed and manufactured. Since the height difference between the evaporator and the condenser is a crucial parameter in the CPL heat pipes, the performance of the heat pipes depending on the parameter was investigated. The parameter is higher the performance is better. However, the improvement rate of the performance does not increase the increase rate of the height. In addition to, the parameter effect depending on heat input was investigated.