• Korean Journal of Materials Research
• /
• v.14 no.7
• /
• pp.522-528
• /
• 2004

Heat analysis of the plate type and wave type heat sink were carried out by using computational simulation. The heat resistance and air flow of two heat sink models were analysed according to natural and forced convection condition and positions of fan. When a fan was at the position of z-axis and y-axis in forced convection, the heat resistances of plate type heat sink were $0.17^{\circ}C/W$, and $0.28^{\circ}C/W$ respectively. In the case of wave type heat sink, they were $0.18^{\circ}C/W$ and $0.53^{\circ}C/W$. As the air flow velocities were averagely $0.386\;m/s\~3.269\;m/s$, air flow velocity of plate type heat sink was faster than that of wave type. In this experiment, it was observed that the plate type heat sink showed a good ability of heat radiation comparing with wave type one.

• Proceedings of the Korean Society for Technology of Plasticity Conference
• /
• 2007.05a
• /
• pp.217-220
• /
• 2007

The quality of product depends on a lots of injection molding conditions at each operation stage and mainly was effected by pressure and temperature. The objective of this study was to investigate the relationship between the product quality and the distribution of pressure in a cavity with operation condition change. Specimen having some ribs was designed and the mold was prepared and temperature and pressure sensors were installed in the mold. PP was used and pressure distribution was measured with operation condition change. The relationship between the sink mark and the pressure in a cavity was investigated by measurement of the level of sink mark. The level of sink mark was decreased at the cross of plane and rib by increasing of pressure in a cavity, so the pressure should be controlled properly in order to get the required quality.

• Journal of KIISE:Information Networking
• /
• v.37 no.3
• /
• pp.204-216
• /
• 2010

Since Sensor nodes around a fixed sink have huge concentrated network traffic, the battery consumption of them is increased extremely. Therefore the lifetime of sensor networks is limited because of huge battery consumption. To address this problem, a mobile sink has been studied for load distribution among sensor nodes. Since a mobile sink changes its location in sensor networks continuously, the mobile sink has time limits to communicate with each sensor node and unstable signal strength from each sensor node. Therefore, a fair and stable data collection method between a mobile sink and sensor nodes is necessary in this environment. When some sensor nodes are not able to send data to the mobile sink, a real-time application in sensor networks cannot be provided. In this paper, the new scheduling method, FQMS (Fair Queuing for Mobile Sink), is proposed for fair and stable data collection for mobile sinks in sensor networks. The FQMS guarantees balanced data collecting between sensor nodes for a mobile sink. In out experiments, the FQMS receives more packets from sensor nodes than legacy scheduling methods and provides fair data collection, because moving speed of a mobile sink, distance between a mobile sink and sensor nodes and the number of sensor nodes are considered.

• Journal of the Korean Society of Manufacturing Process Engineers
• /
• v.16 no.2
• /
• pp.142-148
• /
• 2017

The objective of this study is to investigate the cooling characteristics of a heat sink for an LED headlight used in passenger cars. To this end, this study conducts the experimental and numerical analysis of the heat sink heated at constant heat fluxes without air flow applied. In the experiments, heat was transferred at a constant heat flux through the bottom of a heat sink. The measured temperature on pre-selected locations of the heat sink was in good agreement with the numerically predicted one. The experimental and numerical results indicate that the convective heat transfer coefficient for the natural convection mode was decreased by increasing the heat flux applied to the bottom of heat sink, lowering the cooling capabilities.

• Proceedings of the KSME Conference
• /
• 2007.05b
• /
• pp.2438-2443
• /
• 2007

In order to guarantee the performance of electronic products. It is needed to improve the cooling performance of heat sink. So this paper has been made to investigate the cooling performance for the aluminum heat sink using pulsating heat pipe(PHP). The pulsating heat pipe was used as a heat spreader. Working fluid was R-22. Heater (50 mm ${\times}$ 50 mm ${\times}$ 3mm) was attached to heat sink and it generated 30W, 60W, 80W, 100W. Heat sink was tested for forced convection with 1${\sim}$4m/s of inlet air velocity. And both type heat sinks were carried out by using CFD simulation. This study showed that pulsating heat pipe can be a good tool to improve cooling performance of heat sink.

• Proceedings of the Korean Information Science Society Conference
• /
• 2006.10d
• /
• pp.366-369
• /
• 2006

기존 single sink 센서 네트워크에서의 모든 센서 노드들은 sink로부터 flooding된 질의(query)를 전송 받은 후 센싱 data를 sink로 보냄에 있어서 목적지인 sink 주변 노드의 traffic 집중에 따른 에너지 소비로 인해 전체 네트워크 수명에 영향을 끼쳤다. 이러한 single sink 방식에서의 주변 노드의overhead와 센싱 데이터를 sink로 전달 할 때의 특정 경로상의 노드들의 잔여 에너지량을 고려하여 데이터를 전송하게 함으로써 전체 네트워크 수명을 연장 할 수 있다.

• Proceedings of the KSME Conference
• /
• 2004.04a
• /
• pp.1189-1194
• /
• 2004

In this paper, the effect of tip clearance on the cooling performance of the microchannel heat sink is presented under the fixed pumping power condition. For the various types of microchannel heat sink having different size of fin width and channel width, experimental study is conducted. Through the experiment, the tip clearance effect is investigated by increasing tip clearance from zero. As a result, it is shown that cooling performance of heat sink with tip clearance is better than that of heat sink without tip clearance. For the microchannel heat sink with tip clearance, the optimum conditions for cooling performance is also studied.

• Journal of the Korea Society for Simulation
• /
• v.15 no.4
• /
• pp.107-117
• /
• 2006

Wireless Sensor Network consists of sensor nodes and sink. A sink receives and processes signals created from sensor nodes. Many studies have been performed, since sensor network allows multiple nodes to run using a limited amount of energy, Most researches have focused on using fixed sink. However, in many cases, the sink has mobility effected by man, cars, and etc. This research proposes three methods for reducing the node's energy consumption which is applied the Grid method based on mobile sink. Most routing processes handled by the mobile sink and wireless sensor area is separated and operated respectively. So, this research allows decreasing the power costs. In addition, it also proposes methods using simulation to test the quality of the performance.

• International Journal of Computer Science & Network Security
• /
• v.21 no.3
• /
• pp.212-218
• /
• 2021

Low-power and Lossy Networks (LLNs) have become the common network infrastructure for a wide scope of Internet of Things (IoT) applications. For efficient routing in LLNs, IETF provides a standard solution, namely the IPv6 Routing Protocol for LLNs (RPL). It enables effective interconnectivity with IP networks and flexibly can meet the different application requirements of IoT deployments. However, it still suffers from different open issues, particularly in large-scale setups. These include the node unreachability problem which leads to increasing routing losses at RPL sink nodes. It is a result of the event of memory overflow at LLNs devices due to their limited hardware capabilities. Although this can be alleviated by the establishment of multi-sink topologies, RPL still lacks the support for effective load balancing among multiple sinks. In this paper, we address the need for an efficient multi-sink load balancing solution to enhance the performance of PRL in large-scale scenarios and alleviate the node unreachability problem. We propose a new RPL objective function, Multi-Sink Load Balancing Objective Function (MSLBOF), and introduce the Memory Utilization metrics. MSLBOF enables each RPL node to perform optimal sink selection in a way that insure better memory utilization and effective load balancing. Evaluation results demonstrate the efficiency of MSLBOF in decreasing packet loss and enhancing network stability, compared to MRHOF in standard RPL.

• Journal of the Korean Society of Manufacturing Process Engineers
• /
• v.12 no.4
• /
• pp.61-68
• /
• 2013

As an advance study for the development of a heat sink for special purpose high power illumination, an investigation was made to find feasibility for the application of copper plated EP to a heat sink of small LED light of less than 10W installed in commercial product. In this study, the plated heat sink with EP copper was fabricated for the conventional LED light. It was used actually for finding heat radiation property and effectiveness of the heat sink accompanied with measurement of luminous intensity. The heat is radiated by transfer and dissipation only through the copper plated surface due to extremely low heat conductivity of EP in case of EP heat sink; however the total area of the plate plays the function of heat transfer as well as heat radiation in case of the aluminum heat sink. It seems that the volume difference of heat radiating material is so big that the temperature $P_1$ is 9.0~12.3% higher in 3W and 42.7~54.0% higher in case of 6W volume difference of heat radiating material is so big that the temperature $P_1$ is 9.0~12.3% higher in 3W and 42.7~54.0% higher in case of 6W even though heat transfer rate of copper is approximately 1.9 times higher than that of aluminum. It was thought that this is useful to utilize for heat sink for low power LED light with the low heating rate. Also, the illumination could be greatly influenced by the surrounding temperature of the place where it is installed. Therefore, it seems that the illumination installation environment must be taken into consideration when selecting illumination. Further study was expected on order to aims at development of an exterior surface itself made into heat radiation plate by application of this technology in future.