• 제목/요약/키워드: Singularity Factor

검색결과 75건 처리시간 0.021초

응력특이성을 고려한 접착이음의 강도평가 방법 (Evaluation Method of Bonded Strength Considering Stress Singularity in Adhesively Bonded Joints)

  • 정남용
    • 한국생산제조학회지
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    • 제7권1호
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    • pp.58-68
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    • 1998
  • Advantages of adhesively bonded joints and techniques of weight reduction have led to increasing use of structural adhesives such as LSI(large scale integration) package, automobile, aircraft in the various industries. In spite of such wide applications of adhesively bonded joints, the evaluation method of bonding strength has not been established. Stress singularity occurs at the interface edges of adhesively bonded joints and it is required to analyze it. In this paper, the stress singularity using 2-dimensional elastic boundary element method (BEM) with the changes of the lap length and adhesive for single lap joint was analyzed, and experiments of strength evaluation were carried out. As the results, the evaluating method of bonding strength considering stress singularity at interface edges of adhesively bonded joints and stress intensity factor of interface crack have been proposed in static and fatigue test.

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수분 흡수로 인해 얇은 필름에 발생하는 계면 응력의 경계요소해석 (Boundary Element Analysis of Interface Stresses in a Thin Film Due to Moisture Absorption)

  • 이상순
    • 한국전산구조공학회:학술대회논문집
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    • 한국전산구조공학회 1999년도 봄 학술발표회 논문집
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    • pp.19-26
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    • 1999
  • This paper deals with the stress singularity induced at the interface corner between the viscoelastic thin film and the rigid substrate as the film absorbs moisture from the ambient environment. The rime-domain boundary element method is employed to investigate the behavior of interface stresses. The order of the free-edge singularity is obtained numerically for a given viscoelastic model. It is shown that the free-edge stress intensity factor is relaxed with time,'while the order of the singularity increases with time for the viscoelastic model considered.

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반도체 칩의 접착계면에 발생하는 열응력 해석 (Analysis of Thermal Stresses Developed in Bonding Interface of Semiconductor Chip)

  • 이상순
    • 한국전산구조공학회:학술대회논문집
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    • 한국전산구조공학회 1999년도 가을 학술발표회 논문집
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    • pp.437-443
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    • 1999
  • This paper deals with the stress singularity induced at the interface corner between the viscoelastic thin film and the rigid substrate subjected to uniform temperature change. The viscoelastic film has been assumed to be thermorheologically simple. The time-domain boundary element method(BEM) has been employed to investigate the behavior of interface stresses. The order of the free-edge singularity has been obtained numerically for a given viscoelastic model. It is shown that the free-edge stress intensity factor is relaxed with time, while the order of the singularity increases with time for the viscoelastic model considered.

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반도체 패키지의 경계요소법에 의한 균열진전경로의 예측 (Prediction of Crack Propagation Path Using Boundary Element Method in IC Packages)

  • 정남용
    • 한국자동차공학회논문집
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    • 제16권3호
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    • pp.15-22
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    • 2008
  • Applications of bonded dissimilar materials such as integrated circuit(IC) packages, ceramics/metal and resin/metal bonded joints, are very increasing in various industry fields. It is very important to analyze the thermal stress and stress singularity at interface edge in bonded joints of dissimilar materials. In order to investigate the IC package crack propagating from the edge of die pad and resin, the fracture parameters of bonded dissimilar materials and material properties are obtained. In this paper, the thermal stress and its singularity index for the IC package were analyzed using 2-dimensional elastic boundary element method(BEM). From these results, crack propagation direction and path by thermal stress in the IC package were numerically simulated with boundary element method.

경계요소법을 이용한 반도체 패키지의 응력특이성 해석 (Analyses of Stress Singularities on Bonded Interfaces in the IC Package by Using Boundary Element method)

  • 박철희;정남용
    • 한국공작기계학회논문집
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    • 제16권6호
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    • pp.94-102
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    • 2007
  • Applications of bonded dissimilar materials such as large scale integration (LSI) packages, ceramics/metal and resin/metal bonded joints, are very increasing in various industry fields. It is very important to analyze the thermal stress and stress singularity at interface edge in LSI. In order to investigate stress singularities on the bonded interface edges and delamination of die pad and resin in the IC package. In this paper, stress singularity factors(${\Gamma}_i$) and stress intensity factors($K_i$) considering thermal stress in the IC package were analyzed by using the 2-dimensional elastic boundary element method(BEM).

이종 마찰용접재의 파괴기준 설정 (Establishment of Fracture Criterion on Friction Welded Dissimilar Materials)

  • 정남용;박철희
    • 한국자동차공학회논문집
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    • 제14권5호
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    • pp.164-171
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    • 2006
  • Application of friction welding is increasing in the manufacturing process of machine elements in many industry fields. To establish a reasonable strength evaluation method and fracture criterion, it is necessary to analyze stress singularity under the residual stress condition on friction welded interface between dissimilar materials. In this paper, a method to establish fracture criterion on interface of friction welded dissimiliar materials was investigated by using the boundary element method BEM and static tensile testing. A quantitative fracture criterion for friction welded dissimilar materials is suggested by using stress singularity factor, $\Gamma$.

응력특이성을 고려한 SUH35/SUH3 마찰용접재의 강도평가 (Strength Evaluation of Friction Welded SUH35/SUB3 Considering Stress Singularity)

  • 정남용;박철희
    • 한국자동차공학회논문집
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    • 제14권4호
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    • pp.59-67
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    • 2006
  • Recently, application of friction welded SUH35/SUH3 is increasing in the manufacturing process of automotive engine valves For securing its reliability and a reasonable strength evaluation method, it is necessary to assess stress singularity under the residual stress condition on the friction welded interface between dissimilar materials. In this paper, strength evaluation method of friction welded materials was investigated by boundary element method and static tensile testing. An advanced method of quantitative strength evaluation for SUH35/SUH3 friction welded material is to be suggested by establishing fracture criterion by using stress singularity factors.

접착이음의 강도평가에 대한 해석 (Analysis for Strength Estimation of Adhesive Joints)

  • 박성완
    • 한국공작기계학회논문집
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    • 제14권5호
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    • pp.62-73
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    • 2005
  • The objects of this research are to establish the criteria of peel occurrence considering the shape of bond terminus and to compare the strength properties of adhesive joint of different three type such as butt joint, T-shape, and single lap Joints. The criteria of peel occurrence at the bond terminus was suggested. Peel loads of three type adhesive joint (butt Joint, T-shape specimen, single lap joint) were determined from tensile tests. Principal stress distributions of these joints were determined from finite element method analysis. Then, peel occurrence was estimated with stress singularity factor$(K_{prin})$ when the terminus shape was square, with average principal stress when the terminus shape was rounded. The conclusions are summarized as follows; (1) In the non-filleted model(e.g., butt joint, T-shape specimen), principal stress shows singularity at the bond terminus, intensity of stress(principal stress) singularity $(K_{prin})$ can use as the criteria of peel occurrence at the bond terminus. (2) In the filleted model(e.g., single lap joint), principal stress has not affected singularity at the bond terminus. Average principal stress$(K_{av})$ can use as the criteria of peel occurrence at the bond terminus.

강체모재들을 결합하고 있는 점탄성 접착재층의 계면모서리에서 발생하는 응력특이성의 경제요소해석 (Boundary Element Analysis of Stress Singularity at the Interface Corner of Viscoelastic Adhesive Layer Bonded Between Rigid Adherends)

  • 이상순;박준수
    • 전산구조공학
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    • 제10권2호
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    • pp.131-138
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    • 1997
  • 이 논문에서는, 균일한 횡방향 인장변형률이 작용하는 조건에서 강체모재들을 결합하고 있는 점탄성 접착재층의 계면모서리에 발생하는 응력 특이성을 조사하고있다. Williams방법을 응용하여 라플라스 변형공간에서 특성방정식을 구하였고, 주어진 점탄성 모델에 대해서 변형공간에서의 특성방정식을 시간공간으로 해석적으로 전환하였다. 시간 공간에서의 특이차수는 수치적으로 계산하였다. 계면을 따라 발생하는 응력의 특성을 조사하는데 시간영역 경계요소법을 적용하였다. 수치해석 결과에 의하면, 특이차수는 시간이 경과함에 따라 커지는 반면에, 자유모서리 응력확대계수는 시간에 따라 이완되는 특성을 보여주고 있다.

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단일방향 복합재료의 공유면에 존재하는 계면 모서리균열의 점탄성 해석 (Viscoelastic Analysis of Stress Intensity Factor for Interface Edge Crack in a Unidirectional Liminate)

  • 이상순;김범식
    • 전산구조공학
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    • 제10권1호
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    • pp.129-134
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    • 1997
  • 탄성 섬유와 점탄성 기지로 구성된 2차원의 단일방향 복합재료에서 발생하는 계면 응력 특이성을 시간영역 경계요소법을 사용하여 조사하였다. 먼저, 아무런 균열없이 섬유와 기지가 완전하게 결합되어 있는 단일방향 복합재료에 횡방향 인장변형이 작용할때 자유경계면 부근에 나타나는 계면 특이응력들을 조사하였다. 그러한 응력들은 섬유와 기지의 결합분리나 계면 모서리 균열을 야기 시킬수 있다. 다음에, 여러가지 크기의 모서리 균열들에 대한 응력확대계수가 계산되었다.

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