• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.529-532
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• 2003

Machining technique for optical crystals with single point diamond turning tool is reported in this paper. The main factors influencing the machined surface quality are discovered and regularities of machining process are drawn. Optical crystals have found more and more important applications in the field of modern optics. Optical crystals are mostly brittle materials of poor machinability. The traditional machining method is polishing which has many shortcomings such as low production efficiency. poor ability to be automatically controlled and edge effect of the workpiece. The purpose of our research is to find the optimum machining conditions for ductile cutting of optical crystals and apply the SPDT technique to the manufacturing of ultra precision optical components of brittle materials. As a result. the surface roughness is good when spindle speed is 200m/min. and teed rate is small. The influence of depth of cut is very small.

• Journal of the Korean Society for Precision Engineering
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• v.15 no.9
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• pp.152-157
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• 1998

Since early 1960s, the high precision machining technology, so called ultra-precision technology or nano technology, has been developed in many Held based on single point diamond turning technology. The major application of this technology is the optical components with aspherical surfaces. Now a days, customer requires the smaller and lighter optical elements, such as camera video and etc., with higher performance for convenience. So, the manufacturer focuses on the ultra-precision technology. Thus, this technology becomes the major target to challenge the advanced barrier for the next machining technology.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.414-417
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• 2005

Single point diamond turning technique for optical crystals is studied in this paper. The main factors which are influential the machined surface quality are discovered and regularities of machining process are drawn. Optical crystals have found more and more important applications in the field of modern optics. Optical crystals are mostly brittle materials of poor machinability. The traditional machining method is polishing which has many shortcomings such as low production efficiency, poor ability to be automatically controlled and edge effect of the workpiece. The purpose of our research is to find the optimal machining conditions for ductile cutting of optical crystals and to apply the SPDT technique to the manufacturing of ultra precision optical components of brittle material(Ge). Many technical challenges are being tried for the large space infrared telescope, which is one of the major objectives of the National Strategic Technology Road Map (NSTRM).

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.4 no.2
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• pp.31-36
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• 2005

Machining technique for optical crystals with single point diamond turning tool is reported in this paper. The main factors influencing the machined surface quality are studied and regularities of machining process are drawn. Optical crystals have been known to more and more important applications in the field of modern optics. Ge is more brittle material of poor machinability. The traditional machining method is polishing which has many shortcomings such as low production efficiency, poor ability to be automatically controlled and edge effect of the workpiece. The purpose of our research is to find the optimum machining conditions for ductile cutting of Ge and apply the SPDTM technique to the manufacturing of ultra precision optical components of Ge. As a result, the surface roughness is the best when cutting speed is 180m/min, feed rate is 2mm/min, depth of cut is $0.5{\mu}m$ and nose radius of tool is 0.8mm.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.22 no.2
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• pp.263-267
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• 2013

The continuing demand for increasingly slimmer and brighter liquid crystal display (LCD) panels has led to an increased focus on the role of light guide panels (LGPs) or optical films that are used to obtain diffuse, uniform light from the backlight unit (BLU). The most basic process in the production of such BLU components is the micromachining of V-shaped grooves. Thus, given the current trend, micromachining of V-shaped grooves is expected to play increasingly important roles in today's manufacturing technology. LCD BLUs comprise various optical elements such as a LGP, diffuser sheet, prism sheet, and protector sheet with V-shaped grooves. High-aspect-ratio patterns are required to reduce the number of sheets and enhance light efficiency, but there is a limit to the aspect ratio achievable for a given material and cutting tool. Therefore, this study comprised a series of experimental evaluations conducted to determine the machining limit in microcutting V-shaped grooves on electroless nickel plated die materials when using single-crystal diamond tools with point angles of $20^{\circ}-80^{\circ}$. Cutting performance was evaluated at various cutting speeds and depths of cut using different machining methods and machine tools. The experimental results are that V-shaped patterns with angles of $80^{\circ}$ or up can be realized regardless of the machining conditions and equipment. Moreover, the feed rate has little effect on machinability, and it is thought that the fly-cut method is more efficient for shallow patterns.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.10a
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• pp.184-187
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• 2005

This paper is described about the technique of ultra-precision machining for optical parts in HMD system. Machining technique for PMMA and BK7 with single point diamond turning machining is reported in this paper. The main factors influencing on the machined surface quality are discovered and regularities of machining process are drawn. The purpose of our research is to find the optimum machining conditions fur cutting of PMMA and grinding of BK7. Also, apply the SPDTM technique to the manufacturing of ultra precision optical components of HMD system. Aspheric PMMA lens without a polishing process, the surface roughness of 5 nm Ra, and the form error of ${\lambda}/2\;({\lambda}=632.8nm)$ for reference curved surface 30 mm has been required.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.1507-1510
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• 2005

This study was carried out as a part of the research on the development of a maskless and electroless process for fabricating metal micro/nanostructures by using a nanoindenter and an electroless deposition technique. $2-\mu{m}-deep$ indentation tests on Ni and Cu samples were performed. The elastic recovery of the Ni and Cu was 9.30% and 9.53% of the maximum penetration depth, respectively. The hardness and the elastic modulus were 1.56 GPa and 120 GPa for Ni and 1.49 GPa and 100 GPa for Cu. The effect of single-point diamond machining conditions such as the Berkovich tip orientation (0, 45, and $90^{\circ}$) and the normal load (0.1, 0.3, 0.5, 1, 3, and 5 mN), on both the deformation behavior and the morphology of cutting traces (such as width and depth) was investigated by constant-load scratch tests. The tip orientation had a significant influence on the coefficient of friction, which varied from 0.52-0.66 for Ni and from 0.46-0.61 for Cu. The crisscross-pattern sample showed that the tip orientation strongly affects the surface quality of the machined area during scratching. A selective deposition of Cu at the pit-like defect on a p-type Si(111) surface was also investigated. Preferential deposition of the Cu occurred at the surface defect sites of silicon wafers, indicating that those defect sites act as active sites for the deposition reaction. The shape of the Cu-deposited area was almost the same as that of the residual stress field.

• Journal of the Korean Society for Precision Engineering
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• v.30 no.12
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• pp.1303-1312
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• 2013

We report an ultra-precision lathe designed to machine micron-scale features on a large-area roll mold. The lathe can machine rolls up to 600 mm in diameter and 2,500 mm in length. All axes use hydrostatic oil bearings to exploit the high-precision, stiffness, and damping characteristics. The headstock spindle and rotary tooling table are driven by frameless direct drive motors, while coreless linear motors are used for the two linear axes. Finite element method modeling reveals that the effects of structural deformation on the machining accuracy are less than $1{\mu}m$. The results of thermal testing show that the maximum temperature rise at the spindle outer surface is approximately $0.5^{\circ}C$. Finally, performance evaluations of the error motion, micro-positioning capability, and fine-pitch machining demonstrate that the lathe is capable of producing optical-quality surfaces with micron-scale patterns with feature sizes as small as $20{\mu}m$ on a large-area roll mold.

• Journal of the Korean Society for Precision Engineering
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• v.23 no.8 s.185
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• pp.171-177
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• 2006

This study was performed as a part of the research on the development of a maskless and electroless process for fabricating metal micro/nanostructures by using a nanoindenter and an electroless deposition technique. $2-{\mu}m$-deep indentation tests on Ni and Cu samples were performed. The elastic recovery of the Ni and Cu was 9.30% and 9.53% of the maximum penetration depth, respectively. The hardness and the elastic modulus were 1.56 GPa and 120 GPa for Ni and 1.51 GPa and 104 GPa for Cu. The effect of single-point diamond machining conditions such as the Berkovich tip orientation (0, 45, and $90^{\circ}$ ) and the normal load (0.1, 0.3, 0.5, 1, 3, and 5 mN), on both the deformation behavior and the morphology of cutting traces (such as width and depth) was investigated by constant-load scratch tests. The tip orientation had a significant influence on the coefficient of friction, which varied from 0.52-0.66 for Ni and from 0.46- 0.61 for Cu. The crisscross-pattern sample showed that the tip orientation strongly affects the surface quality of the machined are a during scratching. A selective deposition of Cu at the pit-like defect on a p-type Si(111) surface was also investigated. Preferential deposition of the Cu occurred at the surface defect sites of silicon wafers, indicating that those defect sites act as active sites for the deposition reaction. The shape of the Cu-deposited area was almost the same as that of the residual stress field.