• Journal of the Institute of Electronics Engineers of Korea SC
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• v.44 no.1
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• pp.85-93
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• 2007

This paper presents new LVDS I/O circuits with a high noise margin for use in highly parallel I/O environments. The proposed LVDS I/O includes transmitter and receiver parts. The transmitter circuits consist of a differential phase splitter and a output stage with common mode feedback(CMFB). The differential phase splitter generates a pair of differential signals which have a balanced duty cycle and $180^{\circ}$ phase difference over a wide supply voltage variation due to SSO(simultaneous switching output) noises. The CMFB output stage produces the required constant output current and maintains the required VCM(common mode voltage) within ${\pm}$0.1V tolerance without external circuits in a SSO environment. The proposed receiver circuits in this paper utilizes a three-stage structure(single-ended differential amp., common source amp., output stage) to accurately receive high-speed signals. The receiver part employs a very wide common mode input range differential amplifier(VCDA). As a result, the receiver improves the immunities for the common mode noise and for the supply voltage difference, represented by Vgdp, between the transmitter and receiver sides. Also, the receiver produces a rail-to-rail, full swing output voltage with a balanced duty cycle(50% ${\pm}$ 3%) without external circuits in a SSO environment, which enables correct data recovery. The proposed LVDS I/O circuits have been designed and simulated with 0.18um TSMC library using H-SPICE.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.4
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• pp.69-74
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• 2013

In this paper, the impact of integrating large number of I/O (Input-Output) and Core power Delivery Network (PDN) on a 6 layers Flip-Chip Ball Grid Array (FCBGA) package is investigated. The impact of core induced supply noise on high-speed I/O interfaces, and high-speed I/O interface's supply noise coupling to adjacent high-speed I/O interfaces' jitter impact are studied. Concurrent stress validation software is used to induce SSO noise on each individual I/O interfaces; and at the same time; periodic noise is introduced from Core PDN into the I/O PDN domain. In order to have the maximum coupling impact, a prototype package is designed to merge the I/O and Core PDN as one while impact on jitter on each I/O interfaces are investigated. In order to understand the impact of the Core to I/O and I/O to I/O noise, the on-die noise measurements were measured and results were compared with the original PDN where each I/O and Core PDN are standalone and isolated are used as a benchmark.