• 센서학회지
• /
• 제10권5호
• /
• pp.292-303
• /
• 2001

본 연구에서는 수평형 전계 방출 소자를 제작하고 그 특성을 측정하였다. 이를 진공자장 센서에 이용하기 위하여 Lorentz 원리를 응용하여 센서를 설계하고 제작하였다. $POCl_3(10^{20}cm^{-3})$ 도핑된 다결정 실리콘을 전계 방출 소자의 음극 및 양극 재료로 이용하였으며 그 두께는 각각 $2\;{\mu}m$였다. PSG(두께 $2\;{\mu}m$)를 희생층으로 사용하여 최종 단계에서 불산을 이용하여 제거하고 승화건조법을 이용하여 소자의 기판 점착 현상을 방지하였다. 제작된 소자를 유리기판 #1 위에 silver paste로 고정시키고 Cr 전극 패드와 와이어본딩 한 뒤 진공내에서 양극접합공정을 이용하여 소자를 $1.0{\times}10^{-6}\;Torr$에서 진공 실장하였다. 실장 후 게터를 활성화하여 내부진공도를 향상시켰다. 이렇게 패키징된 소자는 두달여 기간 동안 특별한 특성저하 없이 잘 동작되었으며 그 이상의 기간에 대해서는 확인하지 못하였다. 패키징된 자장 센서는 패키징하기 전 진공챔버 내에서 보인 특성치와 별다른 차이 없이 잘 동작되었으며 단지 약간의 전류 감소 현상만이 관찰되었다. 측정된 센서의 감도는 약 3%/T로서 작은 값이었으나 그 가능성을 확인할 수는 있었다.

• 한국재료학회지
• /
• 제19권7호
• /
• pp.349-355
• /
• 2009

Metal thin film patterns on a LTCC substrate, which was connected through inner via and metal paste for electrical signals, were formed by a screen printing process that used electric paste, such as silver and copper, in a conventional method. This method brought about many problems, such as non uniform thickness in printing, large line spaces, and non-clearance. As a result of these problems, it was very difficult to perform fine and high resolution for high frequency signals. In this study, the electric signal patterns were formed with the sputtered metal thin films (Ti, Cu) on an LTCC substrate that was coated with protective oxide layers, such as $TiO_2$ and $SiO_2$. These electric signal patterns' morphology, surface bonding strength, and effect on electro plating were also investigated. After putting a sold ball on the sputtered metal thin films, their adhesion strength on the LTCC substrate was also evaluated. The protective oxide layers were found to play important roles in creating a strong design for electric components and integrating circuit modules in high frequency ranges.

• 한국재료학회지
• /
• 제13권1호
• /
• pp.18-23
• /
• 2003

Properties of Ag thick films fabricated by using low temperature curable silver pastes were investigated. Ag pastes were consisted of polymer resins and silver powders. Ag pastes were used for conductive or fixing materials between board and various electrical and electronic devices. Low temperature curable Ag pastes have some advantages over high temperature curable types. In cases of chip mounting, soldering properties were required for screen printed Ag thick films. In this study, four types of Ag pastes were fabricated with different compositions. Screen printed Ag thick films on alumina substrates were fabricated at various curing temperatures and times. Thickness, resistivity, adhesive strength and solderability of fabricated Ag thick films were characterized. Finally, Ag thick films produced using Ag pastes, sample A and B, cured at $150^{\circ}C$ for longer than 6 h and $180^{\circ}C$ for longer than 2 h, and $150^{\circ}C$ for longer than 1 h and $180^{\circ}C$ for 1 h, respectively, showed low resistivities of $10^{-4}$ $∼10^{-5}$ Ωcm and good adhesive strength of 1∼5 Mpa. Soldering properties of those Ag thick films with curing temperatures at solder of 62Sn/36Pb/3Ag were also investigated.

• 한국재료학회지
• /
• 제28권9호
• /
• pp.528-533
• /
• 2018

In recent years, solar cells based on crystalline silicon(c-Si) have accounted for much of the photovoltaic industry. The recent studies have focused on fabricating c-Si solar modules with low cost and improved efficiency. Among many suggested methods, a photovoltaic module with a shingled structure that is connected to a small cut cell in series is a recent strong candidate for low-cost, high efficiency energy harvesting systems. The shingled structure increases the efficiency compared to the module with 6 inch full cells by minimizing optical and electrical losses. In this study, we propoese a new Conductive Paste (CP) to interconnect cells in a shingled module and compare it with the Electrical Conductive Adhesives (ECA) in the conventional module. Since the CP consists of a compound of tin and bismuth, the module is more economical than the module with ECA, which contains silver. Moreover, the melting point of CP is below $150^{\circ}C$, so the cells can be integrated with decreased thermal-mechanical stress. The output of the shingled PV module connected by CP is the same as that of the module with ECA. In addition, electroluminescence (EL) analysis indicates that the introduction of CP does not provoke additional cracks. Furthermore, the CP soldering connects cells without increasing ohmic losses. Thus, this study confirms that interconnection with CP can integrate cells with reduced cost in shingled c-Si PV modules.

• 한국신재생에너지학회:학술대회논문집
• /
• 한국신재생에너지학회 2010년도 춘계학술대회 초록집
• /
• pp.91.2-91.2
• /
• 2010

The use of plated front contact for metallization of silicon solar cell may alternative technologies as a screen printed and silver paste contact. This technologies should allow the formation of contact with low contact resistivity a high line conductivity and also reduction of shading losses. The better performance of Ni/Cu contacts is attributed to the reduced series resistance due to better contact conductivity of Ni with Si and subsequent electroplating of Cu on Ni. The ability to pattern narrower grid lines for reduced light shading combined with the lower resistance of a metal silicide contact and improved conductivity of plated deposit. This improves the FF as the series resistance is deduced. This is very much required in the case of low concentrator solar cells in which the series resistance is one of the important and dominant parameter that affect the cell performance. A selective emitter structure with highly dopes regions underneath the metal contacts, is widely known to be one of the most promising high-efficiency solution in solar cell processing. This paper using selective emitter structure technique, fabricated Ni/Cu plating metallization cell with a cell efficiency of 17.19%.

• 대한기계학회논문집B
• /
• 제39권4호
• /
• pp.379-384
• /
• 2015

최근 전기방사를 이용한 프린팅이 미세 패터닝 분야에 응용이 되고 있다. 전기방사를 이용한 패터닝은 연속 프린팅 방식으로 기존의 요구적출형 방식에 비해 패터닝 속도가 빠르다는 장점이 있다. 안정적인 연속 프린팅을 위해서는 고분자의 폴리머를 프린팅하려고 하는 잉크에 혼합하는 것이 필요하다. 본 연구에서는 PEO 를 이러한 첨가 폴리머로 사용하였다. 이러한 폴리머의 첨가에 대한 잉크의 점도 및 Taylor cone 형성에 대해 미치는 영향을 조사하였다. 마지막으로 전기방사 프린팅의 예로서 실버 페이스트 잉크를 유리 기판 위에 패터닝하였다.

• 대한기계학회논문집A
• /
• 제30권4호
• /
• pp.364-372
• /
• 2006

In this paper, we present a finger tip tactile sensor which can detect contact normal force as well as slip. The sensor is made up of two different materials, such as polyvinylidene fluoride (PVDF) known as piezoelectric polymer, and pressure variable resistor ink. In order to detect slip on the surface of the object, two PVDF strips are arranged along the normal direction in the robot finger tip and the thumb tip. The surface electrode of the PVDF strip is fabricated using silk-screening technique with silver paste. Also a thin flexible force sensor is fabricated in the form of a matrix using pressure variable resistor ink in order to sense the static force. The developed tactile sensor is physically flexible and it can be deformed three-dimensionally to any shape so that it can be placed on anywhere on the curved surface. In addition, a tactile sensing system is developed, which includes miniaturized charge amplifier to amplify the small signal from the sensor, and the fast signal processing unit. The sensor system is evaluated experimentally and its effectiveness is validated.

• 한국전기전자재료학회논문지
• /
• 제19권10호
• /
• pp.966-970
• /
• 2006

We reported on characteristics of the piezoelectric ceramic-polymer composite for the application of the thick-film speaker. The PVDF-PZT composites were fabricated to incorporate the advantages of both ceramic and polymer with various mixing ratios by 3-roll mill mixer. The composite solutions were coated by the conventional screen-printing method on ITO electrode coated PET (Polyethylene terephthalate) polymer film. After depositing the top-electrode of silver-paste, 4 kV/mm of DC field was applied at $120^{\circ}C$ for 30 min to poling the composite films. The value of $d_{33}$ (piezoelectric charge constant) was increased when the PZT weight percent was increased. The maximum value of the $d_{33}$ was 24 pC/N at 70 wt% PZT. But the $g{33}$ (piezoelectric voltage constant) showed the maximum value of $32mV{\cdot}m/N$ at 65 wt% of PZT powder. The SPL (sound pressure level) of the speaker fabricated with the 65:35 composite film was about 68 dB at 1 kHz.

• 제어로봇시스템학회:학술대회논문집
• /
• 제어로봇시스템학회 2005년도 ICCAS
• /
• pp.1808-1813
• /
• 2005

In this paper, we present the finger tip tactile sensor which can detect contact normal force as well as slip. The developed sensor is made of two different materials, such as polyvinylidene fluoride(PVDF) that is known as piezoelectric polymer and pressure variable resistor ink. In order to detect slip to surface of object, a PVDF strip is arranged along the normal direction in the robot finger tip and the thumb tip. The surface electrode of the PVDF strip is fabricated using silk-screening technique with silver paste. Also a thin flexible force sensor is fabricated in the form of a matrix using pressure variable resistor ink in order to sense the static force. The developed tactile sensor is physically flexible and it can be deformed three-dimensionally to any shape so that it can be placed on anywhere on the curved surface. In addition, we developed a tactile sensing system by miniaturizing the charge amplifier, in order to amplify the small signal from the sensor, and the fast signal processing unit. The sensor system is evaluated experimentally and its effectiveness is validated.

• 한국초전도학회:학술대회논문집
• /
• 한국초전도학회 2000년도 High Temperature Superconductivity Vol.X
• /
• pp.298-303
• /
• 2000

We evaluated the electric properties of Bi-2223 jointed tapes processed by both resistive- and supercondcuting-joint methods. For the resistive-joint, filler materials of wood metal, Pb/Sn, In, and silver paste were used, whereas, for the superconductive-joint, the lap joint method were used. In the resistive-joint tape, it was observed that the electrical properties such as current transport property, n-value, and contact resistance of the tape were significantly related to the resistivity of filler materials. On the other hand, in the superconducting-joint tape, the current transport property was dependent on the uniaxial pressure. Specifically, the current transport property varied 50 to 80% with uniaxial pressure, probably due to the irregular microstructure in the transition region.