• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2006년도 6th International Meeting on Information Display
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• pp.1126-1129
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• 2006

Here we developed a conductive ink which contains silver nanoparticles from which the electrodes for organic thin film transistor were directly patterned by ink-jet printing. To fabricate a coplanar type OTFT, solution processable semiconducting oligomer, ${\alpha},{\omega}-dihexylquaterthiophene$ (DH4T) was drop-cast onto between the ink-jet printed silver electrodes and I-V characteristics were measured.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2008년도 제39회 하계학술대회
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• pp.1450-1451
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• 2008

To investigate the reliability of the conductive lines patterned by ink-jet printing, we evaluated the reliability of the ink-jet printed silver (Ag) patterns according to the guide lines built up as assessments methods in the production of conventional rigid printed circuit boards. The assessment methods include the uniformity of line width and space, adhesive strength, dielectric withstand, solder float, thermal shock test and pressure cooker test (PCT). To prepare assesment vehicles, different regular test patterns were created by Ag ink-jet printing on the same polyimide substrate for each of assessment methods.

• 청정기술
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• 제21권2호
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• pp.85-89
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• 2015

다양한 전자부품에 활용되는 금속 잉크 기술은 전자부품산업의 주요 기술로 자리매김하였으며 이에 대한 연구 개발이 점차 증가하고 있다. 그 중에서 실버 잉크는 뛰어난 전도성과 안정성을 가지고 있어서 전자부품산업에 오랫동안 이용되어 왔으며 최근에는 입자 크기를 나노 크기로 분산시킨 실버 나노 잉크를 개발하여 디스플레이, 전자태그, 반도체와 연성회로 기판 등에 사용되는 전자소재로써 각광받고 있다. 그러나 이러한 전자산업기기의 첨단화는 제품의 생산량과 소비량을 증가시켜 제조 공정 중에 발생되는 환경오염 물질과 사용하고 버려지는 제품들에 의해 심각한 환경 문제를 가져올 것으로 예상된다. 따라서 본 연구에서는 습식환원법에 의해 제조된 실버나노 잉크의 제조 공정이 환경에 미치는 영향을 전과정평가(life cycle assessment, LCA) 기법을 이용하여 평가하였다. 전과정 평가 소프트웨어로는 GaBi 6를 사용하였고, 유관기관으로부터 받은 실버 나노 잉크의 제조 공정 데이터를 참고하여, 인벤토리를 구축하였으며 전과정목록분석(international organization for standardization, ISO) 14040, 14044 규격의 4단계에 걸쳐 LCA를 수행하였다.

• ETRI Journal
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• 제35권4호
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• pp.571-577
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• 2013

The fabrication of a thin-film transistor backplane and a liquid-crystal display using printing processes can eliminate the need for photolithography and offers the potential to reduce the manufacturing costs. In this study, we prepare contact via structures through a poly(methyl methacrylate) polymer insulator layer using inkjet printing. When droplets of silver ink composed of a polymer solvent are placed onto the polymer insulator and annealed at high temperatures, the silver ink penetrates the interior of the polymer and generates conducting paths between the top and bottom metal lines through the partial dissolution and swelling of the polymer. The electrical property of various contact via-hole interconnections is investigated using a semiconductor characterization system.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2008년도 International Meeting on Information Display
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• pp.799-802
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• 2008

The metal films ink-jetted using the conductive ink based on a mixture of copper and silver nanoparticles were investigated. The porosity and resistivity of films were minimized by adjusting the mixing ratio of Cu and Ag nanoparticles. We demonstrated that the printed tracks with good conductivity could be obtained at sufficiently lower annealing temperatures where plastic substrates could be used.

• 비파괴검사학회지
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• 제34권5호
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• pp.377-383
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• 2014

위치 감응형 전극 네트워크(addressable conducting network, ACN)는 탄소섬유 복합재료와 전극 사이의 접촉저항을 통해 구조물의 손상 감지가 가능하다. 손상 감지를 위한 위치 감응형 전극 네트워크의 신뢰성을 향상시키기 위해서는 전극과 복합재료 사이의 접촉저항이 최소화되어야 한다. 본 연구에서는 은 나노 전극을 탄소섬유 복합재료 위에 인쇄전자기술을 이용하여 제작하였다. 은 전극이 형성된 복합재료는 은 나노 잉크의 소결온도와 복합재료의 표면거칠기에 따라 제작되었으며, 이에 따른 접촉저항을 측정하였다. 또한, 전자주사현미경(scanning electron microscope, SEM)을 통해 전극과 복합재료 사이의 계면을 관찰하였다. 본 연구를 통해, 은 나노 잉크의 소결온도가 $120^{\circ}C$, 복합재료의 표면거칠기가 0.230a일 때, $0.3664{\Omega}$의 최소 접촉저항을 나타냈다.

• Macromolecular Research
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• 제17권1호
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• pp.2-4
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• 2009

• 한국진공학회:학술대회논문집
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• 한국진공학회 2013년도 제44회 동계 정기학술대회 초록집
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• pp.641-641
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• 2013

We report the transparentsilver nanowire electrode fabricated by a direct printing process, liquid-bridge-mediated nanotransfer molding. We fabricated silver nanowire arrays by liquidbridge- mediated nanotransfer molding using the silver nanoparticle ink and PEDOT:PSS polymer. Weinvestigated the formation of silver nanowire arrays by SEM and transmittance of the transparent silver nanowire electrode. We also measured the conductivity to confirm the potential of our approach.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2007년도 Techno-Fair 및 추계학술대회 논문집 전기물성,응용부문
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• pp.100-101
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• 2007

Polymer thick film capacitors were successfully fabricated by using ink-jet printing and screen printing technology. First, a bottom electrode was patterned by ink-jet printing of a nano-sized silver ink. Next, a dielectric layer was formed by the screen printing, then a top electrode was pattern by ink-jet printing of a nano-sized silver ink. The printed area of the dielectric layers were changed into $2{\times}2m^2$and $4{\times}2m^2$, and also the area of the electrodes were patterned with $1{\times}1mm^2$ and $1{\times}3mm^2$. The thickness of the printed dielectric layer was ranged from 1.1 to $1.4{\mu}m$. The analysis of capacitances verified that the capacitances was proportional to the area of the printed electrode. The capacitances of the fabricated capacitors resulted in one third of the calculated capacitances.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 춘계학술대회 및 기술 세미나 논문집 디스플레이 광소자
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• pp.59-60
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• 2008

In this paper, we have investigated the sintering of the organometallic silver electronic ink. We have changed the sintering temperature from 100 to $300^{\circ}C$ in the various atmospheres. The sheet resistance was abruptly changed at the temperature range between 115 and $120^{\circ}C$, due to the f of the crystalline silver resulting from the dissociation of Ag complex, which phenomenon has been confirmed by X-ray diffraction. The grain sizes of Ag films were about 50nm and 70nm at the sintering temperatures of 115 and $150^{\circ}C$, respectively.