• Journal of the Korean Society for Precision Engineering
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• v.29 no.1
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• pp.13-18
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• 2012

In this study, silicone injection molding technology with curved thermoplastic insert was developed to produce super-hydrophobic surface. Thermoplastic insert part and injection mold design of base plastic cover were performed to produce cost effective hydrophobic surface part. An optimization process of part thickness for thermoplastic insert part was performed with transient thermal analysis under silicone over-molding process condition. Structural thermal analysis of silicone injection mold was also performed to obtain uniform temperature condition on the surface of micro-patterned mold core. Super-hydrophobic surface for the silicone injection molded part with thermoplastic insert could be verified from the measurement of contact angle. It was shown that the averaged contact angle was over $140^{\circ}$.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2009.05a
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• pp.425-428
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• 2009

Silicone is recently used for LED chip encapsulment due to its good thermal stability and optical transmittance. To mold a solid-state silicone encapsulment, curing by mixing at elevated temperatures followed by cooling is necessary. As the silicone molding process is involved in healing and subsequent cooling, the thermal residual stress, which causes mechanical warpage or optical birefringence in the final silicone encapsulment, may be induced if there are non-uniformities in cured silicone material properties or encapsulment shape design. The prediction of residual stress is necessary to design a high-quality silicone molding process. Therefore, in the present paper, a numerical parametric study was attempted to evaluate the heating and cooling effects on the thermal residual stress induced in the cured silicone.

• Korean Journal of Radiology
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• v.22 no.7
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• pp.1054-1065
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• 2021

Objective: We implemented a novel resectable myocardial model for mock myectomy using a hybrid method of three-dimensional (3D) printing and silicone molding for patients with apical hypertrophic cardiomyopathy (ApHCM). Materials and Methods: From January 2019 through May 2020, 3D models from three patients with ApHCM were generated using the end-diastolic cardiac CT phase image. After computer-aided designing of measures to prevent structural deformation during silicone injection into molding, 3D printing was performed to reproduce anatomic details and molds for the left ventricular (LV) myocardial mass. We compared the myocardial thickness of each cardiac segment and the LV myocardial mass and cavity volumes between the myocardial model images and cardiac CT images. The surgeon performed mock surgery, and we compared the volume and weight of the resected silicone and myocardium. Results: During the mock surgery, the surgeon could determine an ideal site for the incision and the optimal extent of myocardial resection. The mean differences in the measured myocardial thickness of the model (0.3, 1.0, 6.9, and 7.3 mm in the basal, midventricular, apical segments, and apex, respectively) and volume of the LV myocardial mass and chamber (36.9 mL and 14.8 mL, 2.9 mL and -9.4 mL, and 6.0 mL and -3.0 mL in basal, mid-ventricular and apical segments, respectively) were consistent with cardiac CT. The volume and weight of the resected silicone were similar to those of the resected myocardium (6 mL [6.2 g] of silicone and 5 mL [5.3 g] of the myocardium in patient 2; 12 mL [12.5 g] of silicone and 11.2 mL [11.8 g] of the myocardium in patient 3). Conclusion: Our 3D model created using hybrid 3D printing and silicone molding may be useful for determining the extent of surgery and planning surgery guided by a rehearsal platform for ApHCM.

• Design & Manufacturing
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• v.6 no.1
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• pp.84-89
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• 2012

Silicone is recently used for LED chip encapsulment due to its good thermal stability and optical transmittance. In order to predict residual stress which causes optical briefringence and mechanical warpage of silicone, finite element analysis was conducted for both curing and cooling process during silicone molding. For analysis of curing process, a cure kinetics model was derived based on the differential scanning calorimetry(DSC) test and applied to the material properties for finite element analysis. Finite element simulation result showed that the curing as well as the cooling process should be designed carefully so as to reduce the residual stress although the cooling process plays the bigger role than curing process in determining the final residual stress state. In addition, birefringence experiment was carried out in order to observe residual stress distribution. Experimental results showed that cooling-induced birefringence was larger than curing-induced birefringence.

• Journal of Technologic Dentistry
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• v.3 no.1
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• pp.9-16
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• 1981

A comparative study was conducted to evaluate the relationship of investing medium to the amount of vertical occlusal changes and to the differences of surface smoothness during denture construction. Three groups of 20 dentures, 30 sets of upper and lower were fabricated of conventional heatcuring acrylic denture base resin, using silicone-gypsum molding techniques, with or without covering the occlusal surfaces of the teeth by artificial stone and all-gypsum molding techniques. The distance between the two reference points indented by 1/2 round bur on the upper and lower frontal surfaces of each articulator were measured and recorded before processing and again after processing and remounting of each denture on the articulator. The differences between the two recordings indicated the amount of vertical opening during denture processing. The difference of surface smoothness were investigated and determined by 3 observers continual comparing of the two randomly selected dentures with each other, which were seperately selected as pairs from the different two groups of 20. The results obtained were as follows: 1. During resin processing no statistically significant differences of the amount of vertical occlusal changes were detected between any of the two groups of two silicone-gypsum and one allgypsum molding techniques, although the amount of vertical opening was somewhat increased when silicone-gypsum molding technique was used. 2. Surface smoothness of the processed denture was makedly by increased when silicone-gypsum molding technique was used.

• Design & Manufacturing
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• v.17 no.1
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• pp.1-5
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• 2023

In multi-material injection molding, since two or more materials with different process conditions are used, it is essential to maximize process efficiency by operating the cooling or heating system to a minimum. In this study, Liquid silicone rubber (LSR) that can be cured at a low temperature suitable for the multi-material injection molding was selected and the cure behavior according to the process conditions was analyzed through differential scanning calorimetry (DSC). Dynamic measurement results of DSC with different heating rate were obtained, and through this, the total heat of reaction when the LSR was completely cured was calculated. Isothermal measurement results of DSC were derived for 60 minutes at each temperature from 80 ℃ to 110 ℃ at 10 ℃ intervals, and the final degree of cure at each temperature was calculated based on the total heat of reaction identified from the Dynamic DSC measurement results. As the result, it was found that when the temperature is lowered, the curing start time and the time required for the curing reaction increase, but at a temperature of 90 ℃ or higher, LSR can secure a degree of cure of 80% or more. However, at 80 ℃., it was found that not only had a relatively low degree of curing of about 60%, but also significantly increased the curing start time. In addition, in the case of 110 ℃, the parameters were derived from experimental result using the Kamal kinetic model.

• International Journal of Fuzzy Logic and Intelligent Systems
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• v.8 no.2
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• pp.94-99
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• 2008

The replica of silicone mold which can produce the test samples and the market-displayable products without making expensive metallic patterns is advantageous because it incurs less cost than the ordinary method that manufactures the products from the metallic patterns. However, the production of the products using silicone mold should require a technician with professional knowledge about the metallic patterns every time. Thus we tried to judge whether a forming analysis software for iron molding can be applied to silicon molding in this paper. In other words, this paper suggests a method to use a computer simulator from the designing step of the silicone mold, which is the most important part in making replica using simple silicone molds to the step of pouring the cast. The paper shows that if the know-how of a professional worker is provided in advance, an amateur worker can easily produce silicone molds of the best quality, the defective rate of the products will be decreased, and the replica will have a more complete status. By doing so, we suggested a possibility for reducing the delivery time at the production sites and for improving the product quality.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2009.06a
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• pp.217-218
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• 2009

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2009.10a
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• pp.323-327
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• 2009

Silicone is recently used for LED chip encapsulment due to its good thermal stability and optical transmittance. In order to predict residual stress which causes optical briefringence and mechanical warpage of silicone, finite element analysis was conducted for both curing and cooling process during silicone molding. For analysis of curing process, a cure kinetics model was derived based on the differential scanning calorimetry(DSC) test and applied to the material properties for finite element analysis. Finite element simulation result showed that the curing as well as the cooling process should be designed carefully so as to reduce the residual stress although the cooling process plays the bigger role than curing process in determining the final residual stress state.

• Transactions of Materials Processing
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• v.24 no.2
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• pp.101-106
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• 2015

Recently, silicone is being used for LED chip lens due to its good thermal stability and optical transmittance. In order to predict residual stresses, which cause optical birefringence and mechanical warpage of silicone, a finite element analysis was conducted for the curing of silicone during molding. For the analysis of the curing process, a dynamic cure kinetics model was derived based on the results of a differential scanning calorimetry (DSC) testing and applied to the material properties for finite element analysis. Finite element simulation results showed that a step cure cycle reduced abrupt reaction heat and showed a decrease in the residual stresses.