• Journal of Welding and Joining
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• v.28 no.6
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• pp.35-39
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• 2010

Generally, ceramic material is very difficult to machine due to high strength and hardness. However, ceramic material can be machined at high temperature by plastic flow as metallic material due to the deterioration of the grain boundary glassy phase. Recently, a new method was developed to execute cutting process with CBN cutting tool by local heating of surface with laser. There are various parameters in LAM because it is a complex process with laser treatment and machining. During laser assisted machining, high power results in reducing of cutting force and increasing tool life, but excessive power brings oxidation of the surface. The effect of laser power, feed rate, cutting depth and etc. were investigated on the life of cutting tool. Chips were observed to find out suitable machining conditions. Chips of SSN had more flow-types than HIPSN. It means SSN is easier to machining. The life of cutting tool was increased with increasing laser power and decreasing feed rate and cutting depth.

• 한국정보디스플레이학회:학술대회논문집
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• 2006.08a
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• pp.529-529
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• 2006

Several laboratories worldwide have demonstrated the feasibility of producing amorphous silicon thin film transistor (TFT) arrays at temperatures that are sufficiently low to be compatible with flexible foils such as stainless steel or high temperature polyester. These arrays can be used to fabricate flexible high information content display prototypes using a variety of different display technologies. However, several questions must be addressed before this technology can be used for the economic commercial production of displays. These include process optimization and scale-up to address intrinsic electrical instabilities exhibited by these kinds of transistor device, and the development of appropriate techniques for the handling of flexible substrate materials with large coefficients of thermal expansion. The Flexible Display Center at Arizona State University was established in 2004 as a collaboration among industry, a number of Universities, and US Government research laboratories to focus on these issues. The goal of the FDC is to investigate the manufacturing of flexible TFT technology in order to accelerate the commercialization of flexible displays. This presentation will give a brief outline of the FDC's organization and capabilities, and review the status of efforts to fabricate amorphous silicon TFT arrays on flexible foils using a low temperature process. Together with industrial partners, these arrays are being integrated with cholesteric liquid crystal panels, electrophoretic inks, or organic electroluminescent devices to make flexible display prototypes. In addition to an overview of device stability issues, the presentation will include a discussion of challenges peculiar to the use of flexible substrates. A technique has been developed for temporarily bonding flexible substrates to rigid carrier plates so that they may be processed using conventional flat panel display manufacturing equipment. In addition, custom photolithographic equipment has been developed which permits the dynamic compensation of substrate distortions which accumulate at various process steps.

• Journal of Powder Materials
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• v.25 no.4
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• pp.302-308
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• 2018

A lean alloy is defined as a low alloy steel that minimizes the content of the alloying elements, while maintaining the characteristics of the sintered alloy. The purpose of this study is to determine the change in microstructure and mechanical properties due to the addition of silicon or tin in Fe-Mo-P, Fe-Mn-P, and Fe-Mo-Mn-P alloys. Silicon- or tin-added F-Mo-P, Fe-Mn-P, and Fe-Mo-Mn-P master alloys were compacted at 700 MPa and subsequently sintered under a $H_2-N_2$ atmosphere at $1120^{\circ}C$. The sintered density of three alloy systems decreases under the same compacting pressure due to dimensional expansion with increasing Si content. As the diffusion rate in the Fe-P-Mo system is higher than that in the Fe-P-Mn system, the decrease in the sintered density is the largest in the Fe-P-Mn system. The sintered density of Sn added alloys does not change with the increasing Sn content due to the effect of non-dimensional changes. However, the effect of Si addition on the transverse rupture strengthening enhancement is stronger than that of Sn addition in these lean alloys.

• Journal of the Korean institute of surface engineering
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• v.47 no.2
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• pp.75-80
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• 2014

Nanocrystalline diamond(NCD) films on steel(SKH51) has been investigated using SiC interlayer film. SiC was deposited on SKH51 or Si wafer by RF magnetron sputter. NCD was deposited on SiC at $600^{\circ}C$ for 0.5~4 h employing microwave plasma CVD. Film morphology was observed by FESEM and FIB. Film adherence was examined by Rockwell C adhesion test. The growth rate of NCD on SiC/Si substrate was much higher than that on SiC/SKH51. During particle coalescence, NCD growth rate was slow since overall rate was determined by the diffusion of carbon on SiC surface. After completion of particle coalescence, NCD growth became faster with the reaction of carbon on NCD film controlling the whole process. In the case of SiC/SKH51 substrate, a complete NCD film was not formed even after 4 h of deposition. The adhesion test of NCD/SiC/SKH51 samples revealed a delamination of film whereas that of SiC/SKH51 showed a good adhesion. Many voids of less than 0.1 ${\mu}m$ were detected on NCD/SiC interface. These voids were believed as the reason for the poor adhesion between NCD and SiC films. The origin of voids was due to the insufficient coalescence of diamond particles on SiC surface in the early stage of deposition.

• Journal of Environmental Health Sciences
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• v.10 no.2
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• pp.41-51
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• 1984

This study was performed using samples collected at Myungryundong and at Reservoirs. The purpose of this study was to investigate the differences of water quality between tap and raw water, and to analyse drinking water quality by Fe, Zn from corroded galvanized steel pipe. Results were as follows 1. The older the pipe was, the higher the concentration of Ferrum and Zinc was (t-test : p<0.05). Ferrum and Zinc also exceeded the limits in the older galvanized steel pipe. I think that this comes from the corrosion of pipe. 2. Mercury, Arsenic, Cadmium, Lead, Chomium, Argentum and Aurum not detected in raw water were not detected in tap water. Cobalt, Bismuth and Molybudenum detected in raw water were not detected in tap water. I think that this comes from the quality of raw water, the result of water treatment and the improbability of detection of above metals in water delivery system. 3. Silicon measured 2.4698ppm in raw water, but it ranged from 0.4769ppm to 1.982 ppm in tap water. Manganese measured 0.0638ppm in raw water, but it ranged from 0.0026ppm to 0.0198ppm in 17cases(31%) out of 55samples in tap water. I think that this comes from the water treatment. 4. Aluminium not detected in raw water was found in 17 cases (31%) out of the samples (55cases). It may be considered as the use of coagulants $Al_2(SO_4)_3$. $18H_2O$ and PAC (Poly Aluminium Chloride). The concentration of copper in tap water was much higher in 2 cases(3.6%) out of the samples(55) than that of copper in raw water. I think that this may come from the use of ${CuSO}_4$, the preventive of algae growth, and the result of chlorination, but further study must be necoessary to support the proof.

• Transactions on Electrical and Electronic Materials
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• v.2 no.1
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• pp.1-6
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• 2001

$C_{x}F_{y}$ polymer film was deposited in rf and dc Fluorinert vapor ($C_{7}F_{16}$) plasmas. In the plasma phase, the spatial distribution of optical emission spectra and the temporal concentration of decomposed species were monitored, and kinetics of the $C_{7}F_{16}$ decomposition process was discussed. Deposition of $C_{x}F_{y}$ film has been tried on substrates of stainless steel, glass, molybdenum and silicon wafers at room temperature in the vapor pressures of 40 and 100 Pa. The films deposited in the rf plasma showed excellent electrical properties as an insulator for multi-layered interconnection of deep-submicron LSI, i.e. the low dielectric constant ∼2.0, the dielectric strength ∼2 MV/cm and the high deposition rate ∼100nm/min at 100W input power.

• Journal of the Korean institute of surface engineering
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• v.12 no.2
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• pp.75-83
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• 1979

The Rates of formation and heats of activation for the intermatallic Compound Layers between Cold rolled sheet and molten aluminium &ath (adding small amounts of silicon) has been determined by Continous aluminizing method in the temperature range of 680$^{\circ}$ to 760$^{\circ}C$ and with immerssion time. The structure of the intermetallic Compound Layers was the shape of "Tongues" in pure Al-Bath and Al-Bath Containing 1% Si, But in Al-5% Si Bath was "Band" the Composition of the intermetallic Compound Layers were checked by microhardness measurements and X-Ray probe micro analyzer. FeAl intermetallic Compound layer was found to be uniform in pure Al-Bath and Al-5% Si Bath, But Fe Al intermetallic Compound Layer was shown in Al-1% Si Bath. The growth Rates of the intermetallic Compound Layers was most rapidly increased at Temperatures from 720$^{\circ}$ to 760$^{\circ}C$, at the immorsion time above 60 Second in pure Al-Bath, But in Al-1% Si Bath was solwly increased for the same conditions, and then in Al-5% Si Bath was hardly effected by these experimental condition. Heasts of activation of 29, 46 Kcal per mole which calculuted from Layer growth experiments were found in pure Al-Bath, Al-1% Si Bath respectively.

• Progress in Superconductivity and Cryogenics
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• v.5 no.1
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• pp.48-51
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• 2003

A 1 MVA transformer with BSCCO-2223 high Tc superconducting (HTS) tapes was designed. The rated voltages of each sides of the transformer are 22.0 kV and 6.6 kV respectively. Double pancake HTS windings, which have advantages of insulations and distribution of high voltage, were adopted. Four HTS tapes were wound in parallel fer the windings of low voltage side. Each winding was composed of several double pancake windings made of four parallel conductors were transposed in order to distribute the currents equally in each conductor. A core of the transformer was designed as a shell type core made of laminated silicon steel plate and the core is separated with the windings by a cryostat with a room temperature bore. The operating temperature of HTS windings will be 65K with liquid nitrogen, and a cooling system using a cryocooler was proposed and designed conceptually. This HTS transformer is going to be manufactured in near future based on the design parameters presented in this paper.

• Journal of Sensor Science and Technology
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• v.29 no.5
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• pp.283-292
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• 2020

Current sensors that use a Hall element and Hall IC to measure the magnetic fields generated in steel silicon core gaps do not distinguish between direct and alternating currents. Thus, they are primarily used to measure direct current (DC) in industrial equipment. Although such sensors can measure the DC when installed in expensive equipment, ascertaining problems becomes difficult if the equipment is set up in an unexposed space. The control box is only opened during scheduled maintenance or when anomalies occur. Therefore, in this paper, a method is proposed for facilitating the safety management and maintenance of equipment when necessary, instead of waiting for anomalies or scheduled maintenance. A Bluetooth 4.0 low-energy current-sensor system based on near-field communication is used, which compensates for the nonlinearity of the current-sensor output signal using a piecewise linear model. The sensor is controlled using its generic attribute profile. Sensor nodes and cell phones used to check the signals obtained from the sensor at 50-A input currents showed an accuracy of ±1%, exhibiting linearity in all communications within the range of 0 to 50 A, with a stable output voltage for each communication segment.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.20 no.2
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• pp.520-528
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• 1996

Four point bending tests of the brazed joint composed of sintered silicon nitride and 0.2% carbon steel with Cusil ABA filler which were fabricated at 86$0^{\circ}C$ were performed at temperatures, 25, 100, 200, 300, 400, 50$0^{\circ}C$ From the experiments, the maximum bending strength was measured at 30$0^{\circ}C$ From the 3D FE analysis of the residual stress of the brazed joint, it was revealed that the thermally induced residual stresses were minimized when the environmental temperature was 35$0^{\circ}C$ Considering the degradation of the filler material at high temperatures, it was calculated that the maximum bending strength of the brazed joint occured just below the temperature of the minimum thermal residual stress and the thermal residual stress was the dominative parameter of the brazed joint.